A novel method to incorporate functional filler into TPSiV for balanced physical properties
Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rathe...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhao, Guojie [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2021transfer abstract |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: No title available - an international journal, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:213 ; year:2021 ; day:8 ; month:09 ; pages:0 |
| Links: |
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| DOI / URN: |
10.1016/j.compscitech.2021.108925 |
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ELV054873711 |
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| 100 | 1 | |a Zhao, Guojie |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a A novel method to incorporate functional filler into TPSiV for balanced physical properties |
| 264 | 1 | |c 2021transfer abstract | |
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| 520 | |a Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. | ||
| 520 | |a Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. | ||
| 650 | 7 | |a Electromagnetic interference shielding |2 Elsevier | |
| 650 | 7 | |a TPSiV |2 Elsevier | |
| 650 | 7 | |a CNTs |2 Elsevier | |
| 650 | 7 | |a Mechanical property |2 Elsevier | |
| 650 | 7 | |a Segregated structure |2 Elsevier | |
| 700 | 1 | |a Tian, Ke |4 oth | |
| 700 | 1 | |a Pan, Qinjun |4 oth | |
| 700 | 1 | |a Zhang, Qin |4 oth | |
| 700 | 1 | |a Deng, Hua |4 oth | |
| 700 | 1 | |a Fu, Qiang |4 oth | |
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10.1016/j.compscitech.2021.108925 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001480.pica (DE-627)ELV054873711 (ELSEVIER)S0266-3538(21)00281-5 DE-627 ger DE-627 rakwb eng Zhao, Guojie verfasserin aut A novel method to incorporate functional filler into TPSiV for balanced physical properties 2021transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Electromagnetic interference shielding Elsevier TPSiV Elsevier CNTs Elsevier Mechanical property Elsevier Segregated structure Elsevier Tian, Ke oth Pan, Qinjun oth Zhang, Qin oth Deng, Hua oth Fu, Qiang oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:213 year:2021 day:8 month:09 pages:0 https://doi.org/10.1016/j.compscitech.2021.108925 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 213 2021 8 0908 0 |
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10.1016/j.compscitech.2021.108925 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001480.pica (DE-627)ELV054873711 (ELSEVIER)S0266-3538(21)00281-5 DE-627 ger DE-627 rakwb eng Zhao, Guojie verfasserin aut A novel method to incorporate functional filler into TPSiV for balanced physical properties 2021transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Electromagnetic interference shielding Elsevier TPSiV Elsevier CNTs Elsevier Mechanical property Elsevier Segregated structure Elsevier Tian, Ke oth Pan, Qinjun oth Zhang, Qin oth Deng, Hua oth Fu, Qiang oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:213 year:2021 day:8 month:09 pages:0 https://doi.org/10.1016/j.compscitech.2021.108925 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 213 2021 8 0908 0 |
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10.1016/j.compscitech.2021.108925 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001480.pica (DE-627)ELV054873711 (ELSEVIER)S0266-3538(21)00281-5 DE-627 ger DE-627 rakwb eng Zhao, Guojie verfasserin aut A novel method to incorporate functional filler into TPSiV for balanced physical properties 2021transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Electromagnetic interference shielding Elsevier TPSiV Elsevier CNTs Elsevier Mechanical property Elsevier Segregated structure Elsevier Tian, Ke oth Pan, Qinjun oth Zhang, Qin oth Deng, Hua oth Fu, Qiang oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:213 year:2021 day:8 month:09 pages:0 https://doi.org/10.1016/j.compscitech.2021.108925 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 213 2021 8 0908 0 |
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10.1016/j.compscitech.2021.108925 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001480.pica (DE-627)ELV054873711 (ELSEVIER)S0266-3538(21)00281-5 DE-627 ger DE-627 rakwb eng Zhao, Guojie verfasserin aut A novel method to incorporate functional filler into TPSiV for balanced physical properties 2021transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Electromagnetic interference shielding Elsevier TPSiV Elsevier CNTs Elsevier Mechanical property Elsevier Segregated structure Elsevier Tian, Ke oth Pan, Qinjun oth Zhang, Qin oth Deng, Hua oth Fu, Qiang oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:213 year:2021 day:8 month:09 pages:0 https://doi.org/10.1016/j.compscitech.2021.108925 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 213 2021 8 0908 0 |
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10.1016/j.compscitech.2021.108925 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001480.pica (DE-627)ELV054873711 (ELSEVIER)S0266-3538(21)00281-5 DE-627 ger DE-627 rakwb eng Zhao, Guojie verfasserin aut A novel method to incorporate functional filler into TPSiV for balanced physical properties 2021transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. Electromagnetic interference shielding Elsevier TPSiV Elsevier CNTs Elsevier Mechanical property Elsevier Segregated structure Elsevier Tian, Ke oth Pan, Qinjun oth Zhang, Qin oth Deng, Hua oth Fu, Qiang oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:213 year:2021 day:8 month:09 pages:0 https://doi.org/10.1016/j.compscitech.2021.108925 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 213 2021 8 0908 0 |
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A novel method to incorporate functional filler into TPSiV for balanced physical properties |
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Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. |
| abstractGer |
Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. |
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Various literatures have reported that incorporating functional fillers into thermoplastic vulcanizates (TPVs) is an ideal method to prepare functional TPVs with balanced properties. Nevertheless, it is quite difficult to achieve that for thermoplastic silicone vulcanizate (TPSiV) due to their rather high silicon rubber (SiR) content as well as delicate balance between processing ability and various physical properties. Herein, a novel method involves using CNT/TPU phase as polymer matrix to disperse TPSiV particles through solution processing is proposed. Compared with randomly dispersed CNTs and traditional segregated CNTs network with TPSiV particles, composites fabricated by such method illustrate much better balance between various properties, including: low percolation threshold (Pc), comprehensive mechanical performance, better electromagnetic interference (EMI) shielding ability, etc. CNT/TPU anchored TPSiV double-percolated composite illustrates comparable Pc (0.42 wt%) to traditional segregated TPSiV/CNT composite (0.38 wt%), while the TPSiV composite with randomly dispersed CNT shows apparently high Pc (1.37 wt%). More importantly, both tensile strength and elongation at break are improved for these compoistes with double-percolation structure. It is even better than neat TPSiV composites at the same CNT loading. The prepared two types of segregated composites demonstrate similar electrical conductivity at high filler loading (≥1 wt%), enabling them with similar EMI performance, but the one with CNT/TPU as adhesive phase is much more stable after 100 times bending, illustrating negligible attenuation. This study provides a novel approach for incorporating functional fillers into TPSiV matrix for balanced properties. |
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Tian, Ke Pan, Qinjun Zhang, Qin Deng, Hua Fu, Qiang |
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