Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites
Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composit...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Van Duong, Luong [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2020transfer abstract |
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| Übergeordnetes Werk: |
Enthalten in: Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration - Wiens, Justin P. ELSEVIER, 2019, advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:108 ; year:2020 ; pages:0 |
| Links: |
|---|
| DOI / URN: |
10.1016/j.diamond.2020.107980 |
|---|
| Katalog-ID: |
ELV051301016 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | ELV051301016 | ||
| 003 | DE-627 | ||
| 005 | 20230626031842.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 210910s2020 xx |||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1016/j.diamond.2020.107980 |2 doi | |
| 028 | 5 | 2 | |a /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica |
| 035 | |a (DE-627)ELV051301016 | ||
| 035 | |a (ELSEVIER)S0925-9635(20)30533-1 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 540 |q VZ |
| 084 | |a 35.10 |2 bkl | ||
| 100 | 1 | |a Van Duong, Luong |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| 264 | 1 | |c 2020transfer abstract | |
| 336 | |a nicht spezifiziert |b zzz |2 rdacontent | ||
| 337 | |a nicht spezifiziert |b z |2 rdamedia | ||
| 338 | |a nicht spezifiziert |b zu |2 rdacarrier | ||
| 520 | |a Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. | ||
| 520 | |a Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. | ||
| 700 | 1 | |a Anh, Nguyen Ngoc |4 oth | |
| 700 | 1 | |a Trung, Tran Bao |4 oth | |
| 700 | 1 | |a Chung, Le Danh |4 oth | |
| 700 | 1 | |a Huan, Nguyen Quang |4 oth | |
| 700 | 1 | |a Nhung, Do Thi |4 oth | |
| 700 | 1 | |a Phuong, Mai Thi |4 oth | |
| 700 | 1 | |a Minh, Phan Ngoc |4 oth | |
| 700 | 1 | |a Phuong, Doan Dinh |4 oth | |
| 700 | 1 | |a Van Trinh, Pham |4 oth | |
| 773 | 0 | 8 | |i Enthalten in |n Elsevier Science |a Wiens, Justin P. ELSEVIER |t Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration |d 2019 |d advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials |g Amsterdam [u.a.] |w (DE-627)ELV002660938 |
| 773 | 1 | 8 | |g volume:108 |g year:2020 |g pages:0 |
| 856 | 4 | 0 | |u https://doi.org/10.1016/j.diamond.2020.107980 |3 Volltext |
| 912 | |a GBV_USEFLAG_U | ||
| 912 | |a GBV_ELV | ||
| 912 | |a SYSFLAG_U | ||
| 912 | |a SSG-OLC-PHA | ||
| 936 | b | k | |a 35.10 |j Physikalische Chemie: Allgemeines |q VZ |
| 951 | |a AR | ||
| 952 | |d 108 |j 2020 |h 0 | ||
| author_variant |
d l v dl dlv |
|---|---|
| matchkey_str |
vanduongluonganhnguyenngoctrungtranbaoch:2020----:fetfnelntmeauenlcrclntemlrpryfodoldutwlecronn |
| hierarchy_sort_str |
2020transfer abstract |
| bklnumber |
35.10 |
| publishDate |
2020 |
| allfields |
10.1016/j.diamond.2020.107980 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica (DE-627)ELV051301016 (ELSEVIER)S0925-9635(20)30533-1 DE-627 ger DE-627 rakwb eng 540 VZ 35.10 bkl Van Duong, Luong verfasserin aut Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Anh, Nguyen Ngoc oth Trung, Tran Bao oth Chung, Le Danh oth Huan, Nguyen Quang oth Nhung, Do Thi oth Phuong, Mai Thi oth Minh, Phan Ngoc oth Phuong, Doan Dinh oth Van Trinh, Pham oth Enthalten in Elsevier Science Wiens, Justin P. ELSEVIER Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration 2019 advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials Amsterdam [u.a.] (DE-627)ELV002660938 volume:108 year:2020 pages:0 https://doi.org/10.1016/j.diamond.2020.107980 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 35.10 Physikalische Chemie: Allgemeines VZ AR 108 2020 0 |
| spelling |
10.1016/j.diamond.2020.107980 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica (DE-627)ELV051301016 (ELSEVIER)S0925-9635(20)30533-1 DE-627 ger DE-627 rakwb eng 540 VZ 35.10 bkl Van Duong, Luong verfasserin aut Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Anh, Nguyen Ngoc oth Trung, Tran Bao oth Chung, Le Danh oth Huan, Nguyen Quang oth Nhung, Do Thi oth Phuong, Mai Thi oth Minh, Phan Ngoc oth Phuong, Doan Dinh oth Van Trinh, Pham oth Enthalten in Elsevier Science Wiens, Justin P. ELSEVIER Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration 2019 advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials Amsterdam [u.a.] (DE-627)ELV002660938 volume:108 year:2020 pages:0 https://doi.org/10.1016/j.diamond.2020.107980 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 35.10 Physikalische Chemie: Allgemeines VZ AR 108 2020 0 |
| allfields_unstemmed |
10.1016/j.diamond.2020.107980 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica (DE-627)ELV051301016 (ELSEVIER)S0925-9635(20)30533-1 DE-627 ger DE-627 rakwb eng 540 VZ 35.10 bkl Van Duong, Luong verfasserin aut Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Anh, Nguyen Ngoc oth Trung, Tran Bao oth Chung, Le Danh oth Huan, Nguyen Quang oth Nhung, Do Thi oth Phuong, Mai Thi oth Minh, Phan Ngoc oth Phuong, Doan Dinh oth Van Trinh, Pham oth Enthalten in Elsevier Science Wiens, Justin P. ELSEVIER Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration 2019 advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials Amsterdam [u.a.] (DE-627)ELV002660938 volume:108 year:2020 pages:0 https://doi.org/10.1016/j.diamond.2020.107980 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 35.10 Physikalische Chemie: Allgemeines VZ AR 108 2020 0 |
| allfieldsGer |
10.1016/j.diamond.2020.107980 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica (DE-627)ELV051301016 (ELSEVIER)S0925-9635(20)30533-1 DE-627 ger DE-627 rakwb eng 540 VZ 35.10 bkl Van Duong, Luong verfasserin aut Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Anh, Nguyen Ngoc oth Trung, Tran Bao oth Chung, Le Danh oth Huan, Nguyen Quang oth Nhung, Do Thi oth Phuong, Mai Thi oth Minh, Phan Ngoc oth Phuong, Doan Dinh oth Van Trinh, Pham oth Enthalten in Elsevier Science Wiens, Justin P. ELSEVIER Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration 2019 advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials Amsterdam [u.a.] (DE-627)ELV002660938 volume:108 year:2020 pages:0 https://doi.org/10.1016/j.diamond.2020.107980 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 35.10 Physikalische Chemie: Allgemeines VZ AR 108 2020 0 |
| allfieldsSound |
10.1016/j.diamond.2020.107980 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica (DE-627)ELV051301016 (ELSEVIER)S0925-9635(20)30533-1 DE-627 ger DE-627 rakwb eng 540 VZ 35.10 bkl Van Duong, Luong verfasserin aut Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. Anh, Nguyen Ngoc oth Trung, Tran Bao oth Chung, Le Danh oth Huan, Nguyen Quang oth Nhung, Do Thi oth Phuong, Mai Thi oth Minh, Phan Ngoc oth Phuong, Doan Dinh oth Van Trinh, Pham oth Enthalten in Elsevier Science Wiens, Justin P. ELSEVIER Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration 2019 advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials Amsterdam [u.a.] (DE-627)ELV002660938 volume:108 year:2020 pages:0 https://doi.org/10.1016/j.diamond.2020.107980 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 35.10 Physikalische Chemie: Allgemeines VZ AR 108 2020 0 |
| language |
English |
| source |
Enthalten in Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration Amsterdam [u.a.] volume:108 year:2020 pages:0 |
| sourceStr |
Enthalten in Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration Amsterdam [u.a.] volume:108 year:2020 pages:0 |
| format_phy_str_mv |
Article |
| bklname |
Physikalische Chemie: Allgemeines |
| institution |
findex.gbv.de |
| dewey-raw |
540 |
| isfreeaccess_bool |
false |
| container_title |
Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration |
| authorswithroles_txt_mv |
Van Duong, Luong @@aut@@ Anh, Nguyen Ngoc @@oth@@ Trung, Tran Bao @@oth@@ Chung, Le Danh @@oth@@ Huan, Nguyen Quang @@oth@@ Nhung, Do Thi @@oth@@ Phuong, Mai Thi @@oth@@ Minh, Phan Ngoc @@oth@@ Phuong, Doan Dinh @@oth@@ Van Trinh, Pham @@oth@@ |
| publishDateDaySort_date |
2020-01-01T00:00:00Z |
| hierarchy_top_id |
ELV002660938 |
| dewey-sort |
3540 |
| id |
ELV051301016 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV051301016</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230626031842.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">210910s2020 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/j.diamond.2020.107980</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">/cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV051301016</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S0925-9635(20)30533-1</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">540</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">35.10</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Van Duong, Luong</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2020transfer abstract</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Anh, Nguyen Ngoc</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Trung, Tran Bao</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Chung, Le Danh</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Huan, Nguyen Quang</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nhung, Do Thi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Phuong, Mai Thi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Minh, Phan Ngoc</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Phuong, Doan Dinh</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Van Trinh, Pham</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">Elsevier Science</subfield><subfield code="a">Wiens, Justin P. ELSEVIER</subfield><subfield code="t">Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration</subfield><subfield code="d">2019</subfield><subfield code="d">advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials</subfield><subfield code="g">Amsterdam [u.a.]</subfield><subfield code="w">(DE-627)ELV002660938</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:108</subfield><subfield code="g">year:2020</subfield><subfield code="g">pages:0</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/j.diamond.2020.107980</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">35.10</subfield><subfield code="j">Physikalische Chemie: Allgemeines</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">108</subfield><subfield code="j">2020</subfield><subfield code="h">0</subfield></datafield></record></collection>
|
| author |
Van Duong, Luong |
| spellingShingle |
Van Duong, Luong ddc 540 bkl 35.10 Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| authorStr |
Van Duong, Luong |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)ELV002660938 |
| format |
electronic Article |
| dewey-ones |
540 - Chemistry & allied sciences |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
elsevier |
| remote_str |
true |
| illustrated |
Not Illustrated |
| topic_title |
540 VZ 35.10 bkl Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| topic |
ddc 540 bkl 35.10 |
| topic_unstemmed |
ddc 540 bkl 35.10 |
| topic_browse |
ddc 540 bkl 35.10 |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
zu |
| author2_variant |
n n a nn nna t b t tb tbt l d c ld ldc n q h nq nqh d t n dt dtn m t p mt mtp p n m pn pnm d d p dd ddp t p v tp tpv |
| hierarchy_parent_title |
Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration |
| hierarchy_parent_id |
ELV002660938 |
| dewey-tens |
540 - Chemistry |
| hierarchy_top_title |
Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)ELV002660938 |
| title |
Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| ctrlnum |
(DE-627)ELV051301016 (ELSEVIER)S0925-9635(20)30533-1 |
| title_full |
Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| author_sort |
Van Duong, Luong |
| journal |
Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration |
| journalStr |
Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
500 - Science |
| recordtype |
marc |
| publishDateSort |
2020 |
| contenttype_str_mv |
zzz |
| container_start_page |
0 |
| author_browse |
Van Duong, Luong |
| container_volume |
108 |
| class |
540 VZ 35.10 bkl |
| format_se |
Elektronische Aufsätze |
| author-letter |
Van Duong, Luong |
| doi_str_mv |
10.1016/j.diamond.2020.107980 |
| dewey-full |
540 |
| title_sort |
effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| title_auth |
Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| abstract |
Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. |
| abstractGer |
Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. |
| abstract_unstemmed |
Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. |
| collection_details |
GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA |
| title_short |
Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites |
| url |
https://doi.org/10.1016/j.diamond.2020.107980 |
| remote_bool |
true |
| author2 |
Anh, Nguyen Ngoc Trung, Tran Bao Chung, Le Danh Huan, Nguyen Quang Nhung, Do Thi Phuong, Mai Thi Minh, Phan Ngoc Phuong, Doan Dinh Van Trinh, Pham |
| author2Str |
Anh, Nguyen Ngoc Trung, Tran Bao Chung, Le Danh Huan, Nguyen Quang Nhung, Do Thi Phuong, Mai Thi Minh, Phan Ngoc Phuong, Doan Dinh Van Trinh, Pham |
| ppnlink |
ELV002660938 |
| mediatype_str_mv |
z |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth oth oth oth oth oth oth |
| doi_str |
10.1016/j.diamond.2020.107980 |
| up_date |
2024-07-06T19:53:33.455Z |
| _version_ |
1803860693175238656 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV051301016</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230626031842.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">210910s2020 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/j.diamond.2020.107980</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">/cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001127.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV051301016</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S0925-9635(20)30533-1</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">540</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">35.10</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Van Duong, Luong</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2020transfer abstract</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Anh, Nguyen Ngoc</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Trung, Tran Bao</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Chung, Le Danh</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Huan, Nguyen Quang</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nhung, Do Thi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Phuong, Mai Thi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Minh, Phan Ngoc</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Phuong, Doan Dinh</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Van Trinh, Pham</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">Elsevier Science</subfield><subfield code="a">Wiens, Justin P. ELSEVIER</subfield><subfield code="t">Sodium atom beam collisions with the liquid glycerol surface: Mass effects of deuteration</subfield><subfield code="d">2019</subfield><subfield code="d">advancing the science and technology of diamond, diamond-like carbon, silicon carbides and Group 3 nitride materials</subfield><subfield code="g">Amsterdam [u.a.]</subfield><subfield code="w">(DE-627)ELV002660938</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:108</subfield><subfield code="g">year:2020</subfield><subfield code="g">pages:0</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/j.diamond.2020.107980</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">35.10</subfield><subfield code="j">Physikalische Chemie: Allgemeines</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">108</subfield><subfield code="j">2020</subfield><subfield code="h">0</subfield></datafield></record></collection>
|
| score |
7.401202 |