Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste

Display Omitted

Gespeichert in:
Autor*in:

Wernicki, Evan [verfasserIn]

Gu, Zhiyong

Format:

E-Artikel

Sprache:

Englisch

Erschienen:

2020

Schlagwörter:

Nanoparticles

Sn-Ag-Cu (SAC)

DSC

Nanocomposite

Solder paste

Übergeordnetes Werk:

Enthalten in: Qualitative and quantitative characterization of phenolic and diterpenoid constituents in Danshen (Salvia miltiorrhiza) by comprehensive two-dimensional liquid chromatography coupled with hybrid linear ion trap Orbitrap mass - Cao, Ji-Liang ELSEVIER, 2016, an international journal concerned with all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering, Amsterdam [u.a.]

Übergeordnetes Werk:

volume:690 ; year:2020 ; pages:0

Links:

Volltext

DOI / URN:

10.1016/j.tca.2020.178642

Katalog-ID:

ELV051387611

Nicht das Richtige dabei?

Schreiben Sie uns!