Review of high thermal conductivity polymer dielectrics for electrical insulation
Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with...
Ausführliche Beschreibung
Autor*in: |
Meng Xiao [verfasserIn] Bo Xue Du [verfasserIn] |
---|
Format: |
E-Artikel |
---|---|
Sprache: |
Englisch |
Erschienen: |
2016 |
---|
Übergeordnetes Werk: |
In: High Voltage - Wiley, 2017, (2016) |
---|---|
Übergeordnetes Werk: |
year:2016 |
Links: |
---|
DOI / URN: |
10.1049/hve.2016.0008 |
---|
Katalog-ID: |
DOAJ052476243 |
---|
LEADER | 01000caa a22002652 4500 | ||
---|---|---|---|
001 | DOAJ052476243 | ||
003 | DE-627 | ||
005 | 20230308165505.0 | ||
007 | cr uuu---uuuuu | ||
008 | 230227s2016 xx |||||o 00| ||eng c | ||
024 | 7 | |a 10.1049/hve.2016.0008 |2 doi | |
035 | |a (DE-627)DOAJ052476243 | ||
035 | |a (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e | ||
040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
041 | |a eng | ||
050 | 0 | |a TK1-9971 | |
050 | 0 | |a QC501-721 | |
100 | 0 | |a Meng Xiao |e verfasserin |4 aut | |
245 | 1 | 0 | |a Review of high thermal conductivity polymer dielectrics for electrical insulation |
264 | 1 | |c 2016 | |
336 | |a Text |b txt |2 rdacontent | ||
337 | |a Computermedien |b c |2 rdamedia | ||
338 | |a Online-Ressource |b cr |2 rdacarrier | ||
520 | |a Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. | ||
650 | 4 | |a thermal conductivity | |
650 | 4 | |a thermal insulating materials | |
650 | 4 | |a filled polymers | |
650 | 4 | |a conducting polymers | |
650 | 4 | |a dielectric materials | |
650 | 4 | |a electric properties | |
650 | 4 | |a failure analysis | |
650 | 4 | |a composite insulating materials | |
650 | 4 | |a high thermal conductivity polymer dielectrics | |
650 | 4 | |a electrical insulation material | |
650 | 4 | |a thermal insulation | |
650 | 4 | |a electrical devices | |
650 | 4 | |a electrical equipment | |
650 | 4 | |a equipment size reduction | |
650 | 4 | |a service life extension | |
650 | 4 | |a inorganic thermally conductive particles | |
650 | 4 | |a dielectric polymer composites | |
650 | 4 | |a particle-filled thermal conductive composites | |
650 | 4 | |a intrinsic thermal conductive polymer | |
650 | 4 | |a surface treatment | |
650 | 4 | |a thermal properties | |
650 | 4 | |a electrical properties | |
650 | 4 | |a thermally conductive epoxy | |
650 | 4 | |a polyethylene composites | |
650 | 4 | |a polyimide composites | |
650 | 4 | |a tracking failure | |
650 | 4 | |a thermal accumulation | |
650 | 4 | |a thermal breakdown phenomenon | |
653 | 0 | |a Electrical engineering. Electronics. Nuclear engineering | |
653 | 0 | |a Electricity | |
700 | 0 | |a Bo Xue Du |e verfasserin |4 aut | |
773 | 0 | 8 | |i In |t High Voltage |d Wiley, 2017 |g (2016) |w (DE-627)860188957 |w (DE-600)2856739-0 |x 23977264 |7 nnns |
773 | 1 | 8 | |g year:2016 |
856 | 4 | 0 | |u https://doi.org/10.1049/hve.2016.0008 |z kostenfrei |
856 | 4 | 0 | |u https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e |z kostenfrei |
856 | 4 | 0 | |u https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 |z kostenfrei |
856 | 4 | 2 | |u https://doaj.org/toc/2397-7264 |y Journal toc |z kostenfrei |
912 | |a GBV_USEFLAG_A | ||
912 | |a SYSFLAG_A | ||
912 | |a GBV_DOAJ | ||
912 | |a GBV_ILN_20 | ||
912 | |a GBV_ILN_22 | ||
912 | |a GBV_ILN_23 | ||
912 | |a GBV_ILN_24 | ||
912 | |a GBV_ILN_31 | ||
912 | |a GBV_ILN_39 | ||
912 | |a GBV_ILN_40 | ||
912 | |a GBV_ILN_60 | ||
912 | |a GBV_ILN_62 | ||
912 | |a GBV_ILN_63 | ||
912 | |a GBV_ILN_65 | ||
912 | |a GBV_ILN_69 | ||
912 | |a GBV_ILN_70 | ||
912 | |a GBV_ILN_73 | ||
912 | |a GBV_ILN_95 | ||
912 | |a GBV_ILN_105 | ||
912 | |a GBV_ILN_110 | ||
912 | |a GBV_ILN_151 | ||
912 | |a GBV_ILN_161 | ||
912 | |a GBV_ILN_170 | ||
912 | |a GBV_ILN_171 | ||
912 | |a GBV_ILN_213 | ||
912 | |a GBV_ILN_224 | ||
912 | |a GBV_ILN_230 | ||
912 | |a GBV_ILN_285 | ||
912 | |a GBV_ILN_293 | ||
912 | |a GBV_ILN_602 | ||
912 | |a GBV_ILN_636 | ||
912 | |a GBV_ILN_2004 | ||
912 | |a GBV_ILN_2005 | ||
912 | |a GBV_ILN_2006 | ||
912 | |a GBV_ILN_2007 | ||
912 | |a GBV_ILN_2010 | ||
912 | |a GBV_ILN_2011 | ||
912 | |a GBV_ILN_2014 | ||
912 | |a GBV_ILN_2026 | ||
912 | |a GBV_ILN_2027 | ||
912 | |a GBV_ILN_2034 | ||
912 | |a GBV_ILN_2037 | ||
912 | |a GBV_ILN_2038 | ||
912 | |a GBV_ILN_2044 | ||
912 | |a GBV_ILN_2048 | ||
912 | |a GBV_ILN_2049 | ||
912 | |a GBV_ILN_2050 | ||
912 | |a GBV_ILN_2055 | ||
912 | |a GBV_ILN_2056 | ||
912 | |a GBV_ILN_2057 | ||
912 | |a GBV_ILN_2059 | ||
912 | |a GBV_ILN_2061 | ||
912 | |a GBV_ILN_2064 | ||
912 | |a GBV_ILN_2068 | ||
912 | |a GBV_ILN_2088 | ||
912 | |a GBV_ILN_2106 | ||
912 | |a GBV_ILN_2108 | ||
912 | |a GBV_ILN_2110 | ||
912 | |a GBV_ILN_2111 | ||
912 | |a GBV_ILN_2118 | ||
912 | |a GBV_ILN_2122 | ||
912 | |a GBV_ILN_2143 | ||
912 | |a GBV_ILN_2144 | ||
912 | |a GBV_ILN_2147 | ||
912 | |a GBV_ILN_2148 | ||
912 | |a GBV_ILN_2152 | ||
912 | |a GBV_ILN_2153 | ||
912 | |a GBV_ILN_2232 | ||
912 | |a GBV_ILN_2336 | ||
912 | |a GBV_ILN_2470 | ||
912 | |a GBV_ILN_2507 | ||
912 | |a GBV_ILN_2522 | ||
912 | |a GBV_ILN_4012 | ||
912 | |a GBV_ILN_4035 | ||
912 | |a GBV_ILN_4037 | ||
912 | |a GBV_ILN_4046 | ||
912 | |a GBV_ILN_4112 | ||
912 | |a GBV_ILN_4125 | ||
912 | |a GBV_ILN_4126 | ||
912 | |a GBV_ILN_4242 | ||
912 | |a GBV_ILN_4249 | ||
912 | |a GBV_ILN_4251 | ||
912 | |a GBV_ILN_4305 | ||
912 | |a GBV_ILN_4306 | ||
912 | |a GBV_ILN_4307 | ||
912 | |a GBV_ILN_4313 | ||
912 | |a GBV_ILN_4322 | ||
912 | |a GBV_ILN_4323 | ||
912 | |a GBV_ILN_4324 | ||
912 | |a GBV_ILN_4325 | ||
912 | |a GBV_ILN_4326 | ||
912 | |a GBV_ILN_4333 | ||
912 | |a GBV_ILN_4334 | ||
912 | |a GBV_ILN_4335 | ||
912 | |a GBV_ILN_4336 | ||
912 | |a GBV_ILN_4338 | ||
912 | |a GBV_ILN_4367 | ||
912 | |a GBV_ILN_4700 | ||
951 | |a AR | ||
952 | |j 2016 |
author_variant |
m x mx b x d bxd |
---|---|
matchkey_str |
article:23977264:2016----::eiwfihhracnutvtplmrilcrcfrl |
hierarchy_sort_str |
2016 |
callnumber-subject-code |
TK |
publishDate |
2016 |
allfields |
10.1049/hve.2016.0008 doi (DE-627)DOAJ052476243 (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e DE-627 ger DE-627 rakwb eng TK1-9971 QC501-721 Meng Xiao verfasserin aut Review of high thermal conductivity polymer dielectrics for electrical insulation 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon Electrical engineering. Electronics. Nuclear engineering Electricity Bo Xue Du verfasserin aut In High Voltage Wiley, 2017 (2016) (DE-627)860188957 (DE-600)2856739-0 23977264 nnns year:2016 https://doi.org/10.1049/hve.2016.0008 kostenfrei https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e kostenfrei https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 kostenfrei https://doaj.org/toc/2397-7264 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_636 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2016 |
spelling |
10.1049/hve.2016.0008 doi (DE-627)DOAJ052476243 (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e DE-627 ger DE-627 rakwb eng TK1-9971 QC501-721 Meng Xiao verfasserin aut Review of high thermal conductivity polymer dielectrics for electrical insulation 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon Electrical engineering. Electronics. Nuclear engineering Electricity Bo Xue Du verfasserin aut In High Voltage Wiley, 2017 (2016) (DE-627)860188957 (DE-600)2856739-0 23977264 nnns year:2016 https://doi.org/10.1049/hve.2016.0008 kostenfrei https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e kostenfrei https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 kostenfrei https://doaj.org/toc/2397-7264 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_636 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2016 |
allfields_unstemmed |
10.1049/hve.2016.0008 doi (DE-627)DOAJ052476243 (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e DE-627 ger DE-627 rakwb eng TK1-9971 QC501-721 Meng Xiao verfasserin aut Review of high thermal conductivity polymer dielectrics for electrical insulation 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon Electrical engineering. Electronics. Nuclear engineering Electricity Bo Xue Du verfasserin aut In High Voltage Wiley, 2017 (2016) (DE-627)860188957 (DE-600)2856739-0 23977264 nnns year:2016 https://doi.org/10.1049/hve.2016.0008 kostenfrei https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e kostenfrei https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 kostenfrei https://doaj.org/toc/2397-7264 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_636 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2016 |
allfieldsGer |
10.1049/hve.2016.0008 doi (DE-627)DOAJ052476243 (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e DE-627 ger DE-627 rakwb eng TK1-9971 QC501-721 Meng Xiao verfasserin aut Review of high thermal conductivity polymer dielectrics for electrical insulation 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon Electrical engineering. Electronics. Nuclear engineering Electricity Bo Xue Du verfasserin aut In High Voltage Wiley, 2017 (2016) (DE-627)860188957 (DE-600)2856739-0 23977264 nnns year:2016 https://doi.org/10.1049/hve.2016.0008 kostenfrei https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e kostenfrei https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 kostenfrei https://doaj.org/toc/2397-7264 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_636 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2016 |
allfieldsSound |
10.1049/hve.2016.0008 doi (DE-627)DOAJ052476243 (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e DE-627 ger DE-627 rakwb eng TK1-9971 QC501-721 Meng Xiao verfasserin aut Review of high thermal conductivity polymer dielectrics for electrical insulation 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon Electrical engineering. Electronics. Nuclear engineering Electricity Bo Xue Du verfasserin aut In High Voltage Wiley, 2017 (2016) (DE-627)860188957 (DE-600)2856739-0 23977264 nnns year:2016 https://doi.org/10.1049/hve.2016.0008 kostenfrei https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e kostenfrei https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 kostenfrei https://doaj.org/toc/2397-7264 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_636 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2016 |
language |
English |
source |
In High Voltage (2016) year:2016 |
sourceStr |
In High Voltage (2016) year:2016 |
format_phy_str_mv |
Article |
institution |
findex.gbv.de |
topic_facet |
thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon Electrical engineering. Electronics. Nuclear engineering Electricity |
isfreeaccess_bool |
true |
container_title |
High Voltage |
authorswithroles_txt_mv |
Meng Xiao @@aut@@ Bo Xue Du @@aut@@ |
publishDateDaySort_date |
2016-01-01T00:00:00Z |
hierarchy_top_id |
860188957 |
id |
DOAJ052476243 |
language_de |
englisch |
fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">DOAJ052476243</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230308165505.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">230227s2016 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1049/hve.2016.0008</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)DOAJ052476243</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK1-9971</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">QC501-721</subfield></datafield><datafield tag="100" ind1="0" ind2=" "><subfield code="a">Meng Xiao</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Review of high thermal conductivity polymer dielectrics for electrical insulation</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal conductivity</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal insulating materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">filled polymers</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">conducting polymers</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">dielectric materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electric properties</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">failure analysis</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">composite insulating materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">high thermal conductivity polymer dielectrics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical insulation material</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal insulation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical devices</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical equipment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">equipment size reduction</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">service life extension</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">inorganic thermally conductive particles</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">dielectric polymer composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">particle-filled thermal conductive composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">intrinsic thermal conductive polymer</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">surface treatment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal properties</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical properties</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermally conductive epoxy</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">polyethylene composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">polyimide composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">tracking failure</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal accumulation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal breakdown phenomenon</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electrical engineering. Electronics. Nuclear engineering</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electricity</subfield></datafield><datafield tag="700" ind1="0" ind2=" "><subfield code="a">Bo Xue Du</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">In</subfield><subfield code="t">High Voltage</subfield><subfield code="d">Wiley, 2017</subfield><subfield code="g">(2016)</subfield><subfield code="w">(DE-627)860188957</subfield><subfield code="w">(DE-600)2856739-0</subfield><subfield code="x">23977264</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">year:2016</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1049/hve.2016.0008</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="u">https://doaj.org/toc/2397-7264</subfield><subfield code="y">Journal toc</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_DOAJ</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_20</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_22</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_39</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_60</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_62</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_63</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_65</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_69</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_73</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_95</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_105</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_151</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_161</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_170</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_171</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_213</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_224</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_230</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_285</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_293</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_602</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_636</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2006</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2007</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2010</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2011</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2014</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2026</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2027</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2034</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2038</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2044</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2048</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2049</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2050</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2055</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2056</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2057</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2059</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2061</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2064</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2068</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2088</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2106</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2108</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2111</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2118</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2122</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2143</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2144</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2147</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2148</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2152</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2153</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2232</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2470</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2507</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2522</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4012</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4035</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4112</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4125</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4126</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4242</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4249</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4251</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4305</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4306</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4307</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4313</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4322</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4324</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4325</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4326</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4333</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4334</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4335</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4338</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4367</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="j">2016</subfield></datafield></record></collection>
|
callnumber-first |
T - Technology |
author |
Meng Xiao |
spellingShingle |
Meng Xiao misc TK1-9971 misc QC501-721 misc thermal conductivity misc thermal insulating materials misc filled polymers misc conducting polymers misc dielectric materials misc electric properties misc failure analysis misc composite insulating materials misc high thermal conductivity polymer dielectrics misc electrical insulation material misc thermal insulation misc electrical devices misc electrical equipment misc equipment size reduction misc service life extension misc inorganic thermally conductive particles misc dielectric polymer composites misc particle-filled thermal conductive composites misc intrinsic thermal conductive polymer misc surface treatment misc thermal properties misc electrical properties misc thermally conductive epoxy misc polyethylene composites misc polyimide composites misc tracking failure misc thermal accumulation misc thermal breakdown phenomenon misc Electrical engineering. Electronics. Nuclear engineering misc Electricity Review of high thermal conductivity polymer dielectrics for electrical insulation |
authorStr |
Meng Xiao |
ppnlink_with_tag_str_mv |
@@773@@(DE-627)860188957 |
format |
electronic Article |
delete_txt_mv |
keep |
author_role |
aut aut |
collection |
DOAJ |
remote_str |
true |
callnumber-label |
TK1-9971 |
illustrated |
Not Illustrated |
issn |
23977264 |
topic_title |
TK1-9971 QC501-721 Review of high thermal conductivity polymer dielectrics for electrical insulation thermal conductivity thermal insulating materials filled polymers conducting polymers dielectric materials electric properties failure analysis composite insulating materials high thermal conductivity polymer dielectrics electrical insulation material thermal insulation electrical devices electrical equipment equipment size reduction service life extension inorganic thermally conductive particles dielectric polymer composites particle-filled thermal conductive composites intrinsic thermal conductive polymer surface treatment thermal properties electrical properties thermally conductive epoxy polyethylene composites polyimide composites tracking failure thermal accumulation thermal breakdown phenomenon |
topic |
misc TK1-9971 misc QC501-721 misc thermal conductivity misc thermal insulating materials misc filled polymers misc conducting polymers misc dielectric materials misc electric properties misc failure analysis misc composite insulating materials misc high thermal conductivity polymer dielectrics misc electrical insulation material misc thermal insulation misc electrical devices misc electrical equipment misc equipment size reduction misc service life extension misc inorganic thermally conductive particles misc dielectric polymer composites misc particle-filled thermal conductive composites misc intrinsic thermal conductive polymer misc surface treatment misc thermal properties misc electrical properties misc thermally conductive epoxy misc polyethylene composites misc polyimide composites misc tracking failure misc thermal accumulation misc thermal breakdown phenomenon misc Electrical engineering. Electronics. Nuclear engineering misc Electricity |
topic_unstemmed |
misc TK1-9971 misc QC501-721 misc thermal conductivity misc thermal insulating materials misc filled polymers misc conducting polymers misc dielectric materials misc electric properties misc failure analysis misc composite insulating materials misc high thermal conductivity polymer dielectrics misc electrical insulation material misc thermal insulation misc electrical devices misc electrical equipment misc equipment size reduction misc service life extension misc inorganic thermally conductive particles misc dielectric polymer composites misc particle-filled thermal conductive composites misc intrinsic thermal conductive polymer misc surface treatment misc thermal properties misc electrical properties misc thermally conductive epoxy misc polyethylene composites misc polyimide composites misc tracking failure misc thermal accumulation misc thermal breakdown phenomenon misc Electrical engineering. Electronics. Nuclear engineering misc Electricity |
topic_browse |
misc TK1-9971 misc QC501-721 misc thermal conductivity misc thermal insulating materials misc filled polymers misc conducting polymers misc dielectric materials misc electric properties misc failure analysis misc composite insulating materials misc high thermal conductivity polymer dielectrics misc electrical insulation material misc thermal insulation misc electrical devices misc electrical equipment misc equipment size reduction misc service life extension misc inorganic thermally conductive particles misc dielectric polymer composites misc particle-filled thermal conductive composites misc intrinsic thermal conductive polymer misc surface treatment misc thermal properties misc electrical properties misc thermally conductive epoxy misc polyethylene composites misc polyimide composites misc tracking failure misc thermal accumulation misc thermal breakdown phenomenon misc Electrical engineering. Electronics. Nuclear engineering misc Electricity |
format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
format_main_str_mv |
Text Zeitschrift/Artikel |
carriertype_str_mv |
cr |
hierarchy_parent_title |
High Voltage |
hierarchy_parent_id |
860188957 |
hierarchy_top_title |
High Voltage |
isfreeaccess_txt |
true |
familylinks_str_mv |
(DE-627)860188957 (DE-600)2856739-0 |
title |
Review of high thermal conductivity polymer dielectrics for electrical insulation |
ctrlnum |
(DE-627)DOAJ052476243 (DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e |
title_full |
Review of high thermal conductivity polymer dielectrics for electrical insulation |
author_sort |
Meng Xiao |
journal |
High Voltage |
journalStr |
High Voltage |
callnumber-first-code |
T |
lang_code |
eng |
isOA_bool |
true |
recordtype |
marc |
publishDateSort |
2016 |
contenttype_str_mv |
txt |
author_browse |
Meng Xiao Bo Xue Du |
class |
TK1-9971 QC501-721 |
format_se |
Elektronische Aufsätze |
author-letter |
Meng Xiao |
doi_str_mv |
10.1049/hve.2016.0008 |
author2-role |
verfasserin |
title_sort |
review of high thermal conductivity polymer dielectrics for electrical insulation |
callnumber |
TK1-9971 |
title_auth |
Review of high thermal conductivity polymer dielectrics for electrical insulation |
abstract |
Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. |
abstractGer |
Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. |
abstract_unstemmed |
Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed. |
collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_636 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 |
title_short |
Review of high thermal conductivity polymer dielectrics for electrical insulation |
url |
https://doi.org/10.1049/hve.2016.0008 https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008 https://doaj.org/toc/2397-7264 |
remote_bool |
true |
author2 |
Bo Xue Du |
author2Str |
Bo Xue Du |
ppnlink |
860188957 |
callnumber-subject |
TK - Electrical and Nuclear Engineering |
mediatype_str_mv |
c |
isOA_txt |
true |
hochschulschrift_bool |
false |
doi_str |
10.1049/hve.2016.0008 |
callnumber-a |
TK1-9971 |
up_date |
2024-07-04T01:12:33.105Z |
_version_ |
1803608971655774208 |
fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">DOAJ052476243</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230308165505.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">230227s2016 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1049/hve.2016.0008</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)DOAJ052476243</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)DOAJ77b2f8981f3a415d847a6cdd7fe2c65e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK1-9971</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">QC501-721</subfield></datafield><datafield tag="100" ind1="0" ind2=" "><subfield code="a">Meng Xiao</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Review of high thermal conductivity polymer dielectrics for electrical insulation</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study, the factors affecting the thermal conductivity of dielectric polymer composites were explored. Intrinsic thermal conductive polymer and particle-filled thermal conductive composites were discussed. Effect of thermal conductivity, shape, size, surface treatment of the particle and prepare process on thermal properties of the composites were illustrated. This study focused on the electrical and thermal properties of thermally conductive epoxy, polyimide and polyethylene composites. Tracking failure caused by thermal accumulation is a typical thermal breakdown phenomenon. The performance of the resistance to tracking failure was studied for these composites. The results showed that thermal conductive particles improved the resistance to tracking failure. Finally, application of thermally conductive epoxy in electrical equipment was discussed.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal conductivity</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal insulating materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">filled polymers</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">conducting polymers</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">dielectric materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electric properties</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">failure analysis</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">composite insulating materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">high thermal conductivity polymer dielectrics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical insulation material</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal insulation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical devices</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical equipment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">equipment size reduction</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">service life extension</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">inorganic thermally conductive particles</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">dielectric polymer composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">particle-filled thermal conductive composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">intrinsic thermal conductive polymer</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">surface treatment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal properties</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">electrical properties</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermally conductive epoxy</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">polyethylene composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">polyimide composites</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">tracking failure</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal accumulation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermal breakdown phenomenon</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electrical engineering. Electronics. Nuclear engineering</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electricity</subfield></datafield><datafield tag="700" ind1="0" ind2=" "><subfield code="a">Bo Xue Du</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">In</subfield><subfield code="t">High Voltage</subfield><subfield code="d">Wiley, 2017</subfield><subfield code="g">(2016)</subfield><subfield code="w">(DE-627)860188957</subfield><subfield code="w">(DE-600)2856739-0</subfield><subfield code="x">23977264</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">year:2016</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1049/hve.2016.0008</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doaj.org/article/77b2f8981f3a415d847a6cdd7fe2c65e</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://digital-library.theiet.org/content/journals/10.1049/hve.2016.0008</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="u">https://doaj.org/toc/2397-7264</subfield><subfield code="y">Journal toc</subfield><subfield code="z">kostenfrei</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_DOAJ</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_20</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_22</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_39</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_60</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_62</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_63</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_65</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_69</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_73</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_95</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_105</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_151</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_161</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_170</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_171</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_213</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_224</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_230</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_285</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_293</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_602</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_636</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2006</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2007</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2010</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2011</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2014</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2026</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2027</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2034</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2038</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2044</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2048</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2049</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2050</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2055</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2056</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2057</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2059</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2061</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2064</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2068</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2088</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2106</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2108</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2111</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2118</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2122</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2143</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2144</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2147</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2148</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2152</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2153</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2232</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2470</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2507</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2522</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4012</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4035</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4112</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4125</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4126</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4242</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4249</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4251</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4305</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4306</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4307</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4313</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4322</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4324</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4325</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4326</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4333</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4334</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4335</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4338</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4367</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="j">2016</subfield></datafield></record></collection>
|
score |
7.4031916 |