Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating
In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nit...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Huang, Junjun [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2023transfer abstract |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: No title available - an international journal, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:231 ; year:2023 ; day:5 ; month:01 ; pages:0 |
| Links: |
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| DOI / URN: |
10.1016/j.compscitech.2022.109819 |
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ELV059584173 |
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| 100 | 1 | |a Huang, Junjun |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating |
| 264 | 1 | |c 2023transfer abstract | |
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| 520 | |a In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. | ||
| 520 | |a In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. | ||
| 650 | 7 | |a Hybrid composites |2 Elsevier | |
| 650 | 7 | |a Nano particles |2 Elsevier | |
| 650 | 7 | |a Surface treatments |2 Elsevier | |
| 650 | 7 | |a Interface |2 Elsevier | |
| 700 | 1 | |a Sun, Di |4 oth | |
| 700 | 1 | |a Yang, Guisheng |4 oth | |
| 700 | 1 | |a Ma, Haodong |4 oth | |
| 700 | 1 | |a Chen, Zhenming |4 oth | |
| 700 | 1 | |a Wang, Shufeng |4 oth | |
| 700 | 1 | |a Li, Peng |4 oth | |
| 700 | 1 | |a Li, Honglin |4 oth | |
| 700 | 1 | |a Gui, Chengmei |4 oth | |
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10.1016/j.compscitech.2022.109819 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584173 (ELSEVIER)S0266-3538(22)00561-9 DE-627 ger DE-627 rakwb eng Huang, Junjun verfasserin aut Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. Hybrid composites Elsevier Nano particles Elsevier Surface treatments Elsevier Interface Elsevier Sun, Di oth Yang, Guisheng oth Ma, Haodong oth Chen, Zhenming oth Wang, Shufeng oth Li, Peng oth Li, Honglin oth Gui, Chengmei oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109819 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
| spelling |
10.1016/j.compscitech.2022.109819 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584173 (ELSEVIER)S0266-3538(22)00561-9 DE-627 ger DE-627 rakwb eng Huang, Junjun verfasserin aut Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. Hybrid composites Elsevier Nano particles Elsevier Surface treatments Elsevier Interface Elsevier Sun, Di oth Yang, Guisheng oth Ma, Haodong oth Chen, Zhenming oth Wang, Shufeng oth Li, Peng oth Li, Honglin oth Gui, Chengmei oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109819 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
| allfields_unstemmed |
10.1016/j.compscitech.2022.109819 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584173 (ELSEVIER)S0266-3538(22)00561-9 DE-627 ger DE-627 rakwb eng Huang, Junjun verfasserin aut Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. Hybrid composites Elsevier Nano particles Elsevier Surface treatments Elsevier Interface Elsevier Sun, Di oth Yang, Guisheng oth Ma, Haodong oth Chen, Zhenming oth Wang, Shufeng oth Li, Peng oth Li, Honglin oth Gui, Chengmei oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109819 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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10.1016/j.compscitech.2022.109819 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584173 (ELSEVIER)S0266-3538(22)00561-9 DE-627 ger DE-627 rakwb eng Huang, Junjun verfasserin aut Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. Hybrid composites Elsevier Nano particles Elsevier Surface treatments Elsevier Interface Elsevier Sun, Di oth Yang, Guisheng oth Ma, Haodong oth Chen, Zhenming oth Wang, Shufeng oth Li, Peng oth Li, Honglin oth Gui, Chengmei oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109819 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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10.1016/j.compscitech.2022.109819 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584173 (ELSEVIER)S0266-3538(22)00561-9 DE-627 ger DE-627 rakwb eng Huang, Junjun verfasserin aut Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. Hybrid composites Elsevier Nano particles Elsevier Surface treatments Elsevier Interface Elsevier Sun, Di oth Yang, Guisheng oth Ma, Haodong oth Chen, Zhenming oth Wang, Shufeng oth Li, Peng oth Li, Honglin oth Gui, Chengmei oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109819 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. 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facile process for surface metalization: rational design of ag nanoparticle/polymer brush toward high-efficiency electroless plating |
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Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating |
| abstract |
In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. |
| abstractGer |
In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. |
| abstract_unstemmed |
In order to realize the convenient process of metalization on different materials and make electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was synthesized, which components include deionized water, 3-aminopropyl triethoxysilane, polyvinyl alcohol, and silver nitrate. It is worth noting that because the surface of MLAg contains a large number of -NH2 and -OH groups, it can be coated on different substrate surfaces through a process of rapid film formation (in situ film generation, brush coating, and dip coating) with a special structure (silver nanoparticles/polymer brush (Ag/PB) structure). Of note, we introduced polyvinyl alcohol as a structural optimization scheme to improve the structure of the Ag/PB interface (enhancing the Ag adsorption strength and electronic structure), which has a beneficial inhibitory effect on the growth of Ag grains. Of note, the MLAg/Ag interfacial force is a strong bond cooperation by means of covalent bond. The results show that the polyhedral Ag particles are composed of triangular (111) and square (100) crystal planes, and are evenly distributed on the surface of the substrate with outstanding film-forming performance, speed and catalytic ability. In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. Furthermore, the excellent film-forming and catalytic capacity of as-fabricated MLAg make it suitable for a pre-treated material with a metallized surface. |
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Facile process for surface metalization: Rational design of Ag nanoparticle/polymer brush toward high-efficiency electroless plating |
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Sun, Di Yang, Guisheng Ma, Haodong Chen, Zhenming Wang, Shufeng Li, Peng Li, Honglin Gui, Chengmei |
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In the Cu chemical plating solution, HCHO exhibits an unstable free state and transforms into H-COOH, Ag d-orbitals and open orbitals donate their charge to Cu2+, enabling reduction to Cu atom, and thereby deposition on substrate surface. 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