Development of high strength W/V/Au/ODS-Cu joint using HIP process

A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts...
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Autor*in:	Hiroyuki Noto [verfasserIn] Tetsuya Yamada [verfasserIn] Yoshimitsu Hishinuma [verfasserIn] Takeo Muroga [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2016

Schlagwörter:	Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert

Übergeordnetes Werk:	In: Nuclear Materials and Energy - Elsevier, 2016, 9(2016), C, Seite 411-415
Übergeordnetes Werk:	volume:9 ; year:2016 ; number:C ; pages:411-415

Links:	Link aufrufen Link aufrufen Link aufrufen Journal toc

DOI / URN:	10.1016/j.nme.2016.05.013

Katalog-ID:	DOAJ012788805

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520			\|a A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu.
650		4	\|a Tungsten
650		4	\|a Plasma facing materials
650		4	\|a Copper
650		4	\|a Bonding
650		4	\|a Vanadium insert
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653		0	\|a Nuclear engineering. Atomic power
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700	0		\|a Yoshimitsu Hishinuma \|e verfasserin \|4 aut
700	0		\|a Takeo Muroga \|e verfasserin \|4 aut
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matchkey_str	article:23521791:2016----::eeomnohgsrntwaosuon
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publishDate	2016
allfields	10.1016/j.nme.2016.05.013 doi (DE-627)DOAJ012788805 (DE-599)DOAJbcbc136821ca4ec78fff0b9190522c8c DE-627 ger DE-627 rakwb eng TK9001-9401 Hiroyuki Noto verfasserin aut Development of high strength W/V/Au/ODS-Cu joint using HIP process 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu. Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert Nuclear engineering. Atomic power Tetsuya Yamada verfasserin aut Yoshimitsu Hishinuma verfasserin aut Takeo Muroga verfasserin aut In Nuclear Materials and Energy Elsevier, 2016 9(2016), C, Seite 411-415 (DE-627)817363181 (DE-600)2808888-8 23521791 nnns volume:9 year:2016 number:C pages:411-415 https://doi.org/10.1016/j.nme.2016.05.013 kostenfrei https://doaj.org/article/bcbc136821ca4ec78fff0b9190522c8c kostenfrei http://www.sciencedirect.com/science/article/pii/S2352179115300715 kostenfrei https://doaj.org/toc/2352-1791 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 C 411-415
spelling	10.1016/j.nme.2016.05.013 doi (DE-627)DOAJ012788805 (DE-599)DOAJbcbc136821ca4ec78fff0b9190522c8c DE-627 ger DE-627 rakwb eng TK9001-9401 Hiroyuki Noto verfasserin aut Development of high strength W/V/Au/ODS-Cu joint using HIP process 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu. Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert Nuclear engineering. Atomic power Tetsuya Yamada verfasserin aut Yoshimitsu Hishinuma verfasserin aut Takeo Muroga verfasserin aut In Nuclear Materials and Energy Elsevier, 2016 9(2016), C, Seite 411-415 (DE-627)817363181 (DE-600)2808888-8 23521791 nnns volume:9 year:2016 number:C pages:411-415 https://doi.org/10.1016/j.nme.2016.05.013 kostenfrei https://doaj.org/article/bcbc136821ca4ec78fff0b9190522c8c kostenfrei http://www.sciencedirect.com/science/article/pii/S2352179115300715 kostenfrei https://doaj.org/toc/2352-1791 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 C 411-415
allfields_unstemmed	10.1016/j.nme.2016.05.013 doi (DE-627)DOAJ012788805 (DE-599)DOAJbcbc136821ca4ec78fff0b9190522c8c DE-627 ger DE-627 rakwb eng TK9001-9401 Hiroyuki Noto verfasserin aut Development of high strength W/V/Au/ODS-Cu joint using HIP process 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu. Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert Nuclear engineering. Atomic power Tetsuya Yamada verfasserin aut Yoshimitsu Hishinuma verfasserin aut Takeo Muroga verfasserin aut In Nuclear Materials and Energy Elsevier, 2016 9(2016), C, Seite 411-415 (DE-627)817363181 (DE-600)2808888-8 23521791 nnns volume:9 year:2016 number:C pages:411-415 https://doi.org/10.1016/j.nme.2016.05.013 kostenfrei https://doaj.org/article/bcbc136821ca4ec78fff0b9190522c8c kostenfrei http://www.sciencedirect.com/science/article/pii/S2352179115300715 kostenfrei https://doaj.org/toc/2352-1791 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 C 411-415
allfieldsGer	10.1016/j.nme.2016.05.013 doi (DE-627)DOAJ012788805 (DE-599)DOAJbcbc136821ca4ec78fff0b9190522c8c DE-627 ger DE-627 rakwb eng TK9001-9401 Hiroyuki Noto verfasserin aut Development of high strength W/V/Au/ODS-Cu joint using HIP process 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu. Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert Nuclear engineering. Atomic power Tetsuya Yamada verfasserin aut Yoshimitsu Hishinuma verfasserin aut Takeo Muroga verfasserin aut In Nuclear Materials and Energy Elsevier, 2016 9(2016), C, Seite 411-415 (DE-627)817363181 (DE-600)2808888-8 23521791 nnns volume:9 year:2016 number:C pages:411-415 https://doi.org/10.1016/j.nme.2016.05.013 kostenfrei https://doaj.org/article/bcbc136821ca4ec78fff0b9190522c8c kostenfrei http://www.sciencedirect.com/science/article/pii/S2352179115300715 kostenfrei https://doaj.org/toc/2352-1791 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 C 411-415
allfieldsSound	10.1016/j.nme.2016.05.013 doi (DE-627)DOAJ012788805 (DE-599)DOAJbcbc136821ca4ec78fff0b9190522c8c DE-627 ger DE-627 rakwb eng TK9001-9401 Hiroyuki Noto verfasserin aut Development of high strength W/V/Au/ODS-Cu joint using HIP process 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu. Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert Nuclear engineering. Atomic power Tetsuya Yamada verfasserin aut Yoshimitsu Hishinuma verfasserin aut Takeo Muroga verfasserin aut In Nuclear Materials and Energy Elsevier, 2016 9(2016), C, Seite 411-415 (DE-627)817363181 (DE-600)2808888-8 23521791 nnns volume:9 year:2016 number:C pages:411-415 https://doi.org/10.1016/j.nme.2016.05.013 kostenfrei https://doaj.org/article/bcbc136821ca4ec78fff0b9190522c8c kostenfrei http://www.sciencedirect.com/science/article/pii/S2352179115300715 kostenfrei https://doaj.org/toc/2352-1791 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 C 411-415
language	English
source	In Nuclear Materials and Energy 9(2016), C, Seite 411-415 volume:9 year:2016 number:C pages:411-415
sourceStr	In Nuclear Materials and Energy 9(2016), C, Seite 411-415 volume:9 year:2016 number:C pages:411-415
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert Nuclear engineering. Atomic power
isfreeaccess_bool	true
container_title	Nuclear Materials and Energy
authorswithroles_txt_mv	Hiroyuki Noto @@aut@@ Tetsuya Yamada @@aut@@ Yoshimitsu Hishinuma @@aut@@ Takeo Muroga @@aut@@
publishDateDaySort_date	2016-01-01T00:00:00Z
hierarchy_top_id	817363181
id	DOAJ012788805
language_de	englisch
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callnumber-first	T - Technology
author	Hiroyuki Noto
spellingShingle	Hiroyuki Noto misc TK9001-9401 misc Tungsten misc Plasma facing materials misc Copper misc Bonding misc Vanadium insert misc Gold insert misc Nuclear engineering. Atomic power Development of high strength W/V/Au/ODS-Cu joint using HIP process
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topic_title	TK9001-9401 Development of high strength W/V/Au/ODS-Cu joint using HIP process Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert
topic	misc TK9001-9401 misc Tungsten misc Plasma facing materials misc Copper misc Bonding misc Vanadium insert misc Gold insert misc Nuclear engineering. Atomic power
topic_unstemmed	misc TK9001-9401 misc Tungsten misc Plasma facing materials misc Copper misc Bonding misc Vanadium insert misc Gold insert misc Nuclear engineering. Atomic power
topic_browse	misc TK9001-9401 misc Tungsten misc Plasma facing materials misc Copper misc Bonding misc Vanadium insert misc Gold insert misc Nuclear engineering. Atomic power
format_facet	Elektronische Aufsätze Aufsätze Elektronische Ressource
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title	Development of high strength W/V/Au/ODS-Cu joint using HIP process
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title_full	Development of high strength W/V/Au/ODS-Cu joint using HIP process
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author_browse	Hiroyuki Noto Tetsuya Yamada Yoshimitsu Hishinuma Takeo Muroga
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author-letter	Hiroyuki Noto
doi_str_mv	10.1016/j.nme.2016.05.013
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title_sort	development of high strength w/v/au/ods-cu joint using hip process
callnumber	TK9001-9401
title_auth	Development of high strength W/V/Au/ODS-Cu joint using HIP process
abstract	A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu.
abstractGer	A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu.
abstract_unstemmed	A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu.
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title_short	Development of high strength W/V/Au/ODS-Cu joint using HIP process
url	https://doi.org/10.1016/j.nme.2016.05.013 https://doaj.org/article/bcbc136821ca4ec78fff0b9190522c8c http://www.sciencedirect.com/science/article/pii/S2352179115300715 https://doaj.org/toc/2352-1791
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up_date	2024-07-03T14:02:51.680Z
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Development of high strength W/V/Au/ODS-Cu joint using HIP process

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