A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production
Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Han, Han [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2022transfer abstract |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers - Kim, Yohan ELSEVIER, 2021, an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:240 ; year:2022 ; day:15 ; month:06 ; pages:0 |
| Links: |
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| DOI / URN: |
10.1016/j.solmat.2022.111714 |
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| Katalog-ID: |
ELV057412545 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | ELV057412545 | ||
| 003 | DE-627 | ||
| 005 | 20230626045048.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 220808s2022 xx |||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1016/j.solmat.2022.111714 |2 doi | |
| 028 | 5 | 2 | |a /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica |
| 035 | |a (DE-627)ELV057412545 | ||
| 035 | |a (ELSEVIER)S0927-0248(22)00135-0 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 690 |q VZ |
| 084 | |a 56.03 |2 bkl | ||
| 100 | 1 | |a Han, Han |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| 264 | 1 | |c 2022transfer abstract | |
| 336 | |a nicht spezifiziert |b zzz |2 rdacontent | ||
| 337 | |a nicht spezifiziert |b z |2 rdamedia | ||
| 338 | |a nicht spezifiziert |b zu |2 rdacarrier | ||
| 520 | |a Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. | ||
| 520 | |a Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. | ||
| 650 | 7 | |a Thermal stress cleaving |2 Elsevier | |
| 650 | 7 | |a Laser scribing |2 Elsevier | |
| 650 | 7 | |a Electrical loss |2 Elsevier | |
| 650 | 7 | |a Beam splitter |2 Elsevier | |
| 650 | 7 | |a Mechanical loss |2 Elsevier | |
| 700 | 1 | |a Jia, Xubo |4 oth | |
| 700 | 1 | |a Ma, Chao |4 oth | |
| 700 | 1 | |a Wu, Yelong |4 oth | |
| 773 | 0 | 8 | |i Enthalten in |n NH, Elsevier |a Kim, Yohan ELSEVIER |t Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers |d 2021 |d an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion |g Amsterdam [u.a.] |w (DE-627)ELV00721202X |
| 773 | 1 | 8 | |g volume:240 |g year:2022 |g day:15 |g month:06 |g pages:0 |
| 856 | 4 | 0 | |u https://doi.org/10.1016/j.solmat.2022.111714 |3 Volltext |
| 912 | |a GBV_USEFLAG_U | ||
| 912 | |a GBV_ELV | ||
| 912 | |a SYSFLAG_U | ||
| 936 | b | k | |a 56.03 |j Methoden im Bauingenieurwesen |q VZ |
| 951 | |a AR | ||
| 952 | |d 240 |j 2022 |b 15 |c 0615 |h 0 | ||
| author_variant |
h h hh |
|---|---|
| matchkey_str |
hanhanjiaxubomachaowuyelong:2022----:nvlaesrbnmtocmiewttehrasrscevnfrhcytlieiioslr |
| hierarchy_sort_str |
2022transfer abstract |
| bklnumber |
56.03 |
| publishDate |
2022 |
| allfields |
10.1016/j.solmat.2022.111714 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica (DE-627)ELV057412545 (ELSEVIER)S0927-0248(22)00135-0 DE-627 ger DE-627 rakwb eng 690 VZ 56.03 bkl Han, Han verfasserin aut A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss Elsevier Jia, Xubo oth Ma, Chao oth Wu, Yelong oth Enthalten in NH, Elsevier Kim, Yohan ELSEVIER Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers 2021 an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion Amsterdam [u.a.] (DE-627)ELV00721202X volume:240 year:2022 day:15 month:06 pages:0 https://doi.org/10.1016/j.solmat.2022.111714 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 56.03 Methoden im Bauingenieurwesen VZ AR 240 2022 15 0615 0 |
| spelling |
10.1016/j.solmat.2022.111714 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica (DE-627)ELV057412545 (ELSEVIER)S0927-0248(22)00135-0 DE-627 ger DE-627 rakwb eng 690 VZ 56.03 bkl Han, Han verfasserin aut A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss Elsevier Jia, Xubo oth Ma, Chao oth Wu, Yelong oth Enthalten in NH, Elsevier Kim, Yohan ELSEVIER Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers 2021 an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion Amsterdam [u.a.] (DE-627)ELV00721202X volume:240 year:2022 day:15 month:06 pages:0 https://doi.org/10.1016/j.solmat.2022.111714 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 56.03 Methoden im Bauingenieurwesen VZ AR 240 2022 15 0615 0 |
| allfields_unstemmed |
10.1016/j.solmat.2022.111714 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica (DE-627)ELV057412545 (ELSEVIER)S0927-0248(22)00135-0 DE-627 ger DE-627 rakwb eng 690 VZ 56.03 bkl Han, Han verfasserin aut A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss Elsevier Jia, Xubo oth Ma, Chao oth Wu, Yelong oth Enthalten in NH, Elsevier Kim, Yohan ELSEVIER Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers 2021 an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion Amsterdam [u.a.] (DE-627)ELV00721202X volume:240 year:2022 day:15 month:06 pages:0 https://doi.org/10.1016/j.solmat.2022.111714 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 56.03 Methoden im Bauingenieurwesen VZ AR 240 2022 15 0615 0 |
| allfieldsGer |
10.1016/j.solmat.2022.111714 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica (DE-627)ELV057412545 (ELSEVIER)S0927-0248(22)00135-0 DE-627 ger DE-627 rakwb eng 690 VZ 56.03 bkl Han, Han verfasserin aut A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss Elsevier Jia, Xubo oth Ma, Chao oth Wu, Yelong oth Enthalten in NH, Elsevier Kim, Yohan ELSEVIER Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers 2021 an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion Amsterdam [u.a.] (DE-627)ELV00721202X volume:240 year:2022 day:15 month:06 pages:0 https://doi.org/10.1016/j.solmat.2022.111714 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 56.03 Methoden im Bauingenieurwesen VZ AR 240 2022 15 0615 0 |
| allfieldsSound |
10.1016/j.solmat.2022.111714 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica (DE-627)ELV057412545 (ELSEVIER)S0927-0248(22)00135-0 DE-627 ger DE-627 rakwb eng 690 VZ 56.03 bkl Han, Han verfasserin aut A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss Elsevier Jia, Xubo oth Ma, Chao oth Wu, Yelong oth Enthalten in NH, Elsevier Kim, Yohan ELSEVIER Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers 2021 an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion Amsterdam [u.a.] (DE-627)ELV00721202X volume:240 year:2022 day:15 month:06 pages:0 https://doi.org/10.1016/j.solmat.2022.111714 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 56.03 Methoden im Bauingenieurwesen VZ AR 240 2022 15 0615 0 |
| language |
English |
| source |
Enthalten in Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers Amsterdam [u.a.] volume:240 year:2022 day:15 month:06 pages:0 |
| sourceStr |
Enthalten in Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers Amsterdam [u.a.] volume:240 year:2022 day:15 month:06 pages:0 |
| format_phy_str_mv |
Article |
| bklname |
Methoden im Bauingenieurwesen |
| institution |
findex.gbv.de |
| topic_facet |
Thermal stress cleaving Laser scribing Electrical loss Beam splitter Mechanical loss |
| dewey-raw |
690 |
| isfreeaccess_bool |
false |
| container_title |
Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers |
| authorswithroles_txt_mv |
Han, Han @@aut@@ Jia, Xubo @@oth@@ Ma, Chao @@oth@@ Wu, Yelong @@oth@@ |
| publishDateDaySort_date |
2022-01-15T00:00:00Z |
| hierarchy_top_id |
ELV00721202X |
| dewey-sort |
3690 |
| id |
ELV057412545 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV057412545</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230626045048.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">220808s2022 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/j.solmat.2022.111714</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">/cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV057412545</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S0927-0248(22)00135-0</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">690</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">56.03</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Han, Han</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2022transfer abstract</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thermal stress cleaving</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Laser scribing</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electrical loss</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Beam splitter</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Mechanical loss</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Jia, Xubo</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ma, Chao</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, Yelong</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">NH, Elsevier</subfield><subfield code="a">Kim, Yohan ELSEVIER</subfield><subfield code="t">Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers</subfield><subfield code="d">2021</subfield><subfield code="d">an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion</subfield><subfield code="g">Amsterdam [u.a.]</subfield><subfield code="w">(DE-627)ELV00721202X</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:240</subfield><subfield code="g">year:2022</subfield><subfield code="g">day:15</subfield><subfield code="g">month:06</subfield><subfield code="g">pages:0</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/j.solmat.2022.111714</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">56.03</subfield><subfield code="j">Methoden im Bauingenieurwesen</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">240</subfield><subfield code="j">2022</subfield><subfield code="b">15</subfield><subfield code="c">0615</subfield><subfield code="h">0</subfield></datafield></record></collection>
|
| author |
Han, Han |
| spellingShingle |
Han, Han ddc 690 bkl 56.03 Elsevier Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| authorStr |
Han, Han |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)ELV00721202X |
| format |
electronic Article |
| dewey-ones |
690 - Buildings |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
elsevier |
| remote_str |
true |
| illustrated |
Not Illustrated |
| topic_title |
690 VZ 56.03 bkl A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss Elsevier |
| topic |
ddc 690 bkl 56.03 Elsevier Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss |
| topic_unstemmed |
ddc 690 bkl 56.03 Elsevier Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss |
| topic_browse |
ddc 690 bkl 56.03 Elsevier Thermal stress cleaving Elsevier Laser scribing Elsevier Electrical loss Elsevier Beam splitter Elsevier Mechanical loss |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
zu |
| author2_variant |
x j xj c m cm y w yw |
| hierarchy_parent_title |
Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers |
| hierarchy_parent_id |
ELV00721202X |
| dewey-tens |
690 - Building & construction |
| hierarchy_top_title |
Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)ELV00721202X |
| title |
A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| ctrlnum |
(DE-627)ELV057412545 (ELSEVIER)S0927-0248(22)00135-0 |
| title_full |
A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| author_sort |
Han, Han |
| journal |
Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers |
| journalStr |
Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2022 |
| contenttype_str_mv |
zzz |
| container_start_page |
0 |
| author_browse |
Han, Han |
| container_volume |
240 |
| class |
690 VZ 56.03 bkl |
| format_se |
Elektronische Aufsätze |
| author-letter |
Han, Han |
| doi_str_mv |
10.1016/j.solmat.2022.111714 |
| dewey-full |
690 |
| title_sort |
a novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| title_auth |
A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| abstract |
Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. |
| abstractGer |
Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. |
| abstract_unstemmed |
Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells. |
| collection_details |
GBV_USEFLAG_U GBV_ELV SYSFLAG_U |
| title_short |
A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production |
| url |
https://doi.org/10.1016/j.solmat.2022.111714 |
| remote_bool |
true |
| author2 |
Jia, Xubo Ma, Chao Wu, Yelong |
| author2Str |
Jia, Xubo Ma, Chao Wu, Yelong |
| ppnlink |
ELV00721202X |
| mediatype_str_mv |
z |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth |
| doi_str |
10.1016/j.solmat.2022.111714 |
| up_date |
2024-07-06T23:09:28.729Z |
| _version_ |
1803873019473428480 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">ELV057412545</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230626045048.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">220808s2022 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1016/j.solmat.2022.111714</subfield><subfield code="2">doi</subfield></datafield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">/cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001736.pica</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)ELV057412545</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ELSEVIER)S0927-0248(22)00135-0</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">690</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">56.03</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Han, Han</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">A novel laser scribing method combined with the thermal stress cleaving for the crystalline silicon solar cell separation in mass production</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2022transfer abstract</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Nowadays as the wafer sizes of the crystalline silicon solar cells get larger and larger, separating the cells becomes an essential step. However, in mass production, there is still lack of a low scribing loss and broad compatible cell separation method. In this work, a systematic investigation was conducted on the crystalline silicon solar cell separation processes, including the laser scribing and the cleaving process. Firstly, by combining a 1/4 beam splitter with the laser head, we developed a new laser scribing process, which can achieve a smaller groove width-to-depth ratio (24%) with narrower heat affected area (total width of 30 μm) compared to traditional laser optical systems. Then, we explored the minimum required scribing depths for separating four typical crystalline silicon cells by applying the thermal stress cleaving process. The Czochralski-grown substrates need only point scribing at the beginning and the end of the separating path, but if there is a metal electrode in the separation path, the scribing depth has to be about 20% of the cell thickness. At last, we analyzed the electrical and mechanical strength losses caused by different separation processes. The 20% scribing depth may cause about 30%rel mechanical strength loss. It is proved that combining this new scribing method with the thermal stress cleaving is an economical separation solution with less laser scribing loss and better compatibility for different cells. Our results would shed some light on future separating and module design efforts of solar cells.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Thermal stress cleaving</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Laser scribing</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electrical loss</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Beam splitter</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Mechanical loss</subfield><subfield code="2">Elsevier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Jia, Xubo</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ma, Chao</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wu, Yelong</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="n">NH, Elsevier</subfield><subfield code="a">Kim, Yohan ELSEVIER</subfield><subfield code="t">Question answering method for infrastructure damage information retrieval from textual data using bidirectional encoder representations from transformers</subfield><subfield code="d">2021</subfield><subfield code="d">an international journal devoted to photovoltaic, photothermal, and photochemical solar energy conversion</subfield><subfield code="g">Amsterdam [u.a.]</subfield><subfield code="w">(DE-627)ELV00721202X</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:240</subfield><subfield code="g">year:2022</subfield><subfield code="g">day:15</subfield><subfield code="g">month:06</subfield><subfield code="g">pages:0</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1016/j.solmat.2022.111714</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ELV</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_U</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">56.03</subfield><subfield code="j">Methoden im Bauingenieurwesen</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">240</subfield><subfield code="j">2022</subfield><subfield code="b">15</subfield><subfield code="c">0615</subfield><subfield code="h">0</subfield></datafield></record></collection>
|
| score |
7.400441 |