Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials

The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, sys...
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Autor*in:	Shanggui Deng [verfasserIn] Sharad Bhatnagar [verfasserIn] Shan He [verfasserIn] Nabeel Ahmad [verfasserIn] Abdul Rahaman [verfasserIn] Jingrong Gao [verfasserIn] Jagriti Narang [verfasserIn] Ibrahim Khalifa [verfasserIn] Anindya Nag [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2022

Schlagwörter:	embedded components resistors capacitors inductors interconnects nanomaterials

Übergeordnetes Werk:	In: Nanomaterials - MDPI AG, 2012, 12(2022), 19, p 3284
Übergeordnetes Werk:	volume:12 ; year:2022 ; number:19, p 3284

Links:	Link aufrufen Link aufrufen Link aufrufen Journal toc

DOI / URN:	10.3390/nano12193284

Katalog-ID:	DOAJ084017767

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allfieldsSound	10.3390/nano12193284 doi (DE-627)DOAJ084017767 (DE-599)DOAJ8328a8acbd2e42c7b2021c04f7b924e8 DE-627 ger DE-627 rakwb eng QD1-999 Shanggui Deng verfasserin aut Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, system in package, and system on chip are the various packaging techniques that utilize nanoscale components for their implementation. The active components of the ICs have kept pace with Moore’s law, but the passive components have proven an impediment in the race for miniaturization. Moreover, the toxic effects and nano-scale problems associated with conventional soldering techniques have entailed the active involvement of nanotechnology in the search for answers. Recent advances in these fields and the diverse nanomaterials which are being employed to resolve these issues have been discussed in detail. embedded components resistors capacitors inductors interconnects nanomaterials Chemistry Sharad Bhatnagar verfasserin aut Shan He verfasserin aut Nabeel Ahmad verfasserin aut Abdul Rahaman verfasserin aut Jingrong Gao verfasserin aut Jagriti Narang verfasserin aut Ibrahim Khalifa verfasserin aut Anindya Nag verfasserin aut In Nanomaterials MDPI AG, 2012 12(2022), 19, p 3284 (DE-627)718627199 (DE-600)2662255-5 20794991 nnns volume:12 year:2022 number:19, p 3284 https://doi.org/10.3390/nano12193284 kostenfrei https://doaj.org/article/8328a8acbd2e42c7b2021c04f7b924e8 kostenfrei https://www.mdpi.com/2079-4991/12/19/3284 kostenfrei https://doaj.org/toc/2079-4991 Journal toc kostenfrei GBV_USEFLAG_A SYSFLAG_A GBV_DOAJ GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_95 GBV_ILN_105 GBV_ILN_110 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_213 GBV_ILN_230 GBV_ILN_285 GBV_ILN_293 GBV_ILN_602 GBV_ILN_2014 GBV_ILN_2055 GBV_ILN_2108 GBV_ILN_2119 GBV_ILN_4012 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4249 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4367 GBV_ILN_4700 AR 12 2022 19, p 3284
language	English
source	In Nanomaterials 12(2022), 19, p 3284 volume:12 year:2022 number:19, p 3284
sourceStr	In Nanomaterials 12(2022), 19, p 3284 volume:12 year:2022 number:19, p 3284
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topic_facet	embedded components resistors capacitors inductors interconnects nanomaterials Chemistry
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authorswithroles_txt_mv	Shanggui Deng @@aut@@ Sharad Bhatnagar @@aut@@ Shan He @@aut@@ Nabeel Ahmad @@aut@@ Abdul Rahaman @@aut@@ Jingrong Gao @@aut@@ Jagriti Narang @@aut@@ Ibrahim Khalifa @@aut@@ Anindya Nag @@aut@@
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callnumber-first	Q - Science
author	Shanggui Deng
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topic	misc QD1-999 misc embedded components misc resistors misc capacitors misc inductors misc interconnects misc nanomaterials misc Chemistry
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title_sort	development and applications of embedded passives and interconnects employing nanomaterials
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title_auth	Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials
abstract	The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, system in package, and system on chip are the various packaging techniques that utilize nanoscale components for their implementation. The active components of the ICs have kept pace with Moore’s law, but the passive components have proven an impediment in the race for miniaturization. Moreover, the toxic effects and nano-scale problems associated with conventional soldering techniques have entailed the active involvement of nanotechnology in the search for answers. Recent advances in these fields and the diverse nanomaterials which are being employed to resolve these issues have been discussed in detail.
abstractGer	The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, system in package, and system on chip are the various packaging techniques that utilize nanoscale components for their implementation. The active components of the ICs have kept pace with Moore’s law, but the passive components have proven an impediment in the race for miniaturization. Moreover, the toxic effects and nano-scale problems associated with conventional soldering techniques have entailed the active involvement of nanotechnology in the search for answers. Recent advances in these fields and the diverse nanomaterials which are being employed to resolve these issues have been discussed in detail.
abstract_unstemmed	The advent of nanotechnology has initiated a profound revolution in almost all spheres of technology. The electronics industry is concerned with the ongoing miniaturization of devices and as such requires packaging technologies that will make the devices more compact and resilient. 3D packaging, system in package, and system on chip are the various packaging techniques that utilize nanoscale components for their implementation. The active components of the ICs have kept pace with Moore’s law, but the passive components have proven an impediment in the race for miniaturization. Moreover, the toxic effects and nano-scale problems associated with conventional soldering techniques have entailed the active involvement of nanotechnology in the search for answers. Recent advances in these fields and the diverse nanomaterials which are being employed to resolve these issues have been discussed in detail.
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title_short	Development and Applications of Embedded Passives and Interconnects Employing Nanomaterials
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