Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive

In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are t...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Genty, Sébastien [verfasserIn] Tingaut, Philippe [verfasserIn] Aufray, Maëlenn [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2018

Schlagwörter:	Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy

Übergeordnetes Werk:	Enthalten in: Thermochimica acta - Amsterdam [u.a.] : Elsevier Science, 1970, 666, Seite 27-35
Übergeordnetes Werk:	volume:666 ; pages:27-35

DOI / URN:	10.1016/j.tca.2018.05.018

Katalog-ID:	ELV000055646

Internformat


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520			\|a In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction.
650		4	\|a Epoxy adhesive
650		4	\|a Differential Scanning Calorimetry
650		4	\|a Infrared curing
650		4	\|a Thermal curing
650		4	\|a Cure kinetics
650		4	\|a Activation energy
700	1		\|a Tingaut, Philippe \|e verfasserin \|4 aut
700	1		\|a Aufray, Maëlenn \|e verfasserin \|4 aut
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Indexfelder

author_variant	s g sg p t pt m a ma
matchkey_str	gentysbastientingautphilippeaufraymalenn:2018----:atoyeiaintotmeauefnnrrdaitoc
hierarchy_sort_str	2018
bklnumber	35.00
publishDate	2018
allfields	10.1016/j.tca.2018.05.018 doi (DE-627)ELV000055646 (ELSEVIER)S0040-6031(18)30244-2 DE-627 ger DE-627 rda eng 540 DE-600 35.00 bkl Genty, Sébastien verfasserin aut Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction. Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy Tingaut, Philippe verfasserin aut Aufray, Maëlenn verfasserin aut Enthalten in Thermochimica acta Amsterdam [u.a.] : Elsevier Science, 1970 666, Seite 27-35 Online-Ressource (DE-627)306712628 (DE-600)1500974-9 (DE-576)251938166 nnns volume:666 pages:27-35 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 35.00 Chemie: Allgemeines AR 666 27-35
spelling	10.1016/j.tca.2018.05.018 doi (DE-627)ELV000055646 (ELSEVIER)S0040-6031(18)30244-2 DE-627 ger DE-627 rda eng 540 DE-600 35.00 bkl Genty, Sébastien verfasserin aut Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction. Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy Tingaut, Philippe verfasserin aut Aufray, Maëlenn verfasserin aut Enthalten in Thermochimica acta Amsterdam [u.a.] : Elsevier Science, 1970 666, Seite 27-35 Online-Ressource (DE-627)306712628 (DE-600)1500974-9 (DE-576)251938166 nnns volume:666 pages:27-35 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 35.00 Chemie: Allgemeines AR 666 27-35
allfields_unstemmed	10.1016/j.tca.2018.05.018 doi (DE-627)ELV000055646 (ELSEVIER)S0040-6031(18)30244-2 DE-627 ger DE-627 rda eng 540 DE-600 35.00 bkl Genty, Sébastien verfasserin aut Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction. Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy Tingaut, Philippe verfasserin aut Aufray, Maëlenn verfasserin aut Enthalten in Thermochimica acta Amsterdam [u.a.] : Elsevier Science, 1970 666, Seite 27-35 Online-Ressource (DE-627)306712628 (DE-600)1500974-9 (DE-576)251938166 nnns volume:666 pages:27-35 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 35.00 Chemie: Allgemeines AR 666 27-35
allfieldsGer	10.1016/j.tca.2018.05.018 doi (DE-627)ELV000055646 (ELSEVIER)S0040-6031(18)30244-2 DE-627 ger DE-627 rda eng 540 DE-600 35.00 bkl Genty, Sébastien verfasserin aut Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction. Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy Tingaut, Philippe verfasserin aut Aufray, Maëlenn verfasserin aut Enthalten in Thermochimica acta Amsterdam [u.a.] : Elsevier Science, 1970 666, Seite 27-35 Online-Ressource (DE-627)306712628 (DE-600)1500974-9 (DE-576)251938166 nnns volume:666 pages:27-35 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 35.00 Chemie: Allgemeines AR 666 27-35
allfieldsSound	10.1016/j.tca.2018.05.018 doi (DE-627)ELV000055646 (ELSEVIER)S0040-6031(18)30244-2 DE-627 ger DE-627 rda eng 540 DE-600 35.00 bkl Genty, Sébastien verfasserin aut Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction. Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy Tingaut, Philippe verfasserin aut Aufray, Maëlenn verfasserin aut Enthalten in Thermochimica acta Amsterdam [u.a.] : Elsevier Science, 1970 666, Seite 27-35 Online-Ressource (DE-627)306712628 (DE-600)1500974-9 (DE-576)251938166 nnns volume:666 pages:27-35 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 35.00 Chemie: Allgemeines AR 666 27-35
language	English
source	Enthalten in Thermochimica acta 666, Seite 27-35 volume:666 pages:27-35
sourceStr	Enthalten in Thermochimica acta 666, Seite 27-35 volume:666 pages:27-35
format_phy_str_mv	Article
bklname	Chemie: Allgemeines
institution	findex.gbv.de
topic_facet	Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy
dewey-raw	540
isfreeaccess_bool	false
container_title	Thermochimica acta
authorswithroles_txt_mv	Genty, Sébastien @@aut@@ Tingaut, Philippe @@aut@@ Aufray, Maëlenn @@aut@@
publishDateDaySort_date	2018-01-01T00:00:00Z
hierarchy_top_id	306712628
dewey-sort	3540
id	ELV000055646
language_de	englisch
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author	Genty, Sébastien
spellingShingle	Genty, Sébastien ddc 540 bkl 35.00 misc Epoxy adhesive misc Differential Scanning Calorimetry misc Infrared curing misc Thermal curing misc Cure kinetics misc Activation energy Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
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topic_title	540 DE-600 35.00 bkl Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive Epoxy adhesive Differential Scanning Calorimetry Infrared curing Thermal curing Cure kinetics Activation energy
topic	ddc 540 bkl 35.00 misc Epoxy adhesive misc Differential Scanning Calorimetry misc Infrared curing misc Thermal curing misc Cure kinetics misc Activation energy
topic_unstemmed	ddc 540 bkl 35.00 misc Epoxy adhesive misc Differential Scanning Calorimetry misc Infrared curing misc Thermal curing misc Cure kinetics misc Activation energy
topic_browse	ddc 540 bkl 35.00 misc Epoxy adhesive misc Differential Scanning Calorimetry misc Infrared curing misc Thermal curing misc Cure kinetics misc Activation energy
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title	Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
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title_full	Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
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title_sort	fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
title_auth	Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
abstract	In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction.
abstractGer	In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction.
abstract_unstemmed	In the industry, the cure time of two-component adhesives is very important for a cost-effective manufacturing. Too fast, it does not favor the application of the product and the control of bonded joints. Too slow, it leads to long process times and too high process costs. The best compromises are two-component adhesives that cure slowly at room temperature and can reach full polymerization in minutes, on demand. In this paper, the curing behavior of a model poly-epoxide adhesive (a stoichiometric mixture of a pure epoxy and amine) polymerized with infrared radiation will be studied. The kinetic follow-up of this polymerization will be carried out by thermal analysis (determination of the residual heat peak by Differential Scanning Calorimetry-DSC). This study paves the way to a cold and universal cure-on-demand process, which means achieved in few minutes at low temperature without any initiators, catalysts or accelerators. Basically, infrared curing can be possible thanks to an increase in temperature (called thermal effect). But it has been shown that a “non-thermal effect” could also be involved in accelerating kinetics with infrared. This increase due to a non-thermal effect, suggested as a function of the infrared radiative flux, has been shown to be possible thanks to the absorption of infrared radiation, leading to a reduction in the energy barrier of the primary epoxy/amine reaction.
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title_short	Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive
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up_date	2024-07-06T16:43:05.405Z
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Fast polymerization at low temperature of an infrared radiation cured epoxy-amine adhesive

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