A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging
At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation,...
Ausführliche Beschreibung
Autor*in: |
Miao, Min [verfasserIn] |
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Format: |
E-Artikel |
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Sprache: |
Englisch |
Erschienen: |
2022transfer abstract |
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Übergeordnetes Werk: |
Enthalten in: Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease - Kokkinos, Peter ELSEVIER, 2023, Amsterdam [u.a.] |
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Übergeordnetes Werk: |
volume:129 ; year:2022 ; pages:0 |
Links: |
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DOI / URN: |
10.1016/j.mejo.2022.105582 |
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Katalog-ID: |
ELV059293292 |
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245 | 1 | 0 | |a A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging |
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520 | |a At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. | ||
520 | |a At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. | ||
650 | 7 | |a Electromagnetic interference (EMI) |2 Elsevier | |
650 | 7 | |a Shielding effectiveness (SE) |2 Elsevier | |
650 | 7 | |a System-in-package (SiP) |2 Elsevier | |
650 | 7 | |a Microstrip antenna |2 Elsevier | |
650 | 7 | |a Electromagnetic shielding |2 Elsevier | |
650 | 7 | |a Test fixture |2 Elsevier | |
700 | 1 | |a Zhang, Danya |4 oth | |
700 | 1 | |a Nie, Xin |4 oth | |
700 | 1 | |a Bu, Jingpeng |4 oth | |
773 | 0 | 8 | |i Enthalten in |n Elsevier Science |a Kokkinos, Peter ELSEVIER |t Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease |d 2023 |g Amsterdam [u.a.] |w (DE-627)ELV009440992 |
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allfields |
10.1016/j.mejo.2022.105582 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001939.pica (DE-627)ELV059293292 (ELSEVIER)S0026-2692(22)00211-7 DE-627 ger DE-627 rakwb eng 610 VZ 44.85 bkl Miao, Min verfasserin aut A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. Electromagnetic interference (EMI) Elsevier Shielding effectiveness (SE) Elsevier System-in-package (SiP) Elsevier Microstrip antenna Elsevier Electromagnetic shielding Elsevier Test fixture Elsevier Zhang, Danya oth Nie, Xin oth Bu, Jingpeng oth Enthalten in Elsevier Science Kokkinos, Peter ELSEVIER Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease 2023 Amsterdam [u.a.] (DE-627)ELV009440992 volume:129 year:2022 pages:0 https://doi.org/10.1016/j.mejo.2022.105582 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 44.85 Kardiologie Angiologie VZ AR 129 2022 0 |
spelling |
10.1016/j.mejo.2022.105582 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001939.pica (DE-627)ELV059293292 (ELSEVIER)S0026-2692(22)00211-7 DE-627 ger DE-627 rakwb eng 610 VZ 44.85 bkl Miao, Min verfasserin aut A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. Electromagnetic interference (EMI) Elsevier Shielding effectiveness (SE) Elsevier System-in-package (SiP) Elsevier Microstrip antenna Elsevier Electromagnetic shielding Elsevier Test fixture Elsevier Zhang, Danya oth Nie, Xin oth Bu, Jingpeng oth Enthalten in Elsevier Science Kokkinos, Peter ELSEVIER Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease 2023 Amsterdam [u.a.] (DE-627)ELV009440992 volume:129 year:2022 pages:0 https://doi.org/10.1016/j.mejo.2022.105582 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 44.85 Kardiologie Angiologie VZ AR 129 2022 0 |
allfields_unstemmed |
10.1016/j.mejo.2022.105582 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001939.pica (DE-627)ELV059293292 (ELSEVIER)S0026-2692(22)00211-7 DE-627 ger DE-627 rakwb eng 610 VZ 44.85 bkl Miao, Min verfasserin aut A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. Electromagnetic interference (EMI) Elsevier Shielding effectiveness (SE) Elsevier System-in-package (SiP) Elsevier Microstrip antenna Elsevier Electromagnetic shielding Elsevier Test fixture Elsevier Zhang, Danya oth Nie, Xin oth Bu, Jingpeng oth Enthalten in Elsevier Science Kokkinos, Peter ELSEVIER Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease 2023 Amsterdam [u.a.] (DE-627)ELV009440992 volume:129 year:2022 pages:0 https://doi.org/10.1016/j.mejo.2022.105582 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 44.85 Kardiologie Angiologie VZ AR 129 2022 0 |
allfieldsGer |
10.1016/j.mejo.2022.105582 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001939.pica (DE-627)ELV059293292 (ELSEVIER)S0026-2692(22)00211-7 DE-627 ger DE-627 rakwb eng 610 VZ 44.85 bkl Miao, Min verfasserin aut A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. Electromagnetic interference (EMI) Elsevier Shielding effectiveness (SE) Elsevier System-in-package (SiP) Elsevier Microstrip antenna Elsevier Electromagnetic shielding Elsevier Test fixture Elsevier Zhang, Danya oth Nie, Xin oth Bu, Jingpeng oth Enthalten in Elsevier Science Kokkinos, Peter ELSEVIER Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease 2023 Amsterdam [u.a.] (DE-627)ELV009440992 volume:129 year:2022 pages:0 https://doi.org/10.1016/j.mejo.2022.105582 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 44.85 Kardiologie Angiologie VZ AR 129 2022 0 |
allfieldsSound |
10.1016/j.mejo.2022.105582 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001939.pica (DE-627)ELV059293292 (ELSEVIER)S0026-2692(22)00211-7 DE-627 ger DE-627 rakwb eng 610 VZ 44.85 bkl Miao, Min verfasserin aut A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging 2022transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. Electromagnetic interference (EMI) Elsevier Shielding effectiveness (SE) Elsevier System-in-package (SiP) Elsevier Microstrip antenna Elsevier Electromagnetic shielding Elsevier Test fixture Elsevier Zhang, Danya oth Nie, Xin oth Bu, Jingpeng oth Enthalten in Elsevier Science Kokkinos, Peter ELSEVIER Changes in Cardiorespiratory Fitness and Survival in Patients With or Without Cardiovascular Disease 2023 Amsterdam [u.a.] (DE-627)ELV009440992 volume:129 year:2022 pages:0 https://doi.org/10.1016/j.mejo.2022.105582 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U 44.85 Kardiologie Angiologie VZ AR 129 2022 0 |
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A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging |
abstract |
At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. |
abstractGer |
At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. |
abstract_unstemmed |
At present, one of the major measures to suppress electromagnetic (EM) radiation inside advanced integrated microelectronic packages is the proper placement of electromagnetic shielding. Existing shielding effectiveness (SE) characterization technologies are always intended for enclosure evaluation, which are costly and time consuming, demanding complicated test instrument configuration, fixture setup, and a large room to accommodate the whole test system, especially when broadband test is required in which a series of narrowband antennas are to be switched during the test; additionally, the way test samples are assembled is quite different from that in the final package application. Therefore, their practical value and adaptation in SE evaluation are limited in the view of the professionals engaged in micro/nano electronics package research, development, manufacturing and application, and indeed there exist urgent desires for a compact and cost-effective technology characterizing in-situ the broadband effectiveness of shielding materials for EM radiation suppression in high-density heterogeneously integrated packages and relevant miniaturized system integration scenarios. Accordingly, in this paper a compact dual-port microstrip antenna test fixture working in pairs is designed and prototyped, which provides a quasi in-situ environment for the test sample, and only a vector network analyzer (VNA) is needed which just measures the fixture port scattering parameters so as to conveniently and faithfully reveal the SE. Solid modeling and full-wave simulation for the broadband return loss, insertion loss and radiation pattern of the test setup are carried out by a high-frequency electromagnetic structural analysis software for design verification. The actual test is carried out by loading heat insulation board, heat insulation board laminated with aluminum foil, PureBlue board and FR4 board samples. By comparing the SE of different materials, the validity for the proposed microstrip antenna test fixture in characterization is confirmed. |
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A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging |
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