Comparison of transparent objects metrology through diamond cutting edge radii measurements
The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Akbari, Mansur [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2016transfer abstract |
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| Schlagwörter: |
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| Umfang: |
13 |
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| Übergeordnetes Werk: |
Enthalten in: Identification of genetic characterization and volatile compounds of Tricholoma matsutake from different geographical origins - 2012transfer abstract, CIRP-JMST, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:13 ; year:2016 ; pages:72-84 ; extent:13 |
| Links: |
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| DOI / URN: |
10.1016/j.cirpj.2015.12.001 |
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ELV040044106 |
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| 520 | |a The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. | ||
| 520 | |a The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. | ||
| 650 | 7 | |a Measurement uncertainty |2 Elsevier | |
| 650 | 7 | |a Diamond measurement |2 Elsevier | |
| 650 | 7 | |a Metrology |2 Elsevier | |
| 650 | 7 | |a Cutting edge radius |2 Elsevier | |
| 650 | 7 | |a Comparison of metrology |2 Elsevier | |
| 650 | 7 | |a Transparent objects |2 Elsevier | |
| 700 | 1 | |a Knapp, Wolfgang |4 oth | |
| 700 | 1 | |a Wegener, Konrad |4 oth | |
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10.1016/j.cirpj.2015.12.001 doi GBVA2016009000003.pica (DE-627)ELV040044106 (ELSEVIER)S1755-5817(15)00074-7 DE-627 ger DE-627 rakwb eng 600 600 DE-600 570 VZ 150 VZ Akbari, Mansur verfasserin aut Comparison of transparent objects metrology through diamond cutting edge radii measurements 2016transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. Measurement uncertainty Elsevier Diamond measurement Elsevier Metrology Elsevier Cutting edge radius Elsevier Comparison of metrology Elsevier Transparent objects Elsevier Knapp, Wolfgang oth Wegener, Konrad oth Enthalten in Elsevier Identification of genetic characterization and volatile compounds of Tricholoma matsutake from different geographical origins 2012transfer abstract CIRP-JMST Amsterdam [u.a.] (DE-627)ELV026452936 volume:13 year:2016 pages:72-84 extent:13 https://doi.org/10.1016/j.cirpj.2015.12.001 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_21 GBV_ILN_26 GBV_ILN_72 GBV_ILN_252 AR 13 2016 72-84 13 045F 600 |
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10.1016/j.cirpj.2015.12.001 doi GBVA2016009000003.pica (DE-627)ELV040044106 (ELSEVIER)S1755-5817(15)00074-7 DE-627 ger DE-627 rakwb eng 600 600 DE-600 570 VZ 150 VZ Akbari, Mansur verfasserin aut Comparison of transparent objects metrology through diamond cutting edge radii measurements 2016transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. Measurement uncertainty Elsevier Diamond measurement Elsevier Metrology Elsevier Cutting edge radius Elsevier Comparison of metrology Elsevier Transparent objects Elsevier Knapp, Wolfgang oth Wegener, Konrad oth Enthalten in Elsevier Identification of genetic characterization and volatile compounds of Tricholoma matsutake from different geographical origins 2012transfer abstract CIRP-JMST Amsterdam [u.a.] (DE-627)ELV026452936 volume:13 year:2016 pages:72-84 extent:13 https://doi.org/10.1016/j.cirpj.2015.12.001 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_21 GBV_ILN_26 GBV_ILN_72 GBV_ILN_252 AR 13 2016 72-84 13 045F 600 |
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10.1016/j.cirpj.2015.12.001 doi GBVA2016009000003.pica (DE-627)ELV040044106 (ELSEVIER)S1755-5817(15)00074-7 DE-627 ger DE-627 rakwb eng 600 600 DE-600 570 VZ 150 VZ Akbari, Mansur verfasserin aut Comparison of transparent objects metrology through diamond cutting edge radii measurements 2016transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. Measurement uncertainty Elsevier Diamond measurement Elsevier Metrology Elsevier Cutting edge radius Elsevier Comparison of metrology Elsevier Transparent objects Elsevier Knapp, Wolfgang oth Wegener, Konrad oth Enthalten in Elsevier Identification of genetic characterization and volatile compounds of Tricholoma matsutake from different geographical origins 2012transfer abstract CIRP-JMST Amsterdam [u.a.] (DE-627)ELV026452936 volume:13 year:2016 pages:72-84 extent:13 https://doi.org/10.1016/j.cirpj.2015.12.001 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_21 GBV_ILN_26 GBV_ILN_72 GBV_ILN_252 AR 13 2016 72-84 13 045F 600 |
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10.1016/j.cirpj.2015.12.001 doi GBVA2016009000003.pica (DE-627)ELV040044106 (ELSEVIER)S1755-5817(15)00074-7 DE-627 ger DE-627 rakwb eng 600 600 DE-600 570 VZ 150 VZ Akbari, Mansur verfasserin aut Comparison of transparent objects metrology through diamond cutting edge radii measurements 2016transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. Measurement uncertainty Elsevier Diamond measurement Elsevier Metrology Elsevier Cutting edge radius Elsevier Comparison of metrology Elsevier Transparent objects Elsevier Knapp, Wolfgang oth Wegener, Konrad oth Enthalten in Elsevier Identification of genetic characterization and volatile compounds of Tricholoma matsutake from different geographical origins 2012transfer abstract CIRP-JMST Amsterdam [u.a.] (DE-627)ELV026452936 volume:13 year:2016 pages:72-84 extent:13 https://doi.org/10.1016/j.cirpj.2015.12.001 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_21 GBV_ILN_26 GBV_ILN_72 GBV_ILN_252 AR 13 2016 72-84 13 045F 600 |
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10.1016/j.cirpj.2015.12.001 doi GBVA2016009000003.pica (DE-627)ELV040044106 (ELSEVIER)S1755-5817(15)00074-7 DE-627 ger DE-627 rakwb eng 600 600 DE-600 570 VZ 150 VZ Akbari, Mansur verfasserin aut Comparison of transparent objects metrology through diamond cutting edge radii measurements 2016transfer abstract 13 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. Measurement uncertainty Elsevier Diamond measurement Elsevier Metrology Elsevier Cutting edge radius Elsevier Comparison of metrology Elsevier Transparent objects Elsevier Knapp, Wolfgang oth Wegener, Konrad oth Enthalten in Elsevier Identification of genetic characterization and volatile compounds of Tricholoma matsutake from different geographical origins 2012transfer abstract CIRP-JMST Amsterdam [u.a.] (DE-627)ELV026452936 volume:13 year:2016 pages:72-84 extent:13 https://doi.org/10.1016/j.cirpj.2015.12.001 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_21 GBV_ILN_26 GBV_ILN_72 GBV_ILN_252 AR 13 2016 72-84 13 045F 600 |
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Comparison of transparent objects metrology through diamond cutting edge radii measurements |
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The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. |
| abstractGer |
The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. |
| abstract_unstemmed |
The efficiency of cutting is largely influenced by cutting edge radii. When considering the correct cutting edge radius in the simulations, correct cutting characteristics can be predicted and thus the cutting process optimized. Sharpening the cutting edge of the tool to a specific optimized radius subsequently will improve the service life of the tool, workpiece quality, and performance of cutting. Measuring cutting edge radii of tools already is challenging, especially when measuring cutting edge radii of diamonds cutting tools because of their transparency and their dimension in the micrometer range. Defining a sound framework for selecting the appropriate metrology of transparent objects and clarifying the correct measurement parameters, settings, and proper sample preparation are the main achievement of current work. Tactile profilometer, confocal and focus variation light microscopy, imprinting, scanning electron microscopy (SEM) stereoscopy, and atomic force microscopy (AFM) are used to measure the cutting edge radius of diamonds. The identification of the cutting edge radii are done based on the methodology of the least square circle fit over cutting edge radius, and is determined iteratively. Estimations of uncertainties of the measurements are explained in detail and compared. The same measurement techniques and methodologies can also be applied to measure other transparent or difficult to measure materials. The results of different measurement technologies for the same diamond specimens are compared. In the end, one choice from the utilized measurement methods is suggested based on Analytic Hierarchy Process (AHP), which is one of the methods in Multiple Criteria Decision Analysis (MCDA). The selection process and the proposed set of evaluation criteria can also be applied to other measurements. |
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