Suchergebnisse - "Ogashiwa, Toshinori"

1

Flip-Chip Bonding Using Superconducting Solder Bump

von: Ogashiwa, Toshinori

1995, in: Japanese journal of applied physics. Part 1, Regular papers, brief communications & review papers

Wird geladen...
2

Thermal Fatigue Strength of Pb Sn-Sb-Cu Solder Bumps

von: Ogashiwa, Toshinori

1994, in: Nihon Kinzoku Gakkai shi

Wird geladen...
3

Characteristics of Rapid Solidified Pb-Sn Alloy Wires and Their Application to Solder Bump for Fine Junction

von: Ogashiwa, Toshinori

1994, in: Nihon Kinzoku Gakkai shi

Wird geladen...
4

Thermal stability of back side metallization multilayer for power device application

von: Ito, Takeshi

2012, in: Microelectronics reliability

Wird geladen...
5

Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles

von: Tanaka, Shuji

2012, in: Sensors and actuators / A

Wird geladen...
6

Anisotropic microstructural evolution and coarsening in free sintering and constrained sintering of metal film by using FIB-SEM tomography

von: Okuma, Gaku

2021transfer abstract, in: Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S.

Wird geladen...

Nicht das Richtige dabei?

Schreiben Sie uns!