Polypropylene-high resistivity silicon composite for high frequency applications

Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9...
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Gespeichert in:

Autor*in:	Sebastian, M.T. [verfasserIn] Krupka, J. [verfasserIn] Arun, S. [verfasserIn] Kim, C.H. [verfasserIn] Kim, H.T. [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2018

Schlagwörter:	Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity

Übergeordnetes Werk:	Enthalten in: Materials letters - New York, NY [u.a.] : Elsevier, 1982, 232, Seite 92-94
Übergeordnetes Werk:	volume:232 ; pages:92-94

DOI / URN:	10.1016/j.matlet.2018.08.093

Katalog-ID:	ELV000370746

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520			\|a Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder.
650		4	\|a Millimeter wave materials
650		4	\|a Microwave substrates
650		4	\|a Dielectrics
650		4	\|a Loss tangent
650		4	\|a Thermal conductivity
700	1		\|a Krupka, J. \|e verfasserin \|4 aut
700	1		\|a Arun, S. \|e verfasserin \|4 aut
700	1		\|a Kim, C.H. \|e verfasserin \|4 aut
700	1		\|a Kim, H.T. \|e verfasserin \|4 aut
773	0	8	\|i Enthalten in \|t Materials letters \|d New York, NY [u.a.] : Elsevier, 1982 \|g 232, Seite 92-94 \|h Online-Ressource \|w (DE-627)302719407 \|w (DE-600)1491964-3 \|w (DE-576)259483974 \|x 1873-4979 \|7 nnns
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936	b	k	\|a 51.00 \|j Werkstoffkunde: Allgemeines
951			\|a AR
952			\|d 232 \|h 92-94

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publishDate	2018
allfields	10.1016/j.matlet.2018.08.093 doi (DE-627)ELV000370746 (ELSEVIER)S0167-577X(18)31296-5 DE-627 ger DE-627 rda eng 530 600 670 DE-600 51.00 bkl Sebastian, M.T. verfasserin aut Polypropylene-high resistivity silicon composite for high frequency applications 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder. Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity Krupka, J. verfasserin aut Arun, S. verfasserin aut Kim, C.H. verfasserin aut Kim, H.T. verfasserin aut Enthalten in Materials letters New York, NY [u.a.] : Elsevier, 1982 232, Seite 92-94 Online-Ressource (DE-627)302719407 (DE-600)1491964-3 (DE-576)259483974 1873-4979 nnns volume:232 pages:92-94 GBV_USEFLAG_U SYSFLAG_U GBV_ELV GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2008 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 51.00 Werkstoffkunde: Allgemeines AR 232 92-94
spelling	10.1016/j.matlet.2018.08.093 doi (DE-627)ELV000370746 (ELSEVIER)S0167-577X(18)31296-5 DE-627 ger DE-627 rda eng 530 600 670 DE-600 51.00 bkl Sebastian, M.T. verfasserin aut Polypropylene-high resistivity silicon composite for high frequency applications 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder. Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity Krupka, J. verfasserin aut Arun, S. verfasserin aut Kim, C.H. verfasserin aut Kim, H.T. verfasserin aut Enthalten in Materials letters New York, NY [u.a.] : Elsevier, 1982 232, Seite 92-94 Online-Ressource (DE-627)302719407 (DE-600)1491964-3 (DE-576)259483974 1873-4979 nnns volume:232 pages:92-94 GBV_USEFLAG_U SYSFLAG_U GBV_ELV GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2008 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 51.00 Werkstoffkunde: Allgemeines AR 232 92-94
allfields_unstemmed	10.1016/j.matlet.2018.08.093 doi (DE-627)ELV000370746 (ELSEVIER)S0167-577X(18)31296-5 DE-627 ger DE-627 rda eng 530 600 670 DE-600 51.00 bkl Sebastian, M.T. verfasserin aut Polypropylene-high resistivity silicon composite for high frequency applications 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder. Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity Krupka, J. verfasserin aut Arun, S. verfasserin aut Kim, C.H. verfasserin aut Kim, H.T. verfasserin aut Enthalten in Materials letters New York, NY [u.a.] : Elsevier, 1982 232, Seite 92-94 Online-Ressource (DE-627)302719407 (DE-600)1491964-3 (DE-576)259483974 1873-4979 nnns volume:232 pages:92-94 GBV_USEFLAG_U SYSFLAG_U GBV_ELV GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2008 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 51.00 Werkstoffkunde: Allgemeines AR 232 92-94
allfieldsGer	10.1016/j.matlet.2018.08.093 doi (DE-627)ELV000370746 (ELSEVIER)S0167-577X(18)31296-5 DE-627 ger DE-627 rda eng 530 600 670 DE-600 51.00 bkl Sebastian, M.T. verfasserin aut Polypropylene-high resistivity silicon composite for high frequency applications 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder. Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity Krupka, J. verfasserin aut Arun, S. verfasserin aut Kim, C.H. verfasserin aut Kim, H.T. verfasserin aut Enthalten in Materials letters New York, NY [u.a.] : Elsevier, 1982 232, Seite 92-94 Online-Ressource (DE-627)302719407 (DE-600)1491964-3 (DE-576)259483974 1873-4979 nnns volume:232 pages:92-94 GBV_USEFLAG_U SYSFLAG_U GBV_ELV GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2008 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 51.00 Werkstoffkunde: Allgemeines AR 232 92-94
allfieldsSound	10.1016/j.matlet.2018.08.093 doi (DE-627)ELV000370746 (ELSEVIER)S0167-577X(18)31296-5 DE-627 ger DE-627 rda eng 530 600 670 DE-600 51.00 bkl Sebastian, M.T. verfasserin aut Polypropylene-high resistivity silicon composite for high frequency applications 2018 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder. Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity Krupka, J. verfasserin aut Arun, S. verfasserin aut Kim, C.H. verfasserin aut Kim, H.T. verfasserin aut Enthalten in Materials letters New York, NY [u.a.] : Elsevier, 1982 232, Seite 92-94 Online-Ressource (DE-627)302719407 (DE-600)1491964-3 (DE-576)259483974 1873-4979 nnns volume:232 pages:92-94 GBV_USEFLAG_U SYSFLAG_U GBV_ELV GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2008 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 51.00 Werkstoffkunde: Allgemeines AR 232 92-94
language	English
source	Enthalten in Materials letters 232, Seite 92-94 volume:232 pages:92-94
sourceStr	Enthalten in Materials letters 232, Seite 92-94 volume:232 pages:92-94
format_phy_str_mv	Article
bklname	Werkstoffkunde: Allgemeines
institution	findex.gbv.de
topic_facet	Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity
dewey-raw	530
isfreeaccess_bool	false
container_title	Materials letters
authorswithroles_txt_mv	Sebastian, M.T. @@aut@@ Krupka, J. @@aut@@ Arun, S. @@aut@@ Kim, C.H. @@aut@@ Kim, H.T. @@aut@@
publishDateDaySort_date	2018-01-01T00:00:00Z
hierarchy_top_id	302719407
dewey-sort	3530
id	ELV000370746
language_de	englisch
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author	Sebastian, M.T.
spellingShingle	Sebastian, M.T. ddc 530 bkl 51.00 misc Millimeter wave materials misc Microwave substrates misc Dielectrics misc Loss tangent misc Thermal conductivity Polypropylene-high resistivity silicon composite for high frequency applications
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topic_title	530 600 670 DE-600 51.00 bkl Polypropylene-high resistivity silicon composite for high frequency applications Millimeter wave materials Microwave substrates Dielectrics Loss tangent Thermal conductivity
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title	Polypropylene-high resistivity silicon composite for high frequency applications
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title_full	Polypropylene-high resistivity silicon composite for high frequency applications
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title_sort	polypropylene-high resistivity silicon composite for high frequency applications
title_auth	Polypropylene-high resistivity silicon composite for high frequency applications
abstract	Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder.
abstractGer	Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder.
abstract_unstemmed	Polypropylene-high energy proton irradiated silicon composite was prepared by hot pressing. The dielectric properties of the composite was measured at both low and microwave frequency range up to 45.9 GHz. The composite has a relative permittivity of 3.7 at 5 and 15 GHz but decreased to 2.82 at 45.9 GHz. The loss tangent decreased from 3.36 × 10−3 to 1.7 × 10−3 with increase in frequency in the same frequency range whereas the reported polymer-ceramic composites show an increasing trend in loss factor. The decreasing trend of the loss tangent with increasing frequency indicates the possibility of its use in high frequency applications such as IOT and 5G. The composite containing 30 vol% of high energy proton irradiated high resistivity Si has a relative permittivity of 2.82 and loss tangent 0.0017 at 45.9 GHz. The coefficient of thermal expansion (CTE) of polypropylene decreased from 140 to 60 ppm/°C and the composite has a thermal conductivity of 0.95 W/mK. The thermal conductivity of polypropylene (0.22) has increased by about 331% by the addition of 30 vol% of high resistivity silicon powder.
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title_short	Polypropylene-high resistivity silicon composite for high frequency applications
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up_date	2024-07-06T17:44:19.761Z
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