Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System

A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. T...
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Autor*in:	Liu Ding [verfasserIn] Ji Ping Yang [verfasserIn] Xiao Li Hao [verfasserIn] Ting Tong [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2020

Schlagwörter:	conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole

Übergeordnetes Werk:	In: Frontiers in Materials - Frontiers Media S.A., 2014, 7(2020)
Übergeordnetes Werk:	volume:7 ; year:2020

Links:	Link aufrufen Link aufrufen Link aufrufen Journal toc

DOI / URN:	10.3389/fmats.2020.577962

Katalog-ID:	DOAJ009675965

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520			\|a A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa.
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allfields	10.3389/fmats.2020.577962 doi (DE-627)DOAJ009675965 (DE-599)DOAJ8fce2720e5714e558dfd219c6f8bab78 DE-627 ger DE-627 rakwb eng Liu Ding verfasserin aut Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System 2020 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa. conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole Technology T Ji Ping Yang verfasserin aut Xiao Li Hao verfasserin aut Ting Tong verfasserin aut In Frontiers in Materials Frontiers Media S.A., 2014 7(2020) (DE-627)779920716 (DE-600)2759394-0 22968016 nnns volume:7 year:2020 https://doi.org/10.3389/fmats.2020.577962 kostenfrei https://doaj.org/article/8fce2720e5714e558dfd219c6f8bab78 kostenfrei https://www.frontiersin.org/article/10.3389/fmats.2020.577962/full kostenfrei https://doaj.org/toc/2296-8016 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2003 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 7 2020
spelling	10.3389/fmats.2020.577962 doi (DE-627)DOAJ009675965 (DE-599)DOAJ8fce2720e5714e558dfd219c6f8bab78 DE-627 ger DE-627 rakwb eng Liu Ding verfasserin aut Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System 2020 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa. conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole Technology T Ji Ping Yang verfasserin aut Xiao Li Hao verfasserin aut Ting Tong verfasserin aut In Frontiers in Materials Frontiers Media S.A., 2014 7(2020) (DE-627)779920716 (DE-600)2759394-0 22968016 nnns volume:7 year:2020 https://doi.org/10.3389/fmats.2020.577962 kostenfrei https://doaj.org/article/8fce2720e5714e558dfd219c6f8bab78 kostenfrei https://www.frontiersin.org/article/10.3389/fmats.2020.577962/full kostenfrei https://doaj.org/toc/2296-8016 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2003 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 7 2020
allfields_unstemmed	10.3389/fmats.2020.577962 doi (DE-627)DOAJ009675965 (DE-599)DOAJ8fce2720e5714e558dfd219c6f8bab78 DE-627 ger DE-627 rakwb eng Liu Ding verfasserin aut Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System 2020 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa. conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole Technology T Ji Ping Yang verfasserin aut Xiao Li Hao verfasserin aut Ting Tong verfasserin aut In Frontiers in Materials Frontiers Media S.A., 2014 7(2020) (DE-627)779920716 (DE-600)2759394-0 22968016 nnns volume:7 year:2020 https://doi.org/10.3389/fmats.2020.577962 kostenfrei https://doaj.org/article/8fce2720e5714e558dfd219c6f8bab78 kostenfrei https://www.frontiersin.org/article/10.3389/fmats.2020.577962/full kostenfrei https://doaj.org/toc/2296-8016 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2003 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 7 2020
allfieldsGer	10.3389/fmats.2020.577962 doi (DE-627)DOAJ009675965 (DE-599)DOAJ8fce2720e5714e558dfd219c6f8bab78 DE-627 ger DE-627 rakwb eng Liu Ding verfasserin aut Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System 2020 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa. conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole Technology T Ji Ping Yang verfasserin aut Xiao Li Hao verfasserin aut Ting Tong verfasserin aut In Frontiers in Materials Frontiers Media S.A., 2014 7(2020) (DE-627)779920716 (DE-600)2759394-0 22968016 nnns volume:7 year:2020 https://doi.org/10.3389/fmats.2020.577962 kostenfrei https://doaj.org/article/8fce2720e5714e558dfd219c6f8bab78 kostenfrei https://www.frontiersin.org/article/10.3389/fmats.2020.577962/full kostenfrei https://doaj.org/toc/2296-8016 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2003 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 7 2020
allfieldsSound	10.3389/fmats.2020.577962 doi (DE-627)DOAJ009675965 (DE-599)DOAJ8fce2720e5714e558dfd219c6f8bab78 DE-627 ger DE-627 rakwb eng Liu Ding verfasserin aut Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System 2020 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa. conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole Technology T Ji Ping Yang verfasserin aut Xiao Li Hao verfasserin aut Ting Tong verfasserin aut In Frontiers in Materials Frontiers Media S.A., 2014 7(2020) (DE-627)779920716 (DE-600)2759394-0 22968016 nnns volume:7 year:2020 https://doi.org/10.3389/fmats.2020.577962 kostenfrei https://doaj.org/article/8fce2720e5714e558dfd219c6f8bab78 kostenfrei https://www.frontiersin.org/article/10.3389/fmats.2020.577962/full kostenfrei https://doaj.org/toc/2296-8016 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2003 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 7 2020
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container_title	Frontiers in Materials
authorswithroles_txt_mv	Liu Ding @@aut@@ Ji Ping Yang @@aut@@ Xiao Li Hao @@aut@@ Ting Tong @@aut@@
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author	Liu Ding
spellingShingle	Liu Ding misc conjugated molecule misc epoxy resin misc curing agent misc moderate-temperature curing misc methylimidazole misc Technology misc T Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System
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topic_title	Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System conjugated molecule epoxy resin curing agent moderate-temperature curing methylimidazole
topic	misc conjugated molecule misc epoxy resin misc curing agent misc moderate-temperature curing misc methylimidazole misc Technology misc T
topic_unstemmed	misc conjugated molecule misc epoxy resin misc curing agent misc moderate-temperature curing misc methylimidazole misc Technology misc T
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title	Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System
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title_full	Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System
author_sort	Liu Ding
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title_sort	fabrication and characterization of a modified conjugated molecule-based moderate-temperature curing epoxy resin system
title_auth	Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System
abstract	A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa.
abstractGer	A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa.
abstract_unstemmed	A 2-Methylimidazole derivative [ethyl glycidyl ether (EGE)–2-MI] was synthesized through the reaction of EGE with the conjugated molecule 2-MI. The structure was confirmed by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance spectroscopy, and differential scanning calorimeter. The synthesized EGE–2-MI was applied in epoxy resin E-51 as a latent curing agent. Kinetics of the curing reaction were studied by a differential scanning calorimeter method, optimum curing process parameters were determined, storage life of the resin system at room temperature was evaluated, and mechanical properties of the moderate-temperature-cured products were also tested and analyzed. The results revealed that the epoxy resin system using EGE–2-MI as the curing agent can be efficiently cured at 110–120°C, with an activation energy of 86.34 kJ/mol. The storage period of the EGE–2-MI/cyanate resin system can reach 14 days under ambient temperature. In addition, the cured mixture with EGE–2-MI/cyanate resin has a tensile strength of 40 MPa and an Al–Al adhesion shear strength of 20.11 MPa.
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title_short	Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System
url	https://doi.org/10.3389/fmats.2020.577962 https://doaj.org/article/8fce2720e5714e558dfd219c6f8bab78 https://www.frontiersin.org/article/10.3389/fmats.2020.577962/full https://doaj.org/toc/2296-8016
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doi_str	10.3389/fmats.2020.577962
up_date	2024-07-04T00:36:17.214Z
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Fabrication and Characterization of a Modified Conjugated Molecule-Based Moderate-Temperature Curing Epoxy Resin System

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