Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)

To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of...
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Autor*in:	Sarthak Acharya [verfasserIn] Shahid Sattar [verfasserIn] Shailesh Singh Chouhan [verfasserIn] Jerker Delsing [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2022

Schlagwörter:	copper metallization electronics fabrication DFT analysis fully additive method polymerization UV-laser

Übergeordnetes Werk:	In: Processes - MDPI AG, 2013, 10(2022), 636, p 636
Übergeordnetes Werk:	volume:10 ; year:2022 ; number:636, p 636

Links:	Link aufrufen Link aufrufen Link aufrufen Journal toc

DOI / URN:	10.3390/pr10040636

Katalog-ID:	DOAJ025688987

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callnumber-first	T - Technology
author	Sarthak Acharya
spellingShingle	Sarthak Acharya misc TP1-1185 misc QD1-999 misc copper metallization misc electronics fabrication misc DFT analysis misc fully additive method misc polymerization misc UV-laser misc Chemical technology misc Chemistry Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
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topic_title	TP1-1185 QD1-999 Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method) copper metallization electronics fabrication DFT analysis fully additive method polymerization UV-laser
topic	misc TP1-1185 misc QD1-999 misc copper metallization misc electronics fabrication misc DFT analysis misc fully additive method misc polymerization misc UV-laser misc Chemical technology misc Chemistry
topic_unstemmed	misc TP1-1185 misc QD1-999 misc copper metallization misc electronics fabrication misc DFT analysis misc fully additive method misc polymerization misc UV-laser misc Chemical technology misc Chemistry
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title	Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
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title_sort	detailed characterization of a fully additive covalent bonded pcb manufacturing process (sbu-cbm method)
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title_auth	Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
abstract	To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work.
abstractGer	To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work.
abstract_unstemmed	To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work.
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title_short	Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
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Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)

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