Mesoscale simulation of elastocaloric cooling in SMA films
A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localize...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Wendler, Frank [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2017transfer abstract |
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| Schlagwörter: |
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| Umfang: |
13 |
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| Übergeordnetes Werk: |
Enthalten in: Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. - Chauvet, Marcelle ELSEVIER, 2022, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:136 ; year:2017 ; day:1 ; month:09 ; pages:105-117 ; extent:13 |
| Links: |
|---|
| DOI / URN: |
10.1016/j.actamat.2017.06.044 |
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ELV020490763 |
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| 520 | |a A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. | ||
| 520 | |a A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. | ||
| 650 | 7 | |a Phase-field model |2 Elsevier | |
| 650 | 7 | |a Shape memory alloys |2 Elsevier | |
| 650 | 7 | |a Elastocaloric cooling |2 Elsevier | |
| 650 | 7 | |a Martensitic transition |2 Elsevier | |
| 700 | 1 | |a Ossmer, Hinnerk |4 oth | |
| 700 | 1 | |a Chluba, Christoph |4 oth | |
| 700 | 1 | |a Quandt, Eckhard |4 oth | |
| 700 | 1 | |a Kohl, Manfred |4 oth | |
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10.1016/j.actamat.2017.06.044 doi GBV00000000000260A.pica (DE-627)ELV020490763 (ELSEVIER)S1359-6454(17)30519-0 DE-627 ger DE-627 rakwb eng 670 670 DE-600 330 VZ Wendler, Frank verfasserin aut Mesoscale simulation of elastocaloric cooling in SMA films 2017transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. Phase-field model Elsevier Shape memory alloys Elsevier Elastocaloric cooling Elsevier Martensitic transition Elsevier Ossmer, Hinnerk oth Chluba, Christoph oth Quandt, Eckhard oth Kohl, Manfred oth Enthalten in Elsevier Science Chauvet, Marcelle ELSEVIER Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. 2022 Amsterdam [u.a.] (DE-627)ELV009239057 volume:136 year:2017 day:1 month:09 pages:105-117 extent:13 https://doi.org/10.1016/j.actamat.2017.06.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U AR 136 2017 1 0901 105-117 13 045F 670 |
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10.1016/j.actamat.2017.06.044 doi GBV00000000000260A.pica (DE-627)ELV020490763 (ELSEVIER)S1359-6454(17)30519-0 DE-627 ger DE-627 rakwb eng 670 670 DE-600 330 VZ Wendler, Frank verfasserin aut Mesoscale simulation of elastocaloric cooling in SMA films 2017transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. Phase-field model Elsevier Shape memory alloys Elsevier Elastocaloric cooling Elsevier Martensitic transition Elsevier Ossmer, Hinnerk oth Chluba, Christoph oth Quandt, Eckhard oth Kohl, Manfred oth Enthalten in Elsevier Science Chauvet, Marcelle ELSEVIER Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. 2022 Amsterdam [u.a.] (DE-627)ELV009239057 volume:136 year:2017 day:1 month:09 pages:105-117 extent:13 https://doi.org/10.1016/j.actamat.2017.06.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U AR 136 2017 1 0901 105-117 13 045F 670 |
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10.1016/j.actamat.2017.06.044 doi GBV00000000000260A.pica (DE-627)ELV020490763 (ELSEVIER)S1359-6454(17)30519-0 DE-627 ger DE-627 rakwb eng 670 670 DE-600 330 VZ Wendler, Frank verfasserin aut Mesoscale simulation of elastocaloric cooling in SMA films 2017transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. Phase-field model Elsevier Shape memory alloys Elsevier Elastocaloric cooling Elsevier Martensitic transition Elsevier Ossmer, Hinnerk oth Chluba, Christoph oth Quandt, Eckhard oth Kohl, Manfred oth Enthalten in Elsevier Science Chauvet, Marcelle ELSEVIER Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. 2022 Amsterdam [u.a.] (DE-627)ELV009239057 volume:136 year:2017 day:1 month:09 pages:105-117 extent:13 https://doi.org/10.1016/j.actamat.2017.06.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U AR 136 2017 1 0901 105-117 13 045F 670 |
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10.1016/j.actamat.2017.06.044 doi GBV00000000000260A.pica (DE-627)ELV020490763 (ELSEVIER)S1359-6454(17)30519-0 DE-627 ger DE-627 rakwb eng 670 670 DE-600 330 VZ Wendler, Frank verfasserin aut Mesoscale simulation of elastocaloric cooling in SMA films 2017transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. Phase-field model Elsevier Shape memory alloys Elsevier Elastocaloric cooling Elsevier Martensitic transition Elsevier Ossmer, Hinnerk oth Chluba, Christoph oth Quandt, Eckhard oth Kohl, Manfred oth Enthalten in Elsevier Science Chauvet, Marcelle ELSEVIER Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. 2022 Amsterdam [u.a.] (DE-627)ELV009239057 volume:136 year:2017 day:1 month:09 pages:105-117 extent:13 https://doi.org/10.1016/j.actamat.2017.06.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U AR 136 2017 1 0901 105-117 13 045F 670 |
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10.1016/j.actamat.2017.06.044 doi GBV00000000000260A.pica (DE-627)ELV020490763 (ELSEVIER)S1359-6454(17)30519-0 DE-627 ger DE-627 rakwb eng 670 670 DE-600 330 VZ Wendler, Frank verfasserin aut Mesoscale simulation of elastocaloric cooling in SMA films 2017transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. Phase-field model Elsevier Shape memory alloys Elsevier Elastocaloric cooling Elsevier Martensitic transition Elsevier Ossmer, Hinnerk oth Chluba, Christoph oth Quandt, Eckhard oth Kohl, Manfred oth Enthalten in Elsevier Science Chauvet, Marcelle ELSEVIER Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. 2022 Amsterdam [u.a.] (DE-627)ELV009239057 volume:136 year:2017 day:1 month:09 pages:105-117 extent:13 https://doi.org/10.1016/j.actamat.2017.06.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U AR 136 2017 1 0901 105-117 13 045F 670 |
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Enthalten in Nonlinear relationship between monetary policy and stock returns: Evidence from the U.S. Amsterdam [u.a.] volume:136 year:2017 day:1 month:09 pages:105-117 extent:13 |
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The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. 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mesoscale simulation of elastocaloric cooling in sma films |
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Mesoscale simulation of elastocaloric cooling in SMA films |
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A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. |
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A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. |
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A model for the evolution of the mechanical and thermal properties of shape memory alloy (SMA) films during elastocaloric cycling is developed and compared with experiments. The focus is on Ti-Ni-Cu-Co films of 20 μm thickness showing ultra-low fatigue properties. The films undergo a highly localized pseudoelastic transformation under tensile load cycling featuring strain and temperature band patterns that depend on the loading conditions. The corresponding temperature change is of special interest for film-based elastocaloric cooling applications. Starting from a thermodynamics-based Gibbs free energy model comprising mechanical and chemical contributions, we include a martensite-austenite interface free energy term, for which formulations from a phase-field model are adapted. A 3D continuum mechanics description is modified to treat plane stress conditions appropriate for polycrystalline thin films. The nucleation mechanism of strain bands under dynamic loading is described by introducing a spatial random distribution of the transformation stress barriers reflecting the degree of material inhomogeneity. Heat transfer due to conduction and convection is taken into account. The simulations predict the correlated mechanical and thermal local response of the films including band formation and evolution, tilt angle as well as strain-rate dependence. Macroscopic stress-strain characteristics and thermal evolution curves well represent the experimental results. |
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