Effect of Minor Addition of Ni on the Microstructure and Properties of Zn-Based High-Temperature Solder

Abstract Lead-based solders are widely used for making interconnections between electronic chips and a circuit board that is expected to perform at high temperatures. The substitution of traditional lead-bearing solders is one of the key challenges to electronic industries in the current drive for e...
Ausführliche Beschreibung

Abstract Lead-based solders are widely used for making interconnections between electronic chips and a circuit board that is expected to perform at high temperatures. The substitution of traditional lead-bearing solders is one of the key challenges to electronic industries in the current drive for eco-friendly manufacturing. In the present study, a minor amount of Ni is alloyed with Zn to investigate the effect of Ni on the microstructure and the thermal, mechanical and electrical properties of the newly developed solder. The microstructures of the Ni-Zn solder alloys are composed of β-Zn and Ni-Zn intermetallics (γ-phase). The appearance of a γ-phase Ni-Zn intermetallic ($ NiZn_{5} $) instead of a δ-phase intermetallic in a eutectic structure, grain boundary particles and an irregular second phase is discussed in detail. Addition of Ni results in enhanced mechanical properties, keeping the electrical properties unchanged. The suitability of Ni-Zn alloy as high-temperature solder is evaluated in comparison with traditional Pb-Sn solders and other Zn-based alloys. Graphic Abstract Ausführliche Beschreibung