Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber

Introducing porous materials into resin matrix is effective to achieve low dielectric constant (low- k ) value but challenge for simultaneously improving mechanical and thermal properties due to the heterogeneous dispersion of the...
Ausführliche Beschreibung

Gespeichert in:
Autor*in:

Zhang, Zongwu [verfasserIn]

Zhou, Yijie [verfasserIn]

Cai, Lifeng [verfasserIn]

Xuan, Lixin [verfasserIn]

Wu, Xiao [verfasserIn]

Ma, Xiaoyan [verfasserIn]

Format:

E-Artikel

Sprache:

Englisch

Erschienen:

2022

Schlagwörter:

BD-type bismaleimide resin

POSS

Eugenol

Silica fiber

Dielectric properties

Mechanical properties

Thermal stability

Übergeordnetes Werk:

Enthalten in: The chemical engineering journal - Amsterdam : Elsevier, 1997, 439

Übergeordnetes Werk:

volume:439

DOI / URN:

10.1016/j.cej.2022.135740

Katalog-ID:

ELV007705549

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