Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology
• We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature de...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhao, Libo [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2017 |
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| Schlagwörter: |
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| Umfang: |
13 |
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| Übergeordnetes Werk: |
Enthalten in: Antioxidant activity of propolis extracts from Serbia: A polarographic approach - 2012, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:264 ; year:2017 ; day:1 ; month:09 ; pages:63-75 ; extent:13 |
| Links: |
|---|
| DOI / URN: |
10.1016/j.sna.2017.07.044 |
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ELV030573106 |
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| 520 | |a • We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature decreases the thermal stresses and thermal deflection. • The main stress and deflection caused in the process of fabrication are analyzed through FEM. | ||
| 650 | 7 | |a Thermal stress |2 Elsevier | |
| 650 | 7 | |a Low temperature direct wafer-bonding |2 Elsevier | |
| 650 | 7 | |a Thermal deflection |2 Elsevier | |
| 650 | 7 | |a CMUTs |2 Elsevier | |
| 650 | 7 | |a Parasitic capacitance |2 Elsevier | |
| 700 | 1 | |a Li, Jie |4 oth | |
| 700 | 1 | |a Li, Zhikang |4 oth | |
| 700 | 1 | |a Zhang, Jiawang |4 oth | |
| 700 | 1 | |a Zhao, Yihe |4 oth | |
| 700 | 1 | |a Wang, Jiuhong |4 oth | |
| 700 | 1 | |a Xia, Yong |4 oth | |
| 700 | 1 | |a Li, Ping |4 oth | |
| 700 | 1 | |a Zhao, Yulong |4 oth | |
| 700 | 1 | |a Jiang, Zhuangde |4 oth | |
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10.1016/j.sna.2017.07.044 doi GBVA2017014000003.pica (DE-627)ELV030573106 (ELSEVIER)S0924-4247(17)30156-5 DE-627 ger DE-627 rakwb eng 530 620 530 DE-600 620 DE-600 630 VZ 640 VZ 610 VZ 530 620 VZ 52.56 bkl Zhao, Libo verfasserin aut Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology 2017 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier • We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature decreases the thermal stresses and thermal deflection. • The main stress and deflection caused in the process of fabrication are analyzed through FEM. Thermal stress Elsevier Low temperature direct wafer-bonding Elsevier Thermal deflection Elsevier CMUTs Elsevier Parasitic capacitance Elsevier Li, Jie oth Li, Zhikang oth Zhang, Jiawang oth Zhao, Yihe oth Wang, Jiuhong oth Xia, Yong oth Li, Ping oth Zhao, Yulong oth Jiang, Zhuangde oth Enthalten in Elsevier Science Antioxidant activity of propolis extracts from Serbia: A polarographic approach 2012 Amsterdam [u.a.] (DE-627)ELV01620638X volume:264 year:2017 day:1 month:09 pages:63-75 extent:13 https://doi.org/10.1016/j.sna.2017.07.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 52.56 Regenerative Energieformen alternative Energieformen VZ AR 264 2017 1 0901 63-75 13 045F 530 |
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10.1016/j.sna.2017.07.044 doi GBVA2017014000003.pica (DE-627)ELV030573106 (ELSEVIER)S0924-4247(17)30156-5 DE-627 ger DE-627 rakwb eng 530 620 530 DE-600 620 DE-600 630 VZ 640 VZ 610 VZ 530 620 VZ 52.56 bkl Zhao, Libo verfasserin aut Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology 2017 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier • We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature decreases the thermal stresses and thermal deflection. • The main stress and deflection caused in the process of fabrication are analyzed through FEM. Thermal stress Elsevier Low temperature direct wafer-bonding Elsevier Thermal deflection Elsevier CMUTs Elsevier Parasitic capacitance Elsevier Li, Jie oth Li, Zhikang oth Zhang, Jiawang oth Zhao, Yihe oth Wang, Jiuhong oth Xia, Yong oth Li, Ping oth Zhao, Yulong oth Jiang, Zhuangde oth Enthalten in Elsevier Science Antioxidant activity of propolis extracts from Serbia: A polarographic approach 2012 Amsterdam [u.a.] (DE-627)ELV01620638X volume:264 year:2017 day:1 month:09 pages:63-75 extent:13 https://doi.org/10.1016/j.sna.2017.07.044 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 52.56 Regenerative Energieformen alternative Energieformen VZ AR 264 2017 1 0901 63-75 13 045F 530 |
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fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-bonding technology |
| title_auth |
Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology |
| abstract |
• We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature decreases the thermal stresses and thermal deflection. • The main stress and deflection caused in the process of fabrication are analyzed through FEM. |
| abstractGer |
• We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature decreases the thermal stresses and thermal deflection. • The main stress and deflection caused in the process of fabrication are analyzed through FEM. |
| abstract_unstemmed |
• We present the first demonstration of fabrication of CMUTs less than 350°C. • The needed temperature reduces from 1050°C for previous technologies down to 350°C. • Characterization results of a prototype CMUT array show good performance and high uniformity. • The reduced fabrication temperature decreases the thermal stresses and thermal deflection. • The main stress and deflection caused in the process of fabrication are analyzed through FEM. |
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| title_short |
Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology |
| url |
https://doi.org/10.1016/j.sna.2017.07.044 |
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| author2 |
Li, Jie Li, Zhikang Zhang, Jiawang Zhao, Yihe Wang, Jiuhong Xia, Yong Li, Ping Zhao, Yulong Jiang, Zhuangde |
| author2Str |
Li, Jie Li, Zhikang Zhang, Jiawang Zhao, Yihe Wang, Jiuhong Xia, Yong Li, Ping Zhao, Yulong Jiang, Zhuangde |
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| doi_str |
10.1016/j.sna.2017.07.044 |
| up_date |
2024-07-06T17:55:27.308Z |
| _version_ |
1803853262812610560 |
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