Utjecaj derivata imidazola na koroziju bakra

Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film. Ausführliche Beschreibung

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Autor*in:	Otmačić, H. [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch ; Kroatisch

Erschienen:	2006

Schlagwörter:	Imidazole Derivatives Copper Corrosion

Übergeordnetes Werk:	In: Kemija u Industriji - Croatian Society of Chemical Engineers, 2017, 55(2006), 06, Seite 253-259
Übergeordnetes Werk:	volume:55 ; year:2006 ; number:06 ; pages:253-259

Links:	Link aufrufen Link aufrufen Journal toc Journal toc

Katalog-ID:	DOAJ067329020

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allfields	(DE-627)DOAJ067329020 (DE-599)DOAJca14cd0af92a41f9a286cb9834c67569 DE-627 ger DE-627 rakwb eng hrv QD1-999 Otmačić, H. verfasserin aut Utjecaj derivata imidazola na koroziju bakra 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film. Imidazole Derivatives Copper Corrosion Chemistry In Kemija u Industriji Croatian Society of Chemical Engineers, 2017 55(2006), 06, Seite 253-259 (DE-627)474384195 (DE-600)2170074-6 13349090 nnns volume:55 year:2006 number:06 pages:253-259 https://doaj.org/article/ca14cd0af92a41f9a286cb9834c67569 kostenfrei http://pierre.fkit.hr/hdki/kui/vol55/broj06/253.pdf kostenfrei https://doaj.org/toc/0022-9830 Journal toc kostenfrei https://doaj.org/toc/1334-9090 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_138 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_187 GBV_ILN_213 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_647 GBV_ILN_702 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 55 2006 06 253-259
spelling	(DE-627)DOAJ067329020 (DE-599)DOAJca14cd0af92a41f9a286cb9834c67569 DE-627 ger DE-627 rakwb eng hrv QD1-999 Otmačić, H. verfasserin aut Utjecaj derivata imidazola na koroziju bakra 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film. Imidazole Derivatives Copper Corrosion Chemistry In Kemija u Industriji Croatian Society of Chemical Engineers, 2017 55(2006), 06, Seite 253-259 (DE-627)474384195 (DE-600)2170074-6 13349090 nnns volume:55 year:2006 number:06 pages:253-259 https://doaj.org/article/ca14cd0af92a41f9a286cb9834c67569 kostenfrei http://pierre.fkit.hr/hdki/kui/vol55/broj06/253.pdf kostenfrei https://doaj.org/toc/0022-9830 Journal toc kostenfrei https://doaj.org/toc/1334-9090 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_138 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_187 GBV_ILN_213 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_647 GBV_ILN_702 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 55 2006 06 253-259
allfields_unstemmed	(DE-627)DOAJ067329020 (DE-599)DOAJca14cd0af92a41f9a286cb9834c67569 DE-627 ger DE-627 rakwb eng hrv QD1-999 Otmačić, H. verfasserin aut Utjecaj derivata imidazola na koroziju bakra 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film. Imidazole Derivatives Copper Corrosion Chemistry In Kemija u Industriji Croatian Society of Chemical Engineers, 2017 55(2006), 06, Seite 253-259 (DE-627)474384195 (DE-600)2170074-6 13349090 nnns volume:55 year:2006 number:06 pages:253-259 https://doaj.org/article/ca14cd0af92a41f9a286cb9834c67569 kostenfrei http://pierre.fkit.hr/hdki/kui/vol55/broj06/253.pdf kostenfrei https://doaj.org/toc/0022-9830 Journal toc kostenfrei https://doaj.org/toc/1334-9090 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_138 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_187 GBV_ILN_213 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_647 GBV_ILN_702 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 55 2006 06 253-259
allfieldsGer	(DE-627)DOAJ067329020 (DE-599)DOAJca14cd0af92a41f9a286cb9834c67569 DE-627 ger DE-627 rakwb eng hrv QD1-999 Otmačić, H. verfasserin aut Utjecaj derivata imidazola na koroziju bakra 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film. Imidazole Derivatives Copper Corrosion Chemistry In Kemija u Industriji Croatian Society of Chemical Engineers, 2017 55(2006), 06, Seite 253-259 (DE-627)474384195 (DE-600)2170074-6 13349090 nnns volume:55 year:2006 number:06 pages:253-259 https://doaj.org/article/ca14cd0af92a41f9a286cb9834c67569 kostenfrei http://pierre.fkit.hr/hdki/kui/vol55/broj06/253.pdf kostenfrei https://doaj.org/toc/0022-9830 Journal toc kostenfrei https://doaj.org/toc/1334-9090 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_138 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_187 GBV_ILN_213 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_647 GBV_ILN_702 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 55 2006 06 253-259
allfieldsSound	(DE-627)DOAJ067329020 (DE-599)DOAJca14cd0af92a41f9a286cb9834c67569 DE-627 ger DE-627 rakwb eng hrv QD1-999 Otmačić, H. verfasserin aut Utjecaj derivata imidazola na koroziju bakra 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film. Imidazole Derivatives Copper Corrosion Chemistry In Kemija u Industriji Croatian Society of Chemical Engineers, 2017 55(2006), 06, Seite 253-259 (DE-627)474384195 (DE-600)2170074-6 13349090 nnns volume:55 year:2006 number:06 pages:253-259 https://doaj.org/article/ca14cd0af92a41f9a286cb9834c67569 kostenfrei http://pierre.fkit.hr/hdki/kui/vol55/broj06/253.pdf kostenfrei https://doaj.org/toc/0022-9830 Journal toc kostenfrei https://doaj.org/toc/1334-9090 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_138 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_187 GBV_ILN_213 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_647 GBV_ILN_702 GBV_ILN_2014 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 55 2006 06 253-259
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title_sort	utjecaj derivata imidazola na koroziju bakra
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title_auth	Utjecaj derivata imidazola na koroziju bakra
abstract	Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film.
abstractGer	Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film.
abstract_unstemmed	Inhibiting efficiency of non-toxic imidazole derivatives (presented on Figure 1), as copper corrosion inhibitors in w = 3 % NaCl solution, was studied in the present work. Electrochemical investigations performed by potentiodynamic polarization measurements have shown that all studied compounds decrease the rate of copper corrosion while their inhibiting efficiency increases with molecular mass (Table 1). Except the molecular mass, the nature of the supstituent significantly influences the inhibiting property. Compounds containing alkyl supstituent show lower inhibiting efficiency than aryl containing imidazoles, but their efficiency is temperature independent while the efficiencies of aryl supstitued imidazoles slightly decrease with the increase of temperature (Fig. 3). Furthermore, alkyl imidazoles influence more on cathodic corrosion reaction, while aryl imidazoles have more influence on anodic corrosion reaction. Additional electrochemical (EQCM and EIS) and spectroscopic investigations have shown that, even between the two most efficient corrosion inhibitors, 1-phenyl-4-methylimidazole and 1-(p-tolyl)-4-methylimidazole, exist important differences in the mechanism of retardation of the corrosion process. The inhibitor that contains the tolyl substituent decreases the corrosion rate of copper due to the formation of thin layer of adsorbate, while in the case of 1-phenyl-4-methylimidazole, formation of thick layer can be followed with time (Fig. 4). From EIS (Electrochemical Impedance Spectroscopy) studies, it was observed that these inhibitors significantly increase absolute impedance of copper which shows that they efficiently protect copper from corrosion. In the case of 1-phenyl-4-methylimidazole absolute impedance increases in time (Fig. 5 and 6) which means that the protective layer is slowly forming on the metal surface. Studies performed in the presence of 1-(p-tolyl)-4-methylimidazole showed that already after short immersion time (Fig. 5) very protective surface film is formed and it remains stable in time (Fig. 6.) Investigations performed by SEM and AFM measurements confirm that 1-phenyl-4-methylimidazole forms three-dimensional protective surface layer while in the presence of 1-(p-tolyl)-4--methylimidazole copper surface is protected by a thin inhibitor film.
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title_short	Utjecaj derivata imidazola na koroziju bakra
url	https://doaj.org/article/ca14cd0af92a41f9a286cb9834c67569 http://pierre.fkit.hr/hdki/kui/vol55/broj06/253.pdf https://doaj.org/toc/0022-9830 https://doaj.org/toc/1334-9090
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