Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers
A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation s...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Yupeng, Zhang [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2014transfer abstract |
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| Schlagwörter: |
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| Umfang: |
5 |
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| Übergeordnetes Werk: |
Enthalten in: SUSY effects in R b : Revisited under current experimental constraints - Su, Wei ELSEVIER, 2016transfer abstract, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:43 ; year:2014 ; number:11 ; pages:2597-2601 ; extent:5 |
| Links: |
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| DOI / URN: |
10.1016/S1875-5372(15)60009-1 |
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| Katalog-ID: |
ELV033888531 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | ELV033888531 | ||
| 003 | DE-627 | ||
| 005 | 20230625195320.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 180603s2014 xx |||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1016/S1875-5372(15)60009-1 |2 doi | |
| 028 | 5 | 2 | |a GBVA2014010000013.pica |
| 035 | |a (DE-627)ELV033888531 | ||
| 035 | |a (ELSEVIER)S1875-5372(15)60009-1 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | |a 670 | |
| 082 | 0 | 4 | |a 670 |q DE-600 |
| 082 | 0 | 4 | |a 530 |q VZ |
| 082 | 0 | 4 | |a 610 |q VZ |
| 084 | |a 77.50 |2 bkl | ||
| 100 | 1 | |a Yupeng, Zhang |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers |
| 264 | 1 | |c 2014transfer abstract | |
| 300 | |a 5 | ||
| 336 | |a nicht spezifiziert |b zzz |2 rdacontent | ||
| 337 | |a nicht spezifiziert |b z |2 rdamedia | ||
| 338 | |a nicht spezifiziert |b zu |2 rdacarrier | ||
| 520 | |a A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity | ||
| 520 | |a A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity | ||
| 650 | 7 | |a diamond |2 Elsevier | |
| 650 | 7 | |a intermetallic |2 Elsevier | |
| 650 | 7 | |a Al-Ni, self-propagation joining |2 Elsevier | |
| 650 | 7 | |a micro/nano-multilayers |2 Elsevier | |
| 700 | 1 | |a Jianglong, Yi |4 oth | |
| 700 | 1 | |a Ziyi, Luo |4 oth | |
| 700 | 1 | |a Lei, Xu |4 oth | |
| 700 | 1 | |a Hexing, Chen |4 oth | |
| 700 | 1 | |a Mingjiang, Dai |4 oth | |
| 773 | 0 | 8 | |i Enthalten in |n Elsevier |a Su, Wei ELSEVIER |t SUSY effects in R b : Revisited under current experimental constraints |d 2016transfer abstract |g Amsterdam [u.a.] |w (DE-627)ELV014078635 |
| 773 | 1 | 8 | |g volume:43 |g year:2014 |g number:11 |g pages:2597-2601 |g extent:5 |
| 856 | 4 | 0 | |u https://doi.org/10.1016/S1875-5372(15)60009-1 |3 Volltext |
| 912 | |a GBV_USEFLAG_U | ||
| 912 | |a GBV_ELV | ||
| 912 | |a SYSFLAG_U | ||
| 912 | |a SSG-OLC-PHA | ||
| 936 | b | k | |a 77.50 |j Psychophysiologie |q VZ |
| 951 | |a AR | ||
| 952 | |d 43 |j 2014 |e 11 |h 2597-2601 |g 5 | ||
| 953 | |2 045F |a 670 | ||
| author_variant |
z y zy |
|---|---|
| matchkey_str |
yupengzhangjianglongyiziyiluoleixuhexing:2014----:tutrliwtdodaodncpebnigihlii |
| hierarchy_sort_str |
2014transfer abstract |
| bklnumber |
77.50 |
| publishDate |
2014 |
| allfields |
10.1016/S1875-5372(15)60009-1 doi GBVA2014010000013.pica (DE-627)ELV033888531 (ELSEVIER)S1875-5372(15)60009-1 DE-627 ger DE-627 rakwb eng 670 670 DE-600 530 VZ 610 VZ 77.50 bkl Yupeng, Zhang verfasserin aut Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers 2014transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Elsevier Jianglong, Yi oth Ziyi, Luo oth Lei, Xu oth Hexing, Chen oth Mingjiang, Dai oth Enthalten in Elsevier Su, Wei ELSEVIER SUSY effects in R b : Revisited under current experimental constraints 2016transfer abstract Amsterdam [u.a.] (DE-627)ELV014078635 volume:43 year:2014 number:11 pages:2597-2601 extent:5 https://doi.org/10.1016/S1875-5372(15)60009-1 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 77.50 Psychophysiologie VZ AR 43 2014 11 2597-2601 5 045F 670 |
| spelling |
10.1016/S1875-5372(15)60009-1 doi GBVA2014010000013.pica (DE-627)ELV033888531 (ELSEVIER)S1875-5372(15)60009-1 DE-627 ger DE-627 rakwb eng 670 670 DE-600 530 VZ 610 VZ 77.50 bkl Yupeng, Zhang verfasserin aut Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers 2014transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Elsevier Jianglong, Yi oth Ziyi, Luo oth Lei, Xu oth Hexing, Chen oth Mingjiang, Dai oth Enthalten in Elsevier Su, Wei ELSEVIER SUSY effects in R b : Revisited under current experimental constraints 2016transfer abstract Amsterdam [u.a.] (DE-627)ELV014078635 volume:43 year:2014 number:11 pages:2597-2601 extent:5 https://doi.org/10.1016/S1875-5372(15)60009-1 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 77.50 Psychophysiologie VZ AR 43 2014 11 2597-2601 5 045F 670 |
| allfields_unstemmed |
10.1016/S1875-5372(15)60009-1 doi GBVA2014010000013.pica (DE-627)ELV033888531 (ELSEVIER)S1875-5372(15)60009-1 DE-627 ger DE-627 rakwb eng 670 670 DE-600 530 VZ 610 VZ 77.50 bkl Yupeng, Zhang verfasserin aut Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers 2014transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Elsevier Jianglong, Yi oth Ziyi, Luo oth Lei, Xu oth Hexing, Chen oth Mingjiang, Dai oth Enthalten in Elsevier Su, Wei ELSEVIER SUSY effects in R b : Revisited under current experimental constraints 2016transfer abstract Amsterdam [u.a.] (DE-627)ELV014078635 volume:43 year:2014 number:11 pages:2597-2601 extent:5 https://doi.org/10.1016/S1875-5372(15)60009-1 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 77.50 Psychophysiologie VZ AR 43 2014 11 2597-2601 5 045F 670 |
| allfieldsGer |
10.1016/S1875-5372(15)60009-1 doi GBVA2014010000013.pica (DE-627)ELV033888531 (ELSEVIER)S1875-5372(15)60009-1 DE-627 ger DE-627 rakwb eng 670 670 DE-600 530 VZ 610 VZ 77.50 bkl Yupeng, Zhang verfasserin aut Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers 2014transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Elsevier Jianglong, Yi oth Ziyi, Luo oth Lei, Xu oth Hexing, Chen oth Mingjiang, Dai oth Enthalten in Elsevier Su, Wei ELSEVIER SUSY effects in R b : Revisited under current experimental constraints 2016transfer abstract Amsterdam [u.a.] (DE-627)ELV014078635 volume:43 year:2014 number:11 pages:2597-2601 extent:5 https://doi.org/10.1016/S1875-5372(15)60009-1 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 77.50 Psychophysiologie VZ AR 43 2014 11 2597-2601 5 045F 670 |
| allfieldsSound |
10.1016/S1875-5372(15)60009-1 doi GBVA2014010000013.pica (DE-627)ELV033888531 (ELSEVIER)S1875-5372(15)60009-1 DE-627 ger DE-627 rakwb eng 670 670 DE-600 530 VZ 610 VZ 77.50 bkl Yupeng, Zhang verfasserin aut Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers 2014transfer abstract 5 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Elsevier Jianglong, Yi oth Ziyi, Luo oth Lei, Xu oth Hexing, Chen oth Mingjiang, Dai oth Enthalten in Elsevier Su, Wei ELSEVIER SUSY effects in R b : Revisited under current experimental constraints 2016transfer abstract Amsterdam [u.a.] (DE-627)ELV014078635 volume:43 year:2014 number:11 pages:2597-2601 extent:5 https://doi.org/10.1016/S1875-5372(15)60009-1 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 77.50 Psychophysiologie VZ AR 43 2014 11 2597-2601 5 045F 670 |
| language |
English |
| source |
Enthalten in SUSY effects in R b : Revisited under current experimental constraints Amsterdam [u.a.] volume:43 year:2014 number:11 pages:2597-2601 extent:5 |
| sourceStr |
Enthalten in SUSY effects in R b : Revisited under current experimental constraints Amsterdam [u.a.] volume:43 year:2014 number:11 pages:2597-2601 extent:5 |
| format_phy_str_mv |
Article |
| bklname |
Psychophysiologie |
| institution |
findex.gbv.de |
| topic_facet |
diamond intermetallic Al-Ni, self-propagation joining micro/nano-multilayers |
| dewey-raw |
670 |
| isfreeaccess_bool |
false |
| container_title |
SUSY effects in R b : Revisited under current experimental constraints |
| authorswithroles_txt_mv |
Yupeng, Zhang @@aut@@ Jianglong, Yi @@oth@@ Ziyi, Luo @@oth@@ Lei, Xu @@oth@@ Hexing, Chen @@oth@@ Mingjiang, Dai @@oth@@ |
| publishDateDaySort_date |
2014-01-01T00:00:00Z |
| hierarchy_top_id |
ELV014078635 |
| dewey-sort |
3670 |
| id |
ELV033888531 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV033888531</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230625195320.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">180603s2014 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/S1875-5372(15)60009-1</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">GBVA2014010000013.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV033888531</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S1875-5372(15)60009-1</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">670</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">DE-600</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">530</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">610</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">77.50</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Yupeng, Zhang</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2014transfer abstract</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">5</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">diamond</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">intermetallic</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Al-Ni, self-propagation joining</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">micro/nano-multilayers</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Jianglong, Yi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ziyi, Luo</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lei, Xu</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Hexing, Chen</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Mingjiang, Dai</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">Elsevier</subfield><subfield code="a">Su, Wei ELSEVIER</subfield><subfield code="t">SUSY effects in R b : Revisited under current experimental constraints</subfield><subfield code="d">2016transfer abstract</subfield><subfield code="g">Amsterdam [u.a.]</subfield><subfield code="w">(DE-627)ELV014078635</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:43</subfield><subfield code="g">year:2014</subfield><subfield code="g">number:11</subfield><subfield code="g">pages:2597-2601</subfield><subfield code="g">extent:5</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/S1875-5372(15)60009-1</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">77.50</subfield><subfield code="j">Psychophysiologie</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">43</subfield><subfield code="j">2014</subfield><subfield code="e">11</subfield><subfield code="h">2597-2601</subfield><subfield code="g">5</subfield></datafield><datafield tag="953" ind1=" " ind2=" "><subfield code="2">045F</subfield><subfield code="a">670</subfield></datafield></record></collection>
|
| author |
Yupeng, Zhang |
| spellingShingle |
Yupeng, Zhang ddc 670 ddc 530 ddc 610 bkl 77.50 Elsevier diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers |
| authorStr |
Yupeng, Zhang |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)ELV014078635 |
| format |
electronic Article |
| dewey-ones |
670 - Manufacturing 530 - Physics 610 - Medicine & health |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
elsevier |
| remote_str |
true |
| illustrated |
Not Illustrated |
| topic_title |
670 670 DE-600 530 VZ 610 VZ 77.50 bkl Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers Elsevier |
| topic |
ddc 670 ddc 530 ddc 610 bkl 77.50 Elsevier diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers |
| topic_unstemmed |
ddc 670 ddc 530 ddc 610 bkl 77.50 Elsevier diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers |
| topic_browse |
ddc 670 ddc 530 ddc 610 bkl 77.50 Elsevier diamond Elsevier intermetallic Elsevier Al-Ni, self-propagation joining Elsevier micro/nano-multilayers |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
zu |
| author2_variant |
y j yj l z lz x l xl c h ch d m dm |
| hierarchy_parent_title |
SUSY effects in R b : Revisited under current experimental constraints |
| hierarchy_parent_id |
ELV014078635 |
| dewey-tens |
670 - Manufacturing 530 - Physics 610 - Medicine & health |
| hierarchy_top_title |
SUSY effects in R b : Revisited under current experimental constraints |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)ELV014078635 |
| title |
Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers |
| ctrlnum |
(DE-627)ELV033888531 (ELSEVIER)S1875-5372(15)60009-1 |
| title_full |
Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers |
| author_sort |
Yupeng, Zhang |
| journal |
SUSY effects in R b : Revisited under current experimental constraints |
| journalStr |
SUSY effects in R b : Revisited under current experimental constraints |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology 500 - Science |
| recordtype |
marc |
| publishDateSort |
2014 |
| contenttype_str_mv |
zzz |
| container_start_page |
2597 |
| author_browse |
Yupeng, Zhang |
| container_volume |
43 |
| physical |
5 |
| class |
670 670 DE-600 530 VZ 610 VZ 77.50 bkl |
| format_se |
Elektronische Aufsätze |
| author-letter |
Yupeng, Zhang |
| doi_str_mv |
10.1016/S1875-5372(15)60009-1 |
| dewey-full |
670 530 610 |
| title_sort |
structural view study on diamond and copper bonding with alni micro/nano multilayers |
| title_auth |
Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers |
| abstract |
A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity |
| abstractGer |
A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity |
| abstract_unstemmed |
A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity |
| collection_details |
GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA |
| container_issue |
11 |
| title_short |
Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers |
| url |
https://doi.org/10.1016/S1875-5372(15)60009-1 |
| remote_bool |
true |
| author2 |
Jianglong, Yi Ziyi, Luo Lei, Xu Hexing, Chen Mingjiang, Dai |
| author2Str |
Jianglong, Yi Ziyi, Luo Lei, Xu Hexing, Chen Mingjiang, Dai |
| ppnlink |
ELV014078635 |
| mediatype_str_mv |
z |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth oth oth |
| doi_str |
10.1016/S1875-5372(15)60009-1 |
| up_date |
2024-07-06T19:44:05.105Z |
| _version_ |
1803860097216020480 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV033888531</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230625195320.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">180603s2014 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/S1875-5372(15)60009-1</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">GBVA2014010000013.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV033888531</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S1875-5372(15)60009-1</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">670</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">DE-600</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">530</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">610</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">77.50</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Yupeng, Zhang</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2014transfer abstract</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">5</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">diamond</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">intermetallic</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Al-Ni, self-propagation joining</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">micro/nano-multilayers</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Jianglong, Yi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ziyi, Luo</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lei, Xu</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Hexing, Chen</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Mingjiang, Dai</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">Elsevier</subfield><subfield code="a">Su, Wei ELSEVIER</subfield><subfield code="t">SUSY effects in R b : Revisited under current experimental constraints</subfield><subfield code="d">2016transfer abstract</subfield><subfield code="g">Amsterdam [u.a.]</subfield><subfield code="w">(DE-627)ELV014078635</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:43</subfield><subfield code="g">year:2014</subfield><subfield code="g">number:11</subfield><subfield code="g">pages:2597-2601</subfield><subfield code="g">extent:5</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/S1875-5372(15)60009-1</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">77.50</subfield><subfield code="j">Psychophysiologie</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">43</subfield><subfield code="j">2014</subfield><subfield code="e">11</subfield><subfield code="h">2597-2601</subfield><subfield code="g">5</subfield></datafield><datafield tag="953" ind1=" " ind2=" "><subfield code="2">045F</subfield><subfield code="a">670</subfield></datafield></record></collection>
|
| score |
7.4014387 |