An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics
• A jet array impingement device for direct body liquid cooling is proposed. • A high power test facility for up to 800 W heat power is established. • The low temperature rise of 38.7 °C is achieved with heat power of 800 W. • The maximum effective heat transfer coefficient h = 41,377 W/m2·K is achi...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Wu, Ruikang [verfasserIn] |
|---|
| Format: |
E-Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2019 |
|---|
| Schlagwörter: |
|---|
| Übergeordnetes Werk: |
Enthalten in: Wind resource mapping and energy estimation in complex terrain: A framework based on field observations and computational fluid dynamics - Radünz, William Corrêa ELSEVIER, 2020, design, processes, equipment, economics, Amsterdam [u.a.] |
|---|---|
| Übergeordnetes Werk: |
volume:162 ; year:2019 ; day:5 ; month:11 ; pages:0 |
| Links: |
|---|
| DOI / URN: |
10.1016/j.applthermaleng.2019.114259 |
|---|
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ELV04790870X |
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| 520 | |a • A jet array impingement device for direct body liquid cooling is proposed. • A high power test facility for up to 800 W heat power is established. • The low temperature rise of 38.7 °C is achieved with heat power of 800 W. • The maximum effective heat transfer coefficient h = 41,377 W/m2·K is achieved. • The combine effect of body cooling and 3D thermal conduction is studied. | ||
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10.1016/j.applthermaleng.2019.114259 doi GBV00000000000747.pica (DE-627)ELV04790870X (ELSEVIER)S1359-4311(18)36791-7 DE-627 ger DE-627 rakwb eng 530 620 VZ 52.56 bkl Wu, Ruikang verfasserin aut An immersed jet array impingement cooling device with distributed returns for direct body liquid cooling of high power electronics 2019 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier • A jet array impingement device for direct body liquid cooling is proposed. • A high power test facility for up to 800 W heat power is established. • The low temperature rise of 38.7 °C is achieved with heat power of 800 W. • The maximum effective heat transfer coefficient h = 41,377 W/m2·K is achieved. • The combine effect of body cooling and 3D thermal conduction is studied. High power electronics Elsevier Impingement jet Elsevier TIM Elsevier Direct liquid cooling Elsevier Body cooling Elsevier Immersed Elsevier Fan, Yiwen oth Hong, Tao oth Zou, Hao oth Hu, Run oth Luo, Xiaobing oth Enthalten in Elsevier Science Radünz, William Corrêa ELSEVIER Wind resource mapping and energy estimation in complex terrain: A framework based on field observations and computational fluid dynamics 2020 design, processes, equipment, economics Amsterdam [u.a.] (DE-627)ELV003905551 volume:162 year:2019 day:5 month:11 pages:0 https://doi.org/10.1016/j.applthermaleng.2019.114259 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 52.56 Regenerative Energieformen alternative Energieformen VZ AR 162 2019 5 1105 0 |
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• A jet array impingement device for direct body liquid cooling is proposed. • A high power test facility for up to 800 W heat power is established. • The low temperature rise of 38.7 °C is achieved with heat power of 800 W. • The maximum effective heat transfer coefficient h = 41,377 W/m2·K is achieved. • The combine effect of body cooling and 3D thermal conduction is studied. |
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• A jet array impingement device for direct body liquid cooling is proposed. • A high power test facility for up to 800 W heat power is established. • The low temperature rise of 38.7 °C is achieved with heat power of 800 W. • The maximum effective heat transfer coefficient h = 41,377 W/m2·K is achieved. • The combine effect of body cooling and 3D thermal conduction is studied. |
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• A jet array impingement device for direct body liquid cooling is proposed. • A high power test facility for up to 800 W heat power is established. • The low temperature rise of 38.7 °C is achieved with heat power of 800 W. • The maximum effective heat transfer coefficient h = 41,377 W/m2·K is achieved. • The combine effect of body cooling and 3D thermal conduction is studied. |
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