Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of...
Ausführliche Beschreibung
Autor*in: |
Sarthak Acharya [verfasserIn] Shahid Sattar [verfasserIn] Shailesh Singh Chouhan [verfasserIn] Jerker Delsing [verfasserIn] |
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E-Artikel |
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Sprache: |
Englisch |
Erschienen: |
2022 |
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Übergeordnetes Werk: |
In: Processes - MDPI AG, 2013, 10(2022), 636, p 636 |
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Übergeordnetes Werk: |
volume:10 ; year:2022 ; number:636, p 636 |
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DOI / URN: |
10.3390/pr10040636 |
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Katalog-ID: |
DOAJ025688987 |
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10.3390/pr10040636 doi (DE-627)DOAJ025688987 (DE-599)DOAJ455e113cfec440a1b0331dfc4074e07a DE-627 ger DE-627 rakwb eng TP1-1185 QD1-999 Sarthak Acharya verfasserin aut Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method) 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. copper metallization electronics fabrication DFT analysis fully additive method polymerization UV-laser Chemical technology Chemistry Shahid Sattar verfasserin aut Shailesh Singh Chouhan verfasserin aut Jerker Delsing verfasserin aut In Processes MDPI AG, 2013 10(2022), 636, p 636 (DE-627)750371439 (DE-600)2720994-5 22279717 nnns volume:10 year:2022 number:636, p 636 https://doi.org/10.3390/pr10040636 kostenfrei https://doaj.org/article/455e113cfec440a1b0331dfc4074e07a kostenfrei https://www.mdpi.com/2227-9717/10/4/636 kostenfrei https://doaj.org/toc/2227-9717 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 10 2022 636, p 636 |
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10.3390/pr10040636 doi (DE-627)DOAJ025688987 (DE-599)DOAJ455e113cfec440a1b0331dfc4074e07a DE-627 ger DE-627 rakwb eng TP1-1185 QD1-999 Sarthak Acharya verfasserin aut Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method) 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. copper metallization electronics fabrication DFT analysis fully additive method polymerization UV-laser Chemical technology Chemistry Shahid Sattar verfasserin aut Shailesh Singh Chouhan verfasserin aut Jerker Delsing verfasserin aut In Processes MDPI AG, 2013 10(2022), 636, p 636 (DE-627)750371439 (DE-600)2720994-5 22279717 nnns volume:10 year:2022 number:636, p 636 https://doi.org/10.3390/pr10040636 kostenfrei https://doaj.org/article/455e113cfec440a1b0331dfc4074e07a kostenfrei https://www.mdpi.com/2227-9717/10/4/636 kostenfrei https://doaj.org/toc/2227-9717 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 10 2022 636, p 636 |
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10.3390/pr10040636 doi (DE-627)DOAJ025688987 (DE-599)DOAJ455e113cfec440a1b0331dfc4074e07a DE-627 ger DE-627 rakwb eng TP1-1185 QD1-999 Sarthak Acharya verfasserin aut Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method) 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. copper metallization electronics fabrication DFT analysis fully additive method polymerization UV-laser Chemical technology Chemistry Shahid Sattar verfasserin aut Shailesh Singh Chouhan verfasserin aut Jerker Delsing verfasserin aut In Processes MDPI AG, 2013 10(2022), 636, p 636 (DE-627)750371439 (DE-600)2720994-5 22279717 nnns volume:10 year:2022 number:636, p 636 https://doi.org/10.3390/pr10040636 kostenfrei https://doaj.org/article/455e113cfec440a1b0331dfc4074e07a kostenfrei https://www.mdpi.com/2227-9717/10/4/636 kostenfrei https://doaj.org/toc/2227-9717 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 10 2022 636, p 636 |
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10.3390/pr10040636 doi (DE-627)DOAJ025688987 (DE-599)DOAJ455e113cfec440a1b0331dfc4074e07a DE-627 ger DE-627 rakwb eng TP1-1185 QD1-999 Sarthak Acharya verfasserin aut Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method) 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. copper metallization electronics fabrication DFT analysis fully additive method polymerization UV-laser Chemical technology Chemistry Shahid Sattar verfasserin aut Shailesh Singh Chouhan verfasserin aut Jerker Delsing verfasserin aut In Processes MDPI AG, 2013 10(2022), 636, p 636 (DE-627)750371439 (DE-600)2720994-5 22279717 nnns volume:10 year:2022 number:636, p 636 https://doi.org/10.3390/pr10040636 kostenfrei https://doaj.org/article/455e113cfec440a1b0331dfc4074e07a kostenfrei https://www.mdpi.com/2227-9717/10/4/636 kostenfrei https://doaj.org/toc/2227-9717 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 10 2022 636, p 636 |
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To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. |
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To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. |
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To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. |
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|
score |
7.399806 |