Mechanical properties of low k SiO2 thin films templated by PVA
Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates an...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Niu, Chao [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2015transfer abstract |
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| Schlagwörter: |
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| Umfang: |
5 |
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| Übergeordnetes Werk: |
Enthalten in: Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration - Rey, F. ELSEVIER, 2018, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:41 ; year:2015 ; pages:365-369 ; extent:5 |
| Links: |
|---|
| DOI / URN: |
10.1016/j.ceramint.2015.03.242 |
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ELV023489642 |
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| 520 | |a Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. | ||
| 520 | |a Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. | ||
| 650 | 7 | |a Porous silica film |2 Elsevier | |
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10.1016/j.ceramint.2015.03.242 doi GBVA2015008000020.pica (DE-627)ELV023489642 (ELSEVIER)S0272-8842(15)00658-6 DE-627 ger DE-627 rakwb eng 670 670 DE-600 333.7 610 VZ 43.12 bkl 43.13 bkl 44.13 bkl Niu, Chao verfasserin aut Mechanical properties of low k SiO2 thin films templated by PVA 2015transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica film Elsevier Mechanical properties Elsevier Low-k Elsevier Wu, Xiaoqing oth Ren, Wei oth Chen, Xiaofeng oth Shi, Peng oth Enthalten in Elsevier Science Rey, F. ELSEVIER Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration 2018 Amsterdam [u.a.] (DE-627)ELV000899798 volume:41 year:2015 pages:365-369 extent:5 https://doi.org/10.1016/j.ceramint.2015.03.242 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA SSG-OPC-GGO 43.12 Umweltchemie VZ 43.13 Umwelttoxikologie VZ 44.13 Medizinische Ökologie VZ AR 41 2015 365-369 5 41.2015, S365-, (5 S.) 045F 670 |
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10.1016/j.ceramint.2015.03.242 doi GBVA2015008000020.pica (DE-627)ELV023489642 (ELSEVIER)S0272-8842(15)00658-6 DE-627 ger DE-627 rakwb eng 670 670 DE-600 333.7 610 VZ 43.12 bkl 43.13 bkl 44.13 bkl Niu, Chao verfasserin aut Mechanical properties of low k SiO2 thin films templated by PVA 2015transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica film Elsevier Mechanical properties Elsevier Low-k Elsevier Wu, Xiaoqing oth Ren, Wei oth Chen, Xiaofeng oth Shi, Peng oth Enthalten in Elsevier Science Rey, F. ELSEVIER Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration 2018 Amsterdam [u.a.] (DE-627)ELV000899798 volume:41 year:2015 pages:365-369 extent:5 https://doi.org/10.1016/j.ceramint.2015.03.242 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA SSG-OPC-GGO 43.12 Umweltchemie VZ 43.13 Umwelttoxikologie VZ 44.13 Medizinische Ökologie VZ AR 41 2015 365-369 5 41.2015, S365-, (5 S.) 045F 670 |
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10.1016/j.ceramint.2015.03.242 doi GBVA2015008000020.pica (DE-627)ELV023489642 (ELSEVIER)S0272-8842(15)00658-6 DE-627 ger DE-627 rakwb eng 670 670 DE-600 333.7 610 VZ 43.12 bkl 43.13 bkl 44.13 bkl Niu, Chao verfasserin aut Mechanical properties of low k SiO2 thin films templated by PVA 2015transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica film Elsevier Mechanical properties Elsevier Low-k Elsevier Wu, Xiaoqing oth Ren, Wei oth Chen, Xiaofeng oth Shi, Peng oth Enthalten in Elsevier Science Rey, F. ELSEVIER Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration 2018 Amsterdam [u.a.] (DE-627)ELV000899798 volume:41 year:2015 pages:365-369 extent:5 https://doi.org/10.1016/j.ceramint.2015.03.242 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA SSG-OPC-GGO 43.12 Umweltchemie VZ 43.13 Umwelttoxikologie VZ 44.13 Medizinische Ökologie VZ AR 41 2015 365-369 5 41.2015, S365-, (5 S.) 045F 670 |
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10.1016/j.ceramint.2015.03.242 doi GBVA2015008000020.pica (DE-627)ELV023489642 (ELSEVIER)S0272-8842(15)00658-6 DE-627 ger DE-627 rakwb eng 670 670 DE-600 333.7 610 VZ 43.12 bkl 43.13 bkl 44.13 bkl Niu, Chao verfasserin aut Mechanical properties of low k SiO2 thin films templated by PVA 2015transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica film Elsevier Mechanical properties Elsevier Low-k Elsevier Wu, Xiaoqing oth Ren, Wei oth Chen, Xiaofeng oth Shi, Peng oth Enthalten in Elsevier Science Rey, F. ELSEVIER Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration 2018 Amsterdam [u.a.] (DE-627)ELV000899798 volume:41 year:2015 pages:365-369 extent:5 https://doi.org/10.1016/j.ceramint.2015.03.242 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA SSG-OPC-GGO 43.12 Umweltchemie VZ 43.13 Umwelttoxikologie VZ 44.13 Medizinische Ökologie VZ AR 41 2015 365-369 5 41.2015, S365-, (5 S.) 045F 670 |
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10.1016/j.ceramint.2015.03.242 doi GBVA2015008000020.pica (DE-627)ELV023489642 (ELSEVIER)S0272-8842(15)00658-6 DE-627 ger DE-627 rakwb eng 670 670 DE-600 333.7 610 VZ 43.12 bkl 43.13 bkl 44.13 bkl Niu, Chao verfasserin aut Mechanical properties of low k SiO2 thin films templated by PVA 2015transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. Porous silica film Elsevier Mechanical properties Elsevier Low-k Elsevier Wu, Xiaoqing oth Ren, Wei oth Chen, Xiaofeng oth Shi, Peng oth Enthalten in Elsevier Science Rey, F. ELSEVIER Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration 2018 Amsterdam [u.a.] (DE-627)ELV000899798 volume:41 year:2015 pages:365-369 extent:5 https://doi.org/10.1016/j.ceramint.2015.03.242 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA SSG-OPC-GGO 43.12 Umweltchemie VZ 43.13 Umwelttoxikologie VZ 44.13 Medizinische Ökologie VZ AR 41 2015 365-369 5 41.2015, S365-, (5 S.) 045F 670 |
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Enthalten in Soil and water bioengineering: Practice and research needs for reconciling natural hazard control and ecological restoration Amsterdam [u.a.] volume:41 year:2015 pages:365-369 extent:5 |
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Mechanical properties of low k SiO2 thin films templated by PVA |
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Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. |
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Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. |
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Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method. Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with different degrees of polymerization as molecular template. The precursor was deposited on to coated platinum silicon substrates and annealed at different temperatures. The films were modified with trimethylchlodrosilane (TMCS) for hydrophobicity, which can make the porous films present a stable characteristic of low k. The effects of annealing temperature and polymerization degree of PVA on mechanical properties were investigated. Significant improvement occurred for the sample annealed at 700°C, the hardness and the Young modulus of the silica film templated by HPVA are 0.91GPa and 15.37GPa, respectively. These values are comparable with that of MOCVD low k silica sample. |
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