Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems
In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 2...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Benedetti, Andrea [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2016transfer abstract |
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| Schlagwörter: |
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| Umfang: |
11 |
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| Übergeordnetes Werk: |
Enthalten in: O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome - Barisic, N ELSEVIER, 2013, an international journal, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:89 ; year:2016 ; day:15 ; month:03 ; pages:219-229 ; extent:11 |
| Links: |
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| DOI / URN: |
10.1016/j.compositesb.2015.11.034 |
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| 245 | 1 | 0 | |a Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems |
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| 520 | |a In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. | ||
| 520 | |a In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. | ||
| 650 | 7 | |a A. Theromosetting resin |2 Elsevier | |
| 650 | 7 | |a A. Carbon fibre |2 Elsevier | |
| 650 | 7 | |a Near-surface mounted reinforcement |2 Elsevier | |
| 650 | 7 | |a B. Cure behaviour |2 Elsevier | |
| 650 | 7 | |a D. Non-destructive testing |2 Elsevier | |
| 700 | 1 | |a Fernandes, Pedro |4 oth | |
| 700 | 1 | |a Granja, José L. |4 oth | |
| 700 | 1 | |a Sena-Cruz, José |4 oth | |
| 700 | 1 | |a Azenha, Miguel |4 oth | |
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10.1016/j.compositesb.2015.11.034 doi GBVA2016019000028.pica (DE-627)ELV024806714 (ELSEVIER)S1359-8368(15)00718-0 DE-627 ger DE-627 rakwb eng 660 660 DE-600 610 VZ 580 540 VZ BIODIV DE-30 fid 42.00 bkl Benedetti, Andrea verfasserin aut Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems 2016transfer abstract 11 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. A. Theromosetting resin Elsevier A. Carbon fibre Elsevier Near-surface mounted reinforcement Elsevier B. Cure behaviour Elsevier D. Non-destructive testing Elsevier Fernandes, Pedro oth Granja, José L. oth Sena-Cruz, José oth Azenha, Miguel oth Enthalten in Elsevier Barisic, N ELSEVIER O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome 2013 an international journal Amsterdam [u.a.] (DE-627)ELV011782439 volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 https://doi.org/10.1016/j.compositesb.2015.11.034 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U FID-BIODIV SSG-OLC-PHA 42.00 Biologie: Allgemeines VZ AR 89 2016 15 0315 219-229 11 045F 660 |
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10.1016/j.compositesb.2015.11.034 doi GBVA2016019000028.pica (DE-627)ELV024806714 (ELSEVIER)S1359-8368(15)00718-0 DE-627 ger DE-627 rakwb eng 660 660 DE-600 610 VZ 580 540 VZ BIODIV DE-30 fid 42.00 bkl Benedetti, Andrea verfasserin aut Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems 2016transfer abstract 11 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. A. Theromosetting resin Elsevier A. Carbon fibre Elsevier Near-surface mounted reinforcement Elsevier B. Cure behaviour Elsevier D. Non-destructive testing Elsevier Fernandes, Pedro oth Granja, José L. oth Sena-Cruz, José oth Azenha, Miguel oth Enthalten in Elsevier Barisic, N ELSEVIER O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome 2013 an international journal Amsterdam [u.a.] (DE-627)ELV011782439 volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 https://doi.org/10.1016/j.compositesb.2015.11.034 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U FID-BIODIV SSG-OLC-PHA 42.00 Biologie: Allgemeines VZ AR 89 2016 15 0315 219-229 11 045F 660 |
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10.1016/j.compositesb.2015.11.034 doi GBVA2016019000028.pica (DE-627)ELV024806714 (ELSEVIER)S1359-8368(15)00718-0 DE-627 ger DE-627 rakwb eng 660 660 DE-600 610 VZ 580 540 VZ BIODIV DE-30 fid 42.00 bkl Benedetti, Andrea verfasserin aut Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems 2016transfer abstract 11 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. A. Theromosetting resin Elsevier A. Carbon fibre Elsevier Near-surface mounted reinforcement Elsevier B. Cure behaviour Elsevier D. Non-destructive testing Elsevier Fernandes, Pedro oth Granja, José L. oth Sena-Cruz, José oth Azenha, Miguel oth Enthalten in Elsevier Barisic, N ELSEVIER O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome 2013 an international journal Amsterdam [u.a.] (DE-627)ELV011782439 volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 https://doi.org/10.1016/j.compositesb.2015.11.034 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U FID-BIODIV SSG-OLC-PHA 42.00 Biologie: Allgemeines VZ AR 89 2016 15 0315 219-229 11 045F 660 |
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10.1016/j.compositesb.2015.11.034 doi GBVA2016019000028.pica (DE-627)ELV024806714 (ELSEVIER)S1359-8368(15)00718-0 DE-627 ger DE-627 rakwb eng 660 660 DE-600 610 VZ 580 540 VZ BIODIV DE-30 fid 42.00 bkl Benedetti, Andrea verfasserin aut Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems 2016transfer abstract 11 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. A. Theromosetting resin Elsevier A. Carbon fibre Elsevier Near-surface mounted reinforcement Elsevier B. Cure behaviour Elsevier D. Non-destructive testing Elsevier Fernandes, Pedro oth Granja, José L. oth Sena-Cruz, José oth Azenha, Miguel oth Enthalten in Elsevier Barisic, N ELSEVIER O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome 2013 an international journal Amsterdam [u.a.] (DE-627)ELV011782439 volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 https://doi.org/10.1016/j.compositesb.2015.11.034 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U FID-BIODIV SSG-OLC-PHA 42.00 Biologie: Allgemeines VZ AR 89 2016 15 0315 219-229 11 045F 660 |
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10.1016/j.compositesb.2015.11.034 doi GBVA2016019000028.pica (DE-627)ELV024806714 (ELSEVIER)S1359-8368(15)00718-0 DE-627 ger DE-627 rakwb eng 660 660 DE-600 610 VZ 580 540 VZ BIODIV DE-30 fid 42.00 bkl Benedetti, Andrea verfasserin aut Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems 2016transfer abstract 11 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. A. Theromosetting resin Elsevier A. Carbon fibre Elsevier Near-surface mounted reinforcement Elsevier B. Cure behaviour Elsevier D. Non-destructive testing Elsevier Fernandes, Pedro oth Granja, José L. oth Sena-Cruz, José oth Azenha, Miguel oth Enthalten in Elsevier Barisic, N ELSEVIER O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome 2013 an international journal Amsterdam [u.a.] (DE-627)ELV011782439 volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 https://doi.org/10.1016/j.compositesb.2015.11.034 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U FID-BIODIV SSG-OLC-PHA 42.00 Biologie: Allgemeines VZ AR 89 2016 15 0315 219-229 11 045F 660 |
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Enthalten in O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome Amsterdam [u.a.] volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 |
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Enthalten in O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome Amsterdam [u.a.] volume:89 year:2016 day:15 month:03 pages:219-229 extent:11 |
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O46 – 1548 Long term follow-up of clinical and neurographical abnormalities in eight Croatian patients with triple A syndrome |
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Benedetti, Andrea @@aut@@ Fernandes, Pedro @@oth@@ Granja, José L. @@oth@@ Sena-Cruz, José @@oth@@ Azenha, Miguel @@oth@@ |
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Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems |
| abstract |
In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. |
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In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. |
| abstract_unstemmed |
In NSM-CFRP installations, the mechanical behaviour of the strengthening system is strongly influenced by the epoxy adhesive, particularly at early ages. In the present work, the influence of temperature on the curing process of the epoxy was investigated. Three distinct temperatures were studied: 20, 30 and 40 °C. The elastic modulus of the adhesive was monitored through EMM-ARM (Elasticity Modulus Monitoring through Ambient Response Method). Direct pull-out tests with concrete specimens strengthened with NSM CFRP strips were carried out at the same three distinct temperatures to compare the evolution of bond performance with the E-modulus of epoxy since early ages. The results showed that increasing the curing temperature significantly accelerated both the curing process of the epoxy adhesive and the evolution of bond performance. The EMM-ARM technique has revealed its ability in clearly identifying the hardening kinetics of epoxy adhesives, allowing also thermal activation analysis. Finally, existing models for predicting temperature-dependent mechanical properties were extended to also describe the bond behaviour of NSM-CFRP applications. |
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