High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging
With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was pr...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Cai, Zhiyong [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2018transfer abstract |
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| Umfang: |
7 |
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| Übergeordnetes Werk: |
Enthalten in: Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) - Cutts, Joshua ELSEVIER, 2021, Amsterdam |
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| Übergeordnetes Werk: |
volume:728 ; year:2018 ; day:13 ; month:06 ; pages:95-101 ; extent:7 |
| Links: |
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| DOI / URN: |
10.1016/j.msea.2018.05.020 |
|---|
| Katalog-ID: |
ELV043237819 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | ELV043237819 | ||
| 003 | DE-627 | ||
| 005 | 20230626003401.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 180726s2018 xx |||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1016/j.msea.2018.05.020 |2 doi | |
| 028 | 5 | 2 | |a /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica |
| 035 | |a (DE-627)ELV043237819 | ||
| 035 | |a (ELSEVIER)S0921-5093(18)30669-5 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 570 |q VZ |
| 100 | 1 | |a Cai, Zhiyong |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging |
| 264 | 1 | |c 2018transfer abstract | |
| 300 | |a 7 | ||
| 336 | |a nicht spezifiziert |b zzz |2 rdacontent | ||
| 337 | |a nicht spezifiziert |b z |2 rdamedia | ||
| 338 | |a nicht spezifiziert |b zu |2 rdacarrier | ||
| 520 | |a With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. | ||
| 520 | |a With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. | ||
| 650 | 7 | |a Thermal conductivity |2 Elsevier | |
| 650 | 7 | |a Aluminum silicon alloy |2 Elsevier | |
| 650 | 7 | |a Tensile property |2 Elsevier | |
| 650 | 7 | |a Microstructure |2 Elsevier | |
| 650 | 7 | |a Thermal cycling |2 Elsevier | |
| 700 | 1 | |a Zhang, Chun |4 oth | |
| 700 | 1 | |a Wang, Richu |4 oth | |
| 700 | 1 | |a Peng, Chaoqun |4 oth | |
| 700 | 1 | |a Wu, Xiang |4 oth | |
| 700 | 1 | |a Li, Haipu |4 oth | |
| 773 | 0 | 8 | |i Enthalten in |n Elsevier |a Cutts, Joshua ELSEVIER |t Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) |d 2021 |g Amsterdam |w (DE-627)ELV007117167 |
| 773 | 1 | 8 | |g volume:728 |g year:2018 |g day:13 |g month:06 |g pages:95-101 |g extent:7 |
| 856 | 4 | 0 | |u https://doi.org/10.1016/j.msea.2018.05.020 |3 Volltext |
| 912 | |a GBV_USEFLAG_U | ||
| 912 | |a GBV_ELV | ||
| 912 | |a SYSFLAG_U | ||
| 912 | |a SSG-OLC-PHA | ||
| 951 | |a AR | ||
| 952 | |d 728 |j 2018 |b 13 |c 0613 |h 95-101 |g 7 | ||
| author_variant |
z c zc |
|---|---|
| matchkey_str |
caizhiyongzhangchunwangrichupengchaoqunw:2018----:iheprtrmcaiapoeteadhraccigtbltoa5sal |
| hierarchy_sort_str |
2018transfer abstract |
| publishDate |
2018 |
| allfields |
10.1016/j.msea.2018.05.020 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica (DE-627)ELV043237819 (ELSEVIER)S0921-5093(18)30669-5 DE-627 ger DE-627 rakwb eng 570 VZ Cai, Zhiyong verfasserin aut High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging 2018transfer abstract 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling Elsevier Zhang, Chun oth Wang, Richu oth Peng, Chaoqun oth Wu, Xiang oth Li, Haipu oth Enthalten in Elsevier Cutts, Joshua ELSEVIER Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) 2021 Amsterdam (DE-627)ELV007117167 volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 https://doi.org/10.1016/j.msea.2018.05.020 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA AR 728 2018 13 0613 95-101 7 |
| spelling |
10.1016/j.msea.2018.05.020 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica (DE-627)ELV043237819 (ELSEVIER)S0921-5093(18)30669-5 DE-627 ger DE-627 rakwb eng 570 VZ Cai, Zhiyong verfasserin aut High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging 2018transfer abstract 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling Elsevier Zhang, Chun oth Wang, Richu oth Peng, Chaoqun oth Wu, Xiang oth Li, Haipu oth Enthalten in Elsevier Cutts, Joshua ELSEVIER Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) 2021 Amsterdam (DE-627)ELV007117167 volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 https://doi.org/10.1016/j.msea.2018.05.020 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA AR 728 2018 13 0613 95-101 7 |
| allfields_unstemmed |
10.1016/j.msea.2018.05.020 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica (DE-627)ELV043237819 (ELSEVIER)S0921-5093(18)30669-5 DE-627 ger DE-627 rakwb eng 570 VZ Cai, Zhiyong verfasserin aut High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging 2018transfer abstract 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling Elsevier Zhang, Chun oth Wang, Richu oth Peng, Chaoqun oth Wu, Xiang oth Li, Haipu oth Enthalten in Elsevier Cutts, Joshua ELSEVIER Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) 2021 Amsterdam (DE-627)ELV007117167 volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 https://doi.org/10.1016/j.msea.2018.05.020 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA AR 728 2018 13 0613 95-101 7 |
| allfieldsGer |
10.1016/j.msea.2018.05.020 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica (DE-627)ELV043237819 (ELSEVIER)S0921-5093(18)30669-5 DE-627 ger DE-627 rakwb eng 570 VZ Cai, Zhiyong verfasserin aut High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging 2018transfer abstract 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling Elsevier Zhang, Chun oth Wang, Richu oth Peng, Chaoqun oth Wu, Xiang oth Li, Haipu oth Enthalten in Elsevier Cutts, Joshua ELSEVIER Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) 2021 Amsterdam (DE-627)ELV007117167 volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 https://doi.org/10.1016/j.msea.2018.05.020 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA AR 728 2018 13 0613 95-101 7 |
| allfieldsSound |
10.1016/j.msea.2018.05.020 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica (DE-627)ELV043237819 (ELSEVIER)S0921-5093(18)30669-5 DE-627 ger DE-627 rakwb eng 570 VZ Cai, Zhiyong verfasserin aut High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging 2018transfer abstract 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling Elsevier Zhang, Chun oth Wang, Richu oth Peng, Chaoqun oth Wu, Xiang oth Li, Haipu oth Enthalten in Elsevier Cutts, Joshua ELSEVIER Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) 2021 Amsterdam (DE-627)ELV007117167 volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 https://doi.org/10.1016/j.msea.2018.05.020 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA AR 728 2018 13 0613 95-101 7 |
| language |
English |
| source |
Enthalten in Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) Amsterdam volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 |
| sourceStr |
Enthalten in Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) Amsterdam volume:728 year:2018 day:13 month:06 pages:95-101 extent:7 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Thermal conductivity Aluminum silicon alloy Tensile property Microstructure Thermal cycling |
| dewey-raw |
570 |
| isfreeaccess_bool |
false |
| container_title |
Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) |
| authorswithroles_txt_mv |
Cai, Zhiyong @@aut@@ Zhang, Chun @@oth@@ Wang, Richu @@oth@@ Peng, Chaoqun @@oth@@ Wu, Xiang @@oth@@ Li, Haipu @@oth@@ |
| publishDateDaySort_date |
2018-01-13T00:00:00Z |
| hierarchy_top_id |
ELV007117167 |
| dewey-sort |
3570 |
| id |
ELV043237819 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV043237819</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230626003401.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">180726s2018 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/j.msea.2018.05.020</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">/cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV043237819</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S0921-5093(18)30669-5</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">570</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Cai, Zhiyong</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2018transfer abstract</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">7</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thermal conductivity</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Aluminum silicon alloy</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Tensile property</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microstructure</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thermal cycling</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhang, Chun</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wang, Richu</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Peng, Chaoqun</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, Xiang</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Li, Haipu</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">Elsevier</subfield><subfield code="a">Cutts, Joshua ELSEVIER</subfield><subfield code="t">Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2)</subfield><subfield code="d">2021</subfield><subfield code="g">Amsterdam</subfield><subfield code="w">(DE-627)ELV007117167</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:728</subfield><subfield code="g">year:2018</subfield><subfield code="g">day:13</subfield><subfield code="g">month:06</subfield><subfield code="g">pages:95-101</subfield><subfield code="g">extent:7</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/j.msea.2018.05.020</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">728</subfield><subfield code="j">2018</subfield><subfield code="b">13</subfield><subfield code="c">0613</subfield><subfield code="h">95-101</subfield><subfield code="g">7</subfield></datafield></record></collection>
|
| author |
Cai, Zhiyong |
| spellingShingle |
Cai, Zhiyong ddc 570 Elsevier Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging |
| authorStr |
Cai, Zhiyong |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)ELV007117167 |
| format |
electronic Article |
| dewey-ones |
570 - Life sciences; biology |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
elsevier |
| remote_str |
true |
| illustrated |
Not Illustrated |
| topic_title |
570 VZ High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling Elsevier |
| topic |
ddc 570 Elsevier Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling |
| topic_unstemmed |
ddc 570 Elsevier Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling |
| topic_browse |
ddc 570 Elsevier Thermal conductivity Elsevier Aluminum silicon alloy Elsevier Tensile property Elsevier Microstructure Elsevier Thermal cycling |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
zu |
| author2_variant |
c z cz r w rw c p cp x w xw h l hl |
| hierarchy_parent_title |
Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) |
| hierarchy_parent_id |
ELV007117167 |
| dewey-tens |
570 - Life sciences; biology |
| hierarchy_top_title |
Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)ELV007117167 |
| title |
High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging |
| ctrlnum |
(DE-627)ELV043237819 (ELSEVIER)S0921-5093(18)30669-5 |
| title_full |
High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging |
| author_sort |
Cai, Zhiyong |
| journal |
Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) |
| journalStr |
Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2) |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
500 - Science |
| recordtype |
marc |
| publishDateSort |
2018 |
| contenttype_str_mv |
zzz |
| container_start_page |
95 |
| author_browse |
Cai, Zhiyong |
| container_volume |
728 |
| physical |
7 |
| class |
570 VZ |
| format_se |
Elektronische Aufsätze |
| author-letter |
Cai, Zhiyong |
| doi_str_mv |
10.1016/j.msea.2018.05.020 |
| dewey-full |
570 |
| title_sort |
high-temperature mechanical properties and thermal cycling stability of al-50si alloy for electronic packaging |
| title_auth |
High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging |
| abstract |
With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. |
| abstractGer |
With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. |
| abstract_unstemmed |
With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress. |
| collection_details |
GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA |
| title_short |
High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging |
| url |
https://doi.org/10.1016/j.msea.2018.05.020 |
| remote_bool |
true |
| author2 |
Zhang, Chun Wang, Richu Peng, Chaoqun Wu, Xiang Li, Haipu |
| author2Str |
Zhang, Chun Wang, Richu Peng, Chaoqun Wu, Xiang Li, Haipu |
| ppnlink |
ELV007117167 |
| mediatype_str_mv |
z |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth oth oth |
| doi_str |
10.1016/j.msea.2018.05.020 |
| up_date |
2024-07-06T18:17:58.416Z |
| _version_ |
1803854679552032768 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV043237819</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230626003401.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">180726s2018 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/j.msea.2018.05.020</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">/cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000000866.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV043237819</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S0921-5093(18)30669-5</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">570</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Cai, Zhiyong</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2018transfer abstract</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">7</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thermal conductivity</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Aluminum silicon alloy</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Tensile property</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microstructure</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thermal cycling</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhang, Chun</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wang, Richu</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Peng, Chaoqun</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, Xiang</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Li, Haipu</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">Elsevier</subfield><subfield code="a">Cutts, Joshua ELSEVIER</subfield><subfield code="t">Generation of 3X FLAG-tagged human embryonic stem cell (hESC) line to study WNT-induced β-catenin DNA interactions (HVRDe009-A-2)</subfield><subfield code="d">2021</subfield><subfield code="g">Amsterdam</subfield><subfield code="w">(DE-627)ELV007117167</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:728</subfield><subfield code="g">year:2018</subfield><subfield code="g">day:13</subfield><subfield code="g">month:06</subfield><subfield code="g">pages:95-101</subfield><subfield code="g">extent:7</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/j.msea.2018.05.020</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">728</subfield><subfield code="j">2018</subfield><subfield code="b">13</subfield><subfield code="c">0613</subfield><subfield code="h">95-101</subfield><subfield code="g">7</subfield></datafield></record></collection>
|
| score |
7.398963 |