Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations
• Electrothermal 3-D simulations of UIS tests of IGBTs are performed in PSPICE. • The approach relies on a circuit representation of both the electrical and the thermal problems. • The correlation between the shape of the avalanche curve and the UIS current distribution is analyzed. • The simulation...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
d’Alessandro, Vincenzo [verfasserIn] |
|---|
| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2013 |
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| Umfang: |
6 |
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| Übergeordnetes Werk: |
Enthalten in: Fixed-time neural control for output-constrained synchronization of second-order chaotic systems - Yao, Qijia ELSEVIER, 2023, Amsterdam [u.a.] |
|---|---|
| Übergeordnetes Werk: |
volume:53 ; year:2013 ; number:9 ; pages:1713-1718 ; extent:6 |
| Links: |
|---|
| DOI / URN: |
10.1016/j.microrel.2013.07.083 |
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ELV033564876 |
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| 520 | |a • Electrothermal 3-D simulations of UIS tests of IGBTs are performed in PSPICE. • The approach relies on a circuit representation of both the electrical and the thermal problems. • The correlation between the shape of the avalanche curve and the UIS current distribution is analyzed. • The simulation requires only 2minutes on a desktop PC. • Any dynamic behaviors of multicellular/multifinger power devices can be effectively investigated. | ||
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10.1016/j.microrel.2013.07.083 doi GBVA2013022000019.pica (DE-627)ELV033564876 (ELSEVIER)S0026-2714(13)00258-8 DE-627 ger DE-627 rakwb eng 620 620 DE-600 510 VZ 30.20 bkl 31.00 bkl d’Alessandro, Vincenzo verfasserin aut Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations 2013 6 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier • Electrothermal 3-D simulations of UIS tests of IGBTs are performed in PSPICE. • The approach relies on a circuit representation of both the electrical and the thermal problems. • The correlation between the shape of the avalanche curve and the UIS current distribution is analyzed. • The simulation requires only 2minutes on a desktop PC. • Any dynamic behaviors of multicellular/multifinger power devices can be effectively investigated. Magnani, Alessandro oth Riccio, Michele oth Iwahashi, Yohei oth Breglio, Giovanni oth Rinaldi, Niccolò oth Irace, Andrea oth Enthalten in Elsevier Yao, Qijia ELSEVIER Fixed-time neural control for output-constrained synchronization of second-order chaotic systems 2023 Amsterdam [u.a.] (DE-627)ELV009442901 volume:53 year:2013 number:9 pages:1713-1718 extent:6 https://doi.org/10.1016/j.microrel.2013.07.083 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OPC-MAT 30.20 Nichtlineare Dynamik VZ 31.00 Mathematik: Allgemeines VZ AR 53 2013 9 1713-1718 6 045F 620 |
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Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations |
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• Electrothermal 3-D simulations of UIS tests of IGBTs are performed in PSPICE. • The approach relies on a circuit representation of both the electrical and the thermal problems. • The correlation between the shape of the avalanche curve and the UIS current distribution is analyzed. • The simulation requires only 2minutes on a desktop PC. • Any dynamic behaviors of multicellular/multifinger power devices can be effectively investigated. |
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• Electrothermal 3-D simulations of UIS tests of IGBTs are performed in PSPICE. • The approach relies on a circuit representation of both the electrical and the thermal problems. • The correlation between the shape of the avalanche curve and the UIS current distribution is analyzed. • The simulation requires only 2minutes on a desktop PC. • Any dynamic behaviors of multicellular/multifinger power devices can be effectively investigated. |
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• Electrothermal 3-D simulations of UIS tests of IGBTs are performed in PSPICE. • The approach relies on a circuit representation of both the electrical and the thermal problems. • The correlation between the shape of the avalanche curve and the UIS current distribution is analyzed. • The simulation requires only 2minutes on a desktop PC. • Any dynamic behaviors of multicellular/multifinger power devices can be effectively investigated. |
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Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations |
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