Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber
Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of the...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhang, Zongwu [verfasserIn] Zhou, Yijie [verfasserIn] Cai, Lifeng [verfasserIn] Xuan, Lixin [verfasserIn] Wu, Xiao [verfasserIn] Ma, Xiaoyan [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2022 |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: The chemical engineering journal - Amsterdam : Elsevier, 1997, 439 |
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| Übergeordnetes Werk: |
volume:439 |
| DOI / URN: |
10.1016/j.cej.2022.135740 |
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| Katalog-ID: |
ELV007705549 |
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| 245 | 1 | 0 | |a Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
| 264 | 1 | |c 2022 | |
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| 520 | |a Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. | ||
| 650 | 4 | |a BD-type bismaleimide resin | |
| 650 | 4 | |a POSS | |
| 650 | 4 | |a Eugenol | |
| 650 | 4 | |a Silica fiber | |
| 650 | 4 | |a Dielectric properties | |
| 650 | 4 | |a Mechanical properties | |
| 650 | 4 | |a Thermal stability | |
| 700 | 1 | |a Zhou, Yijie |e verfasserin |4 aut | |
| 700 | 1 | |a Cai, Lifeng |e verfasserin |4 aut | |
| 700 | 1 | |a Xuan, Lixin |e verfasserin |4 aut | |
| 700 | 1 | |a Wu, Xiao |e verfasserin |4 aut | |
| 700 | 1 | |a Ma, Xiaoyan |e verfasserin |4 aut | |
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10.1016/j.cej.2022.135740 doi (DE-627)ELV007705549 (ELSEVIER)S1385-8947(22)01240-2 DE-627 ger DE-627 rda eng 660.05 DE-101 660 DE-101 660 DE-600 58.10 bkl Zhang, Zongwu verfasserin aut Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber 2022 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. BD-type bismaleimide resin POSS Eugenol Silica fiber Dielectric properties Mechanical properties Thermal stability Zhou, Yijie verfasserin aut Cai, Lifeng verfasserin aut Xuan, Lixin verfasserin aut Wu, Xiao verfasserin aut Ma, Xiaoyan verfasserin aut Enthalten in The chemical engineering journal Amsterdam : Elsevier, 1997 439 Online-Ressource (DE-627)320500322 (DE-600)2012137-4 (DE-576)098330152 1873-3212 nnns volume:439 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 58.10 Verfahrenstechnik: Allgemeines AR 439 045F 660.05 |
| spelling |
10.1016/j.cej.2022.135740 doi (DE-627)ELV007705549 (ELSEVIER)S1385-8947(22)01240-2 DE-627 ger DE-627 rda eng 660.05 DE-101 660 DE-101 660 DE-600 58.10 bkl Zhang, Zongwu verfasserin aut Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber 2022 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. BD-type bismaleimide resin POSS Eugenol Silica fiber Dielectric properties Mechanical properties Thermal stability Zhou, Yijie verfasserin aut Cai, Lifeng verfasserin aut Xuan, Lixin verfasserin aut Wu, Xiao verfasserin aut Ma, Xiaoyan verfasserin aut Enthalten in The chemical engineering journal Amsterdam : Elsevier, 1997 439 Online-Ressource (DE-627)320500322 (DE-600)2012137-4 (DE-576)098330152 1873-3212 nnns volume:439 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 58.10 Verfahrenstechnik: Allgemeines AR 439 045F 660.05 |
| allfields_unstemmed |
10.1016/j.cej.2022.135740 doi (DE-627)ELV007705549 (ELSEVIER)S1385-8947(22)01240-2 DE-627 ger DE-627 rda eng 660.05 DE-101 660 DE-101 660 DE-600 58.10 bkl Zhang, Zongwu verfasserin aut Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber 2022 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. BD-type bismaleimide resin POSS Eugenol Silica fiber Dielectric properties Mechanical properties Thermal stability Zhou, Yijie verfasserin aut Cai, Lifeng verfasserin aut Xuan, Lixin verfasserin aut Wu, Xiao verfasserin aut Ma, Xiaoyan verfasserin aut Enthalten in The chemical engineering journal Amsterdam : Elsevier, 1997 439 Online-Ressource (DE-627)320500322 (DE-600)2012137-4 (DE-576)098330152 1873-3212 nnns volume:439 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 58.10 Verfahrenstechnik: Allgemeines AR 439 045F 660.05 |
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10.1016/j.cej.2022.135740 doi (DE-627)ELV007705549 (ELSEVIER)S1385-8947(22)01240-2 DE-627 ger DE-627 rda eng 660.05 DE-101 660 DE-101 660 DE-600 58.10 bkl Zhang, Zongwu verfasserin aut Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber 2022 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. BD-type bismaleimide resin POSS Eugenol Silica fiber Dielectric properties Mechanical properties Thermal stability Zhou, Yijie verfasserin aut Cai, Lifeng verfasserin aut Xuan, Lixin verfasserin aut Wu, Xiao verfasserin aut Ma, Xiaoyan verfasserin aut Enthalten in The chemical engineering journal Amsterdam : Elsevier, 1997 439 Online-Ressource (DE-627)320500322 (DE-600)2012137-4 (DE-576)098330152 1873-3212 nnns volume:439 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 58.10 Verfahrenstechnik: Allgemeines AR 439 045F 660.05 |
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10.1016/j.cej.2022.135740 doi (DE-627)ELV007705549 (ELSEVIER)S1385-8947(22)01240-2 DE-627 ger DE-627 rda eng 660.05 DE-101 660 DE-101 660 DE-600 58.10 bkl Zhang, Zongwu verfasserin aut Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber 2022 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. BD-type bismaleimide resin POSS Eugenol Silica fiber Dielectric properties Mechanical properties Thermal stability Zhou, Yijie verfasserin aut Cai, Lifeng verfasserin aut Xuan, Lixin verfasserin aut Wu, Xiao verfasserin aut Ma, Xiaoyan verfasserin aut Enthalten in The chemical engineering journal Amsterdam : Elsevier, 1997 439 Online-Ressource (DE-627)320500322 (DE-600)2012137-4 (DE-576)098330152 1873-3212 nnns volume:439 GBV_USEFLAG_U SYSFLAG_U GBV_ELV SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_224 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2038 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4313 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4338 GBV_ILN_4393 58.10 Verfahrenstechnik: Allgemeines AR 439 045F 660.05 |
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Zhang, Zongwu @@aut@@ Zhou, Yijie @@aut@@ Cai, Lifeng @@aut@@ Xuan, Lixin @@aut@@ Wu, Xiao @@aut@@ Ma, Xiaoyan @@aut@@ |
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Zhang, Zongwu ddc 660.05 ddc 660 bkl 58.10 misc BD-type bismaleimide resin misc POSS misc Eugenol misc Silica fiber misc Dielectric properties misc Mechanical properties misc Thermal stability Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
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660.05 DE-101 660 DE-101 660 DE-600 58.10 bkl Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber BD-type bismaleimide resin POSS Eugenol Silica fiber Dielectric properties Mechanical properties Thermal stability |
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Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
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Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
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synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
| title_auth |
Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
| abstract |
Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. |
| abstractGer |
Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. |
| abstract_unstemmed |
Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of these fillers. Herein, a novel eugenol-functionalized cage-like (pore size, 1–2 nm) polyhedral oligomeric silsesquioxane (EG-POSS) was designed and synthesized, which exhibits excellent solubility and reactivity with BD-type bismaleimide resin. Thus, 4 wt% incorporated EG-POSS is uniformly dispersed in resin matrix and the resultant hybrid (BDEP-0.04) shows outstanding comprehensive performance, especially on dielectric, mechanical and thermal properties. Specifically, the dielectric constant ( k ) and loss (tan δ ) at 1 MHz are reduced to 2.88 and 0.010 from 3.33 and 0.013. Meanwhile, the corresponding impact strength and flexural strength are improved to 18.75 KJ/m2 and 159.01 MPa, increased by 63.63 % and 27.29 %. In addition, BDEP-0.04 also exhibits the excellent thermal stability with glass transition temperature ( T g ) of 290 °C, which is 8 °C higher than BD resin. Based on the lower k and t a n δ value of BDEP-0.04 hybrid resin, as well as its better adhesion with silica fiber, the wave-transparent and mechanical properties of silica fiber reinforced composites (SF/BDEP-0.04) are further improved, showing that the wave transmission efficiency (94.2%), flexural strength (309.99 MPa), flexural modulus (15.70 GPa) and interlaminar shear strength (35.41 MPa) are all greatly higher than those of SF/BD. It’s concluded that EG-POSS is effective to optimize and balance the dielectric, mechanical and thermal properties of BD-type bismaleimide resin and SFs/BD composites, which is valuable for practical application in wave-transparent field. |
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Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber |
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| score |
7.4012136 |