Suchergebnisse - "Haseeb, A. S. Md. Abdul"

1

Interfacial reactions between electroplated Ni–Zn alloy films and lead-free solders

von: Chia, Pay Ying

2013, in: Journal of materials science

Wird geladen...
2

Interfacial reactions between electroplated Ni–Zn alloy films and lead-free solders

von: Chia, Pay Ying

2013, in: Journal of materials science / Materials in electronics

Wird geladen...
3

Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior

von: Zahri, Nur Amirah Mohd

2019, in: Welding in the world

Wird geladen...
4

Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow

von: Goh, Yingxin

2013, in: Journal of materials science / Materials in electronics

Wird geladen...
5

Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow

von: Goh, Yingxin

2013, in: Journal of materials science

Wird geladen...

Nicht das Richtige dabei?

Schreiben Sie uns!