Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing

In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductiv...
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Autor*in:	Li, Xiuqing [verfasserIn] Wang, Qi [verfasserIn] Wei, Shizhong [verfasserIn] Lou, Wenpeng [verfasserIn] Liang, Jingkun [verfasserIn] Chen, Liangdong [verfasserIn] Xu, Liujie [verfasserIn] Zhou, Yucheng [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2023

Schlagwörter:	Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties

Übergeordnetes Werk:	Enthalten in: Journal of alloys and compounds - Lausanne : Elsevier, 1991, 970
Übergeordnetes Werk:	volume:970

DOI / URN:	10.1016/j.jallcom.2023.172571

Katalog-ID:	ELV065452313

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100	1		\|a Li, Xiuqing \|e verfasserin \|0 (orcid)0000-0003-0034-2468 \|4 aut
245	1	0	\|a Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing
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520			\|a In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles.
650		4	\|a Spray drying method
650		4	\|a HIP
650		4	\|a Cu-20W composite
650		4	\|a Nanoparticle
650		4	\|a High-temperature mechanical properties
700	1		\|a Wang, Qi \|e verfasserin \|4 aut
700	1		\|a Wei, Shizhong \|e verfasserin \|4 aut
700	1		\|a Lou, Wenpeng \|e verfasserin \|4 aut
700	1		\|a Liang, Jingkun \|e verfasserin \|4 aut
700	1		\|a Chen, Liangdong \|e verfasserin \|4 aut
700	1		\|a Xu, Liujie \|e verfasserin \|4 aut
700	1		\|a Zhou, Yucheng \|e verfasserin \|4 aut
773	0	8	\|i Enthalten in \|t Journal of alloys and compounds \|d Lausanne : Elsevier, 1991 \|g 970 \|h Online-Ressource \|w (DE-627)320504646 \|w (DE-600)2012675-X \|w (DE-576)098615009 \|7 nnns
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publishDate	2023
allfields	10.1016/j.jallcom.2023.172571 doi (DE-627)ELV065452313 (ELSEVIER)S0925-8388(23)03874-4 DE-627 ger DE-627 rda eng 670 540 VZ 51.54 bkl 33.61 bkl 35.90 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles. Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Liang, Jingkun verfasserin aut Chen, Liangdong verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Journal of alloys and compounds Lausanne : Elsevier, 1991 970 Online-Ressource (DE-627)320504646 (DE-600)2012675-X (DE-576)098615009 nnns volume:970 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.54 Nichteisenmetalle und ihre Legierungen VZ 33.61 Festkörperphysik VZ 35.90 Festkörperchemie VZ AR 970
spelling	10.1016/j.jallcom.2023.172571 doi (DE-627)ELV065452313 (ELSEVIER)S0925-8388(23)03874-4 DE-627 ger DE-627 rda eng 670 540 VZ 51.54 bkl 33.61 bkl 35.90 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles. Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Liang, Jingkun verfasserin aut Chen, Liangdong verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Journal of alloys and compounds Lausanne : Elsevier, 1991 970 Online-Ressource (DE-627)320504646 (DE-600)2012675-X (DE-576)098615009 nnns volume:970 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.54 Nichteisenmetalle und ihre Legierungen VZ 33.61 Festkörperphysik VZ 35.90 Festkörperchemie VZ AR 970
allfields_unstemmed	10.1016/j.jallcom.2023.172571 doi (DE-627)ELV065452313 (ELSEVIER)S0925-8388(23)03874-4 DE-627 ger DE-627 rda eng 670 540 VZ 51.54 bkl 33.61 bkl 35.90 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles. Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Liang, Jingkun verfasserin aut Chen, Liangdong verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Journal of alloys and compounds Lausanne : Elsevier, 1991 970 Online-Ressource (DE-627)320504646 (DE-600)2012675-X (DE-576)098615009 nnns volume:970 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.54 Nichteisenmetalle und ihre Legierungen VZ 33.61 Festkörperphysik VZ 35.90 Festkörperchemie VZ AR 970
allfieldsGer	10.1016/j.jallcom.2023.172571 doi (DE-627)ELV065452313 (ELSEVIER)S0925-8388(23)03874-4 DE-627 ger DE-627 rda eng 670 540 VZ 51.54 bkl 33.61 bkl 35.90 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles. Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Liang, Jingkun verfasserin aut Chen, Liangdong verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Journal of alloys and compounds Lausanne : Elsevier, 1991 970 Online-Ressource (DE-627)320504646 (DE-600)2012675-X (DE-576)098615009 nnns volume:970 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.54 Nichteisenmetalle und ihre Legierungen VZ 33.61 Festkörperphysik VZ 35.90 Festkörperchemie VZ AR 970
allfieldsSound	10.1016/j.jallcom.2023.172571 doi (DE-627)ELV065452313 (ELSEVIER)S0925-8388(23)03874-4 DE-627 ger DE-627 rda eng 670 540 VZ 51.54 bkl 33.61 bkl 35.90 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles. Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Liang, Jingkun verfasserin aut Chen, Liangdong verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Journal of alloys and compounds Lausanne : Elsevier, 1991 970 Online-Ressource (DE-627)320504646 (DE-600)2012675-X (DE-576)098615009 nnns volume:970 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.54 Nichteisenmetalle und ihre Legierungen VZ 33.61 Festkörperphysik VZ 35.90 Festkörperchemie VZ AR 970
language	English
source	Enthalten in Journal of alloys and compounds 970 volume:970
sourceStr	Enthalten in Journal of alloys and compounds 970 volume:970
format_phy_str_mv	Article
bklname	Nichteisenmetalle und ihre Legierungen Festkörperphysik Festkörperchemie
institution	findex.gbv.de
topic_facet	Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties
dewey-raw	670
isfreeaccess_bool	false
container_title	Journal of alloys and compounds
authorswithroles_txt_mv	Li, Xiuqing @@aut@@ Wang, Qi @@aut@@ Wei, Shizhong @@aut@@ Lou, Wenpeng @@aut@@ Liang, Jingkun @@aut@@ Chen, Liangdong @@aut@@ Xu, Liujie @@aut@@ Zhou, Yucheng @@aut@@
publishDateDaySort_date	2023-01-01T00:00:00Z
hierarchy_top_id	320504646
dewey-sort	3670
id	ELV065452313
language_de	englisch
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The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. 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author	Li, Xiuqing
spellingShingle	Li, Xiuqing ddc 670 bkl 51.54 bkl 33.61 bkl 35.90 misc Spray drying method misc HIP misc Cu-20W composite misc Nanoparticle misc High-temperature mechanical properties Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing
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topic_title	670 540 VZ 51.54 bkl 33.61 bkl 35.90 bkl Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing Spray drying method HIP Cu-20W composite Nanoparticle High-temperature mechanical properties
topic	ddc 670 bkl 51.54 bkl 33.61 bkl 35.90 misc Spray drying method misc HIP misc Cu-20W composite misc Nanoparticle misc High-temperature mechanical properties
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title	Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing
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title_full	Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing
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title_sort	microstructure and high-temperature mechanical properties of cu-w composite prepared by hot isostatic pressing
title_auth	Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing
abstract	In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles.
abstractGer	In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles.
abstract_unstemmed	In current work, Cu-20wt%W (Cu-20W) composite of near theoretical density (99.69 %) and high electrical conductivity (86.78 %IACS) was fabricated by spray drying technique and hot isostatic pressing (HIP), aiming to enhance the mechanical properties of Cu-W composite while maintaining high conductivity. The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). The strength of Cu-20W composite is heightened by combining fine-grain strengthening and dispersion strengthening due to the introduced W nanoparticles.
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title_short	Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing
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author2	Wang, Qi Wei, Shizhong Lou, Wenpeng Liang, Jingkun Chen, Liangdong Xu, Liujie Zhou, Yucheng
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doi_str	10.1016/j.jallcom.2023.172571
up_date	2024-07-06T23:04:48.806Z
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The impacts of W nanoparticles on the microstructure and properties of Cu-20W samples were evaluated. Adding W nanoparticles can remarkably refine the grain of Cu and strengthen the Cu-W composite through a pinning effect. Room temperature tensile strength and compressive yield strength of Cu-20W composite were 380 MPa and 304.49 MPa, which are 117.14 % and 616.95 % higher than that of pure Cu (175 MPa and 42.47 MPa), respectively. Tungsten nanoparticles can promote the high-temperature reliability of Cu-W samples. Tensile strength of pure Cu and Cu-20W sample gradually decreased with increasing test temperature, but the percentage increment of tensile strength increased. The tungsten particles pinned at grain boundaries during hot deformation inhibit recrystallization grain growth and hinder dislocation movement, thereby contributing to the high-temperature properties of Cu-20W composite. The peak stress of Cu-20W sample is 146.60 % higher than pure Cu, even at close to the melting point of Cu (940 °C). 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Microstructure and high-temperature mechanical properties of Cu-W composite prepared by hot isostatic pressing

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