Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging
Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synth...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhang, Zongwu [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2023transfer abstract |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: No title available - an international journal, Amsterdam [u.a.] |
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| Übergeordnetes Werk: |
volume:231 ; year:2023 ; day:5 ; month:01 ; pages:0 |
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| DOI / URN: |
10.1016/j.compscitech.2022.109825 |
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ELV059584203 |
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| 245 | 1 | 0 | |a Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging |
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| 520 | |a Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. | ||
| 520 | |a Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. | ||
| 650 | 7 | |a Thermal properties |2 Elsevier | |
| 650 | 7 | |a Mechanical properties |2 Elsevier | |
| 650 | 7 | |a porosity/voids |2 Elsevier | |
| 650 | 7 | |a Dielectricity |2 Elsevier | |
| 650 | 7 | |a Multifunctional composites |2 Elsevier | |
| 700 | 1 | |a Zhou, Yijie |4 oth | |
| 700 | 1 | |a Yang, Yu |4 oth | |
| 700 | 1 | |a Ma, Xiaoyan |4 oth | |
| 700 | 1 | |a Xuan, Lixin |4 oth | |
| 700 | 1 | |a Wu, Xiao |4 oth | |
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10.1016/j.compscitech.2022.109825 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584203 (ELSEVIER)S0266-3538(22)00567-X DE-627 ger DE-627 rakwb eng Zhang, Zongwu verfasserin aut Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Thermal properties Elsevier Mechanical properties Elsevier porosity/voids Elsevier Dielectricity Elsevier Multifunctional composites Elsevier Zhou, Yijie oth Yang, Yu oth Ma, Xiaoyan oth Xuan, Lixin oth Wu, Xiao oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109825 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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10.1016/j.compscitech.2022.109825 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584203 (ELSEVIER)S0266-3538(22)00567-X DE-627 ger DE-627 rakwb eng Zhang, Zongwu verfasserin aut Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Thermal properties Elsevier Mechanical properties Elsevier porosity/voids Elsevier Dielectricity Elsevier Multifunctional composites Elsevier Zhou, Yijie oth Yang, Yu oth Ma, Xiaoyan oth Xuan, Lixin oth Wu, Xiao oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109825 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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10.1016/j.compscitech.2022.109825 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584203 (ELSEVIER)S0266-3538(22)00567-X DE-627 ger DE-627 rakwb eng Zhang, Zongwu verfasserin aut Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Thermal properties Elsevier Mechanical properties Elsevier porosity/voids Elsevier Dielectricity Elsevier Multifunctional composites Elsevier Zhou, Yijie oth Yang, Yu oth Ma, Xiaoyan oth Xuan, Lixin oth Wu, Xiao oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109825 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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10.1016/j.compscitech.2022.109825 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584203 (ELSEVIER)S0266-3538(22)00567-X DE-627 ger DE-627 rakwb eng Zhang, Zongwu verfasserin aut Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Thermal properties Elsevier Mechanical properties Elsevier porosity/voids Elsevier Dielectricity Elsevier Multifunctional composites Elsevier Zhou, Yijie oth Yang, Yu oth Ma, Xiaoyan oth Xuan, Lixin oth Wu, Xiao oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109825 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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10.1016/j.compscitech.2022.109825 doi /cbs_pica/cbs_olc/import_discovery/elsevier/einzuspielen/GBV00000000001973.pica (DE-627)ELV059584203 (ELSEVIER)S0266-3538(22)00567-X DE-627 ger DE-627 rakwb eng Zhang, Zongwu verfasserin aut Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging 2023transfer abstract nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. Thermal properties Elsevier Mechanical properties Elsevier porosity/voids Elsevier Dielectricity Elsevier Multifunctional composites Elsevier Zhou, Yijie oth Yang, Yu oth Ma, Xiaoyan oth Xuan, Lixin oth Wu, Xiao oth Enthalten in Elsevier No title available an international journal Amsterdam [u.a.] (DE-627)ELV013958402 nnns volume:231 year:2023 day:5 month:01 pages:0 https://doi.org/10.1016/j.compscitech.2022.109825 Volltext GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_40 AR 231 2023 5 0105 0 |
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Zhang, Zongwu Elsevier Thermal properties Elsevier Mechanical properties Elsevier porosity/voids Elsevier Dielectricity Elsevier Multifunctional composites Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging |
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synthesis of tetra(epoxy)-terminated open-cage poss and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging |
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Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging |
| abstract |
Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. |
| abstractGer |
Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. |
| abstract_unstemmed |
Polyhedral oligomeric silsesquioxanes (POSSs) are ideal particles to reduce the dielectric constant (k) and loss (tan δ ) values of resin matrixes for electronic packaging, but greatly limited by its finite addition due to phase-separation. Herein, tetra(epoxy)-terminated open-cage TG-POSS was synthesized and utilized as a unique building block to crosslink with bisphenol A or hexafluoro-bisphenol A, respectively, for the preparation of novel high performance low-k composites (POSS/BPA or POSS/FBPA). Results reveal that such rational design endows these two materials with homogeneous hybridization even at high POSS loading (>72.0 wt%), which is the main reason for superior dielectric, thermal and hydrophobic properties as compared with counterparts reported previously. Especially, fluorinated POSS/FBPA shows the lowest k value of 2.38, lowest tan δ value of 0.008, highest initial decomposition temperature of 396.1 °C and largest water contact angle of 117.0°, under the extra-contribution of trifluoromethyl units. In addition, its well-dispersed, moderate-crosslinked and rigid-flexible polymer network also leads to outstanding mechanical properties (elongation at break of 3.50% and modulus of 2.75 GPa) for practical applications. Summarily, this work highlights a useful strategy to fabricate high performance low-k composites with high POSS content, which is not only potential for advanced microelectronic industry but also instructive for academic fields. |
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Synthesis of tetra(epoxy)-terminated open-cage POSS and its particle thermo-crosslinking with diphenols for fabricating high performance low-k composites adopted in electronic packaging |
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