Recent Advances in Encapsulation Materials for Light Emitting Diodes: a Review

Abstract Light emitting diodes (LEDs) as the emerging green light sources are of great significance to achieve the energy saving and emission reduction. The encapsulation materials as the key supporting and protection materials can directly influence the reliability, performance, and service life of...
Ausführliche Beschreibung

Abstract Light emitting diodes (LEDs) as the emerging green light sources are of great significance to achieve the energy saving and emission reduction. The encapsulation materials as the key supporting and protection materials can directly influence the reliability, performance, and service life of LEDs. Thus, the encapsulation materials with ideal properties including high transmittance, high refractive index (RI), excellent mechanical property, high thermal conductivity, and high aging resistance are urgently needed in the LEDs-based semiconductor lighting field. Epoxy resins and organic silicone resins as the main two traditional encapsulation materials still have some problems, such as low RI, poor mechanical property, prone to yellowing, easy to aging, and so on. To overcome these problems, numerous researches were conducted to improve the overall performances of epoxy resins and organic silicone resins for LED encapsulation. Especially, the organic-inorganic nanocomposite materials can combine the advantages of inorganic nanoparticles and organic resins and show excellent performance for LED encapsulation, hence drawing more and more attention. This review will summarize the recent development of epoxy resin materials, organic silicone materials, and organic-inorganic nanocomposite materials for LED encapsulation, and outlook the key problems and future development direction of the LED encapsulation industry. Ausführliche Beschreibung