Thermal monitoring as a method for estimation of technical state of digital devices
Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state o...
Ausführliche Beschreibung
Autor*in: |
Lavrich Yu. N. [verfasserIn] |
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Format: |
E-Artikel |
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Sprache: |
Englisch ; Russisch |
Erschienen: |
2015 |
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In: Tekhnologiya i Konstruirovanie v Elektronnoi Apparature - Politehperiodika, 2011, (2015), 4, Seite 36-41 |
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Übergeordnetes Werk: |
year:2015 ; number:4 ; pages:36-41 |
Links: |
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DOI / URN: |
10.15222/TKEA2015.4.36 |
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Katalog-ID: |
DOAJ063660873 |
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10.15222/TKEA2015.4.36 doi (DE-627)DOAJ063660873 (DE-599)DOAJ1cda89d5a5244c8394fadacc2c379747 DE-627 ger DE-627 rakwb eng rus TK1-9971 Lavrich Yu. N. verfasserin aut Thermal monitoring as a method for estimation of technical state of digital devices 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. digital devices technical state control generalized parameter thermal monitoring Electrical engineering. Electronics. Nuclear engineering In Tekhnologiya i Konstruirovanie v Elektronnoi Apparature Politehperiodika, 2011 (2015), 4, Seite 36-41 (DE-627)736433473 (DE-600)2704178-5 23099992 nnns year:2015 number:4 pages:36-41 https://doi.org/10.15222/TKEA2015.4.36 kostenfrei https://doaj.org/article/1cda89d5a5244c8394fadacc2c379747 kostenfrei http://www.tkea.com.ua/tkea/2015/4_2015/pdf/07.pdf kostenfrei https://doaj.org/toc/2225-5818 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2015 4 36-41 |
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10.15222/TKEA2015.4.36 doi (DE-627)DOAJ063660873 (DE-599)DOAJ1cda89d5a5244c8394fadacc2c379747 DE-627 ger DE-627 rakwb eng rus TK1-9971 Lavrich Yu. N. verfasserin aut Thermal monitoring as a method for estimation of technical state of digital devices 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. digital devices technical state control generalized parameter thermal monitoring Electrical engineering. Electronics. Nuclear engineering In Tekhnologiya i Konstruirovanie v Elektronnoi Apparature Politehperiodika, 2011 (2015), 4, Seite 36-41 (DE-627)736433473 (DE-600)2704178-5 23099992 nnns year:2015 number:4 pages:36-41 https://doi.org/10.15222/TKEA2015.4.36 kostenfrei https://doaj.org/article/1cda89d5a5244c8394fadacc2c379747 kostenfrei http://www.tkea.com.ua/tkea/2015/4_2015/pdf/07.pdf kostenfrei https://doaj.org/toc/2225-5818 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2015 4 36-41 |
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10.15222/TKEA2015.4.36 doi (DE-627)DOAJ063660873 (DE-599)DOAJ1cda89d5a5244c8394fadacc2c379747 DE-627 ger DE-627 rakwb eng rus TK1-9971 Lavrich Yu. N. verfasserin aut Thermal monitoring as a method for estimation of technical state of digital devices 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. digital devices technical state control generalized parameter thermal monitoring Electrical engineering. Electronics. Nuclear engineering In Tekhnologiya i Konstruirovanie v Elektronnoi Apparature Politehperiodika, 2011 (2015), 4, Seite 36-41 (DE-627)736433473 (DE-600)2704178-5 23099992 nnns year:2015 number:4 pages:36-41 https://doi.org/10.15222/TKEA2015.4.36 kostenfrei https://doaj.org/article/1cda89d5a5244c8394fadacc2c379747 kostenfrei http://www.tkea.com.ua/tkea/2015/4_2015/pdf/07.pdf kostenfrei https://doaj.org/toc/2225-5818 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2015 4 36-41 |
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10.15222/TKEA2015.4.36 doi (DE-627)DOAJ063660873 (DE-599)DOAJ1cda89d5a5244c8394fadacc2c379747 DE-627 ger DE-627 rakwb eng rus TK1-9971 Lavrich Yu. N. verfasserin aut Thermal monitoring as a method for estimation of technical state of digital devices 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. digital devices technical state control generalized parameter thermal monitoring Electrical engineering. Electronics. Nuclear engineering In Tekhnologiya i Konstruirovanie v Elektronnoi Apparature Politehperiodika, 2011 (2015), 4, Seite 36-41 (DE-627)736433473 (DE-600)2704178-5 23099992 nnns year:2015 number:4 pages:36-41 https://doi.org/10.15222/TKEA2015.4.36 kostenfrei https://doaj.org/article/1cda89d5a5244c8394fadacc2c379747 kostenfrei http://www.tkea.com.ua/tkea/2015/4_2015/pdf/07.pdf kostenfrei https://doaj.org/toc/2225-5818 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 2015 4 36-41 |
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Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. |
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Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. |
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Requirements to the reliability level of modern element base are so high that traditional methods of assessing the technical condition of electronics become ineffective, the modern theory of reliability has almost no practical applications [1], and reliability index does not reflect the true state of an electronic device due to an insufficient amount of information received during testing of electronic devices. The majority of modern electronics are limitedly easy-to-test. They are equipped with small number of tools for direct measurement that leads to a delayed troubleshooting and the inability to take measures efficiently. Despite the fact that new generations of electronics use modern components and new design technologies, their performance is still defined by two states — serviceability or failure, and the failure still happens unexpectedly. We may note, that failure is an uncontrolled result of an irreversible degradation process, taking place in time and having appropriate time parameters, but it's not the critical act. Research of various structural and hierarchical levels of functional units of digital electronics show that temperature control can be used for automatic condition monitoring of such devices in real time. As a generalized control parameter, it is advisable to use the temperature of the case of the element, and the case itself — as a generalized point. |
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|
score |
7.4011087 |