A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade
The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost l...
Ausführliche Beschreibung
Autor*in: |
Terzo, Stefano [verfasserIn] |
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E-Artikel |
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Englisch |
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2020transfer abstract |
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Enthalten in: The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol - Ide, C.V. ELSEVIER, 2017, a journal on accelerators, instrumentation and techniques applied to research in nuclear and atomic physics, materials science and related fields in physics, Amsterdam |
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Übergeordnetes Werk: |
volume:982 ; year:2020 ; day:1 ; month:12 ; pages:0 |
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DOI / URN: |
10.1016/j.nima.2020.164587 |
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ELV05172328X |
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520 | |a The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. | ||
520 | |a The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. | ||
650 | 7 | |a Particle tracking detectors |2 Elsevier | |
650 | 7 | |a Radiation-hard detectors |2 Elsevier | |
650 | 7 | |a 3D silicon sensors |2 Elsevier | |
650 | 7 | |a Solid state detectors |2 Elsevier | |
650 | 7 | |a High Luminosity |2 Elsevier | |
700 | 1 | |a Grinstein, Sebastian |4 oth | |
700 | 1 | |a Manna, Maria |4 oth | |
700 | 1 | |a Pellegrini, Giulio |4 oth | |
700 | 1 | |a Quirion, David |4 oth | |
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10.1016/j.nima.2020.164587 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001171.pica (DE-627)ELV05172328X (ELSEVIER)S0168-9002(20)30984-0 DE-627 ger DE-627 rakwb eng 610 VZ 44.90 bkl Terzo, Stefano verfasserin aut A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. Particle tracking detectors Elsevier Radiation-hard detectors Elsevier 3D silicon sensors Elsevier Solid state detectors Elsevier High Luminosity Elsevier Grinstein, Sebastian oth Manna, Maria oth Pellegrini, Giulio oth Quirion, David oth Enthalten in North-Holland Publ. Co Ide, C.V. ELSEVIER The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol 2017 a journal on accelerators, instrumentation and techniques applied to research in nuclear and atomic physics, materials science and related fields in physics Amsterdam (DE-627)ELV000874671 volume:982 year:2020 day:1 month:12 pages:0 https://doi.org/10.1016/j.nima.2020.164587 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 44.90 Neurologie VZ AR 982 2020 1 1201 0 |
spelling |
10.1016/j.nima.2020.164587 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001171.pica (DE-627)ELV05172328X (ELSEVIER)S0168-9002(20)30984-0 DE-627 ger DE-627 rakwb eng 610 VZ 44.90 bkl Terzo, Stefano verfasserin aut A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. Particle tracking detectors Elsevier Radiation-hard detectors Elsevier 3D silicon sensors Elsevier Solid state detectors Elsevier High Luminosity Elsevier Grinstein, Sebastian oth Manna, Maria oth Pellegrini, Giulio oth Quirion, David oth Enthalten in North-Holland Publ. Co Ide, C.V. ELSEVIER The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol 2017 a journal on accelerators, instrumentation and techniques applied to research in nuclear and atomic physics, materials science and related fields in physics Amsterdam (DE-627)ELV000874671 volume:982 year:2020 day:1 month:12 pages:0 https://doi.org/10.1016/j.nima.2020.164587 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 44.90 Neurologie VZ AR 982 2020 1 1201 0 |
allfields_unstemmed |
10.1016/j.nima.2020.164587 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001171.pica (DE-627)ELV05172328X (ELSEVIER)S0168-9002(20)30984-0 DE-627 ger DE-627 rakwb eng 610 VZ 44.90 bkl Terzo, Stefano verfasserin aut A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. Particle tracking detectors Elsevier Radiation-hard detectors Elsevier 3D silicon sensors Elsevier Solid state detectors Elsevier High Luminosity Elsevier Grinstein, Sebastian oth Manna, Maria oth Pellegrini, Giulio oth Quirion, David oth Enthalten in North-Holland Publ. Co Ide, C.V. ELSEVIER The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol 2017 a journal on accelerators, instrumentation and techniques applied to research in nuclear and atomic physics, materials science and related fields in physics Amsterdam (DE-627)ELV000874671 volume:982 year:2020 day:1 month:12 pages:0 https://doi.org/10.1016/j.nima.2020.164587 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 44.90 Neurologie VZ AR 982 2020 1 1201 0 |
allfieldsGer |
10.1016/j.nima.2020.164587 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001171.pica (DE-627)ELV05172328X (ELSEVIER)S0168-9002(20)30984-0 DE-627 ger DE-627 rakwb eng 610 VZ 44.90 bkl Terzo, Stefano verfasserin aut A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. Particle tracking detectors Elsevier Radiation-hard detectors Elsevier 3D silicon sensors Elsevier Solid state detectors Elsevier High Luminosity Elsevier Grinstein, Sebastian oth Manna, Maria oth Pellegrini, Giulio oth Quirion, David oth Enthalten in North-Holland Publ. Co Ide, C.V. ELSEVIER The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol 2017 a journal on accelerators, instrumentation and techniques applied to research in nuclear and atomic physics, materials science and related fields in physics Amsterdam (DE-627)ELV000874671 volume:982 year:2020 day:1 month:12 pages:0 https://doi.org/10.1016/j.nima.2020.164587 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 44.90 Neurologie VZ AR 982 2020 1 1201 0 |
allfieldsSound |
10.1016/j.nima.2020.164587 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001171.pica (DE-627)ELV05172328X (ELSEVIER)S0168-9002(20)30984-0 DE-627 ger DE-627 rakwb eng 610 VZ 44.90 bkl Terzo, Stefano verfasserin aut A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade 2020transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. Particle tracking detectors Elsevier Radiation-hard detectors Elsevier 3D silicon sensors Elsevier Solid state detectors Elsevier High Luminosity Elsevier Grinstein, Sebastian oth Manna, Maria oth Pellegrini, Giulio oth Quirion, David oth Enthalten in North-Holland Publ. Co Ide, C.V. ELSEVIER The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol 2017 a journal on accelerators, instrumentation and techniques applied to research in nuclear and atomic physics, materials science and related fields in physics Amsterdam (DE-627)ELV000874671 volume:982 year:2020 day:1 month:12 pages:0 https://doi.org/10.1016/j.nima.2020.164587 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA 44.90 Neurologie VZ AR 982 2020 1 1201 0 |
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Enthalten in The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol Amsterdam volume:982 year:2020 day:1 month:12 pages:0 |
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The efficacy of EEG-biofeedback for acute pain management, a randomized sham-controlled study of a tailored protocol |
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A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade |
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The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. |
abstractGer |
The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. |
abstract_unstemmed |
The ATLAS experiment at the Large Hadron Collider (LHC) will replace its inner tracker system to cope with the extreme particle fluence expected after the High Luminosity upgrade of the accelerator (HL-LHC). The 3D silicon sensor technology has been selected as baseline to instrument the innermost layer of the pixel detector in the future ATLAS Inner Tracker (ITk). A new generation of 3D pixel sensors with thin active substrates and small pixel cells of ( 50 × 50 ) μ m2 and ( 25 × 100 ) μ m2 produced at CNM in Spain, have been interconnected to the RD53A chip, the first prototype of ASIC for the HL-LHC. Performance of these new 3D RD53A modules have been studied before and after uniform proton irradiation up to 1 × 1016 n eq /cm2, i.e. a particle fluence close to the one expected for the innermost layer of ITk. The first results of the power dissipation and hit efficiency for uniformly irradiated 3D RD53A devices will be presented. These revealed a superior radiation hardness of these novel pixel sensors. |
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A new generation of radiation hard 3D pixel sensors for the ATLAS upgrade |
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https://doi.org/10.1016/j.nima.2020.164587 |
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