Super-flexible and highly conductive H-Ti

2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferi...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Ye, Xiao-Ai [verfasserIn] Zhang, Si-Ying [verfasserIn] Zhao, Da-Qiang [verfasserIn] Ding, Ling [verfasserIn] Fang, Kan [verfasserIn] Zhou, Xu [verfasserIn] Wang, Gui-Gen [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2023

Schlagwörter:	A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing

Übergeordnetes Werk:	Enthalten in: Composites / A - Amsterdam [u.a.] : Elsevier, 1996, 176
Übergeordnetes Werk:	volume:176

DOI / URN:	10.1016/j.compositesa.2023.107866

Katalog-ID:	ELV065709187

Internformat


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520			\|a 2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s).
650		4	\|a A. 3-Dimensional reinforcement
650		4	\|a A. Layered structures
650		4	\|a B. EMI shielding
650		4	\|a D. Mechanical testing
700	1		\|a Zhang, Si-Ying \|e verfasserin \|4 aut
700	1		\|a Zhao, Da-Qiang \|e verfasserin \|4 aut
700	1		\|a Ding, Ling \|e verfasserin \|4 aut
700	1		\|a Fang, Kan \|e verfasserin \|4 aut
700	1		\|a Zhou, Xu \|e verfasserin \|4 aut
700	1		\|a Wang, Gui-Gen \|e verfasserin \|4 aut
773	0	8	\|i Enthalten in \|t Composites / A \|d Amsterdam [u.a.] : Elsevier, 1996 \|g 176 \|h Online-Ressource \|w (DE-627)320501078 \|w (DE-600)2012223-8 \|w (DE-576)094531404 \|7 nnns
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912			\|a GBV_USEFLAG_U
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912			\|a GBV_ILN_24
912			\|a GBV_ILN_31
912			\|a GBV_ILN_32
912			\|a GBV_ILN_40
912			\|a GBV_ILN_60
912			\|a GBV_ILN_62
912			\|a GBV_ILN_65
912			\|a GBV_ILN_69
912			\|a GBV_ILN_70
912			\|a GBV_ILN_73
912			\|a GBV_ILN_74
912			\|a GBV_ILN_90
912			\|a GBV_ILN_95
912			\|a GBV_ILN_100
912			\|a GBV_ILN_105
912			\|a GBV_ILN_110
912			\|a GBV_ILN_150
912			\|a GBV_ILN_151
912			\|a GBV_ILN_187
912			\|a GBV_ILN_213
912			\|a GBV_ILN_224
912			\|a GBV_ILN_230
912			\|a GBV_ILN_370
912			\|a GBV_ILN_602
912			\|a GBV_ILN_702
912			\|a GBV_ILN_2001
912			\|a GBV_ILN_2003
912			\|a GBV_ILN_2004
912			\|a GBV_ILN_2005
912			\|a GBV_ILN_2007
912			\|a GBV_ILN_2008
912			\|a GBV_ILN_2009
912			\|a GBV_ILN_2010
912			\|a GBV_ILN_2011
912			\|a GBV_ILN_2014
912			\|a GBV_ILN_2015
912			\|a GBV_ILN_2020
912			\|a GBV_ILN_2021
912			\|a GBV_ILN_2025
912			\|a GBV_ILN_2026
912			\|a GBV_ILN_2027
912			\|a GBV_ILN_2034
912			\|a GBV_ILN_2044
912			\|a GBV_ILN_2048
912			\|a GBV_ILN_2049
912			\|a GBV_ILN_2050
912			\|a GBV_ILN_2055
912			\|a GBV_ILN_2056
912			\|a GBV_ILN_2059
912			\|a GBV_ILN_2061
912			\|a GBV_ILN_2064
912			\|a GBV_ILN_2088
912			\|a GBV_ILN_2106
912			\|a GBV_ILN_2110
912			\|a GBV_ILN_2111
912			\|a GBV_ILN_2112
912			\|a GBV_ILN_2122
912			\|a GBV_ILN_2129
912			\|a GBV_ILN_2143
912			\|a GBV_ILN_2152
912			\|a GBV_ILN_2153
912			\|a GBV_ILN_2190
912			\|a GBV_ILN_2232
912			\|a GBV_ILN_2336
912			\|a GBV_ILN_2411
912			\|a GBV_ILN_2470
912			\|a GBV_ILN_2507
912			\|a GBV_ILN_4035
912			\|a GBV_ILN_4037
912			\|a GBV_ILN_4112
912			\|a GBV_ILN_4125
912			\|a GBV_ILN_4242
912			\|a GBV_ILN_4249
912			\|a GBV_ILN_4251
912			\|a GBV_ILN_4305
912			\|a GBV_ILN_4306
912			\|a GBV_ILN_4307
912			\|a GBV_ILN_4313
912			\|a GBV_ILN_4322
912			\|a GBV_ILN_4323
912			\|a GBV_ILN_4324
912			\|a GBV_ILN_4325
912			\|a GBV_ILN_4326
912			\|a GBV_ILN_4333
912			\|a GBV_ILN_4334
912			\|a GBV_ILN_4338
912			\|a GBV_ILN_4393
912			\|a GBV_ILN_4700
936	b	k	\|a 51.75 \|j Verbundwerkstoffe \|j Schichtstoffe \|q VZ
951			\|a AR
952			\|d 176

Indexfelder

author_variant	x a y xay s y z syz d q z dqz l d ld k f kf x z xz g g w ggw
matchkey_str	yexiaoaizhangsiyingzhaodaqiangdinglingfa:2023----:uefeiladihyo
hierarchy_sort_str	2023
bklnumber	51.75
publishDate	2023
allfields	10.1016/j.compositesa.2023.107866 doi (DE-627)ELV065709187 (ELSEVIER)S1359-835X(23)00442-6 DE-627 ger DE-627 rda eng 660 VZ 51.75 bkl Ye, Xiao-Ai verfasserin aut Super-flexible and highly conductive H-Ti 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier 2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s). A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing Zhang, Si-Ying verfasserin aut Zhao, Da-Qiang verfasserin aut Ding, Ling verfasserin aut Fang, Kan verfasserin aut Zhou, Xu verfasserin aut Wang, Gui-Gen verfasserin aut Enthalten in Composites / A Amsterdam [u.a.] : Elsevier, 1996 176 Online-Ressource (DE-627)320501078 (DE-600)2012223-8 (DE-576)094531404 nnns volume:176 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2411 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.75 Verbundwerkstoffe Schichtstoffe VZ AR 176
spelling	10.1016/j.compositesa.2023.107866 doi (DE-627)ELV065709187 (ELSEVIER)S1359-835X(23)00442-6 DE-627 ger DE-627 rda eng 660 VZ 51.75 bkl Ye, Xiao-Ai verfasserin aut Super-flexible and highly conductive H-Ti 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier 2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s). A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing Zhang, Si-Ying verfasserin aut Zhao, Da-Qiang verfasserin aut Ding, Ling verfasserin aut Fang, Kan verfasserin aut Zhou, Xu verfasserin aut Wang, Gui-Gen verfasserin aut Enthalten in Composites / A Amsterdam [u.a.] : Elsevier, 1996 176 Online-Ressource (DE-627)320501078 (DE-600)2012223-8 (DE-576)094531404 nnns volume:176 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2411 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.75 Verbundwerkstoffe Schichtstoffe VZ AR 176
allfields_unstemmed	10.1016/j.compositesa.2023.107866 doi (DE-627)ELV065709187 (ELSEVIER)S1359-835X(23)00442-6 DE-627 ger DE-627 rda eng 660 VZ 51.75 bkl Ye, Xiao-Ai verfasserin aut Super-flexible and highly conductive H-Ti 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier 2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s). A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing Zhang, Si-Ying verfasserin aut Zhao, Da-Qiang verfasserin aut Ding, Ling verfasserin aut Fang, Kan verfasserin aut Zhou, Xu verfasserin aut Wang, Gui-Gen verfasserin aut Enthalten in Composites / A Amsterdam [u.a.] : Elsevier, 1996 176 Online-Ressource (DE-627)320501078 (DE-600)2012223-8 (DE-576)094531404 nnns volume:176 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2411 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.75 Verbundwerkstoffe Schichtstoffe VZ AR 176
allfieldsGer	10.1016/j.compositesa.2023.107866 doi (DE-627)ELV065709187 (ELSEVIER)S1359-835X(23)00442-6 DE-627 ger DE-627 rda eng 660 VZ 51.75 bkl Ye, Xiao-Ai verfasserin aut Super-flexible and highly conductive H-Ti 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier 2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s). A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing Zhang, Si-Ying verfasserin aut Zhao, Da-Qiang verfasserin aut Ding, Ling verfasserin aut Fang, Kan verfasserin aut Zhou, Xu verfasserin aut Wang, Gui-Gen verfasserin aut Enthalten in Composites / A Amsterdam [u.a.] : Elsevier, 1996 176 Online-Ressource (DE-627)320501078 (DE-600)2012223-8 (DE-576)094531404 nnns volume:176 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2411 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.75 Verbundwerkstoffe Schichtstoffe VZ AR 176
allfieldsSound	10.1016/j.compositesa.2023.107866 doi (DE-627)ELV065709187 (ELSEVIER)S1359-835X(23)00442-6 DE-627 ger DE-627 rda eng 660 VZ 51.75 bkl Ye, Xiao-Ai verfasserin aut Super-flexible and highly conductive H-Ti 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier 2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s). A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing Zhang, Si-Ying verfasserin aut Zhao, Da-Qiang verfasserin aut Ding, Ling verfasserin aut Fang, Kan verfasserin aut Zhou, Xu verfasserin aut Wang, Gui-Gen verfasserin aut Enthalten in Composites / A Amsterdam [u.a.] : Elsevier, 1996 176 Online-Ressource (DE-627)320501078 (DE-600)2012223-8 (DE-576)094531404 nnns volume:176 GBV_USEFLAG_U GBV_ELV SYSFLAG_U SSG-OLC-PHA GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2411 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.75 Verbundwerkstoffe Schichtstoffe VZ AR 176
language	English
source	Enthalten in Composites / A 176 volume:176
sourceStr	Enthalten in Composites / A 176 volume:176
format_phy_str_mv	Article
bklname	Verbundwerkstoffe Schichtstoffe
institution	findex.gbv.de
topic_facet	A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing
dewey-raw	660
isfreeaccess_bool	false
container_title	Composites / A
authorswithroles_txt_mv	Ye, Xiao-Ai @@aut@@ Zhang, Si-Ying @@aut@@ Zhao, Da-Qiang @@aut@@ Ding, Ling @@aut@@ Fang, Kan @@aut@@ Zhou, Xu @@aut@@ Wang, Gui-Gen @@aut@@
publishDateDaySort_date	2023-01-01T00:00:00Z
hierarchy_top_id	320501078
dewey-sort	3660
id	ELV065709187
language_de	englisch
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author	Ye, Xiao-Ai
spellingShingle	Ye, Xiao-Ai ddc 660 bkl 51.75 misc A. 3-Dimensional reinforcement misc A. Layered structures misc B. EMI shielding misc D. Mechanical testing Super-flexible and highly conductive H-Ti
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topic_title	660 VZ 51.75 bkl Super-flexible and highly conductive H-Ti A. 3-Dimensional reinforcement A. Layered structures B. EMI shielding D. Mechanical testing
topic	ddc 660 bkl 51.75 misc A. 3-Dimensional reinforcement misc A. Layered structures misc B. EMI shielding misc D. Mechanical testing
topic_unstemmed	ddc 660 bkl 51.75 misc A. 3-Dimensional reinforcement misc A. Layered structures misc B. EMI shielding misc D. Mechanical testing
topic_browse	ddc 660 bkl 51.75 misc A. 3-Dimensional reinforcement misc A. Layered structures misc B. EMI shielding misc D. Mechanical testing
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title	Super-flexible and highly conductive H-Ti
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title_full	Super-flexible and highly conductive H-Ti
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title_sort	super-flexible and highly conductive h-ti
title_auth	Super-flexible and highly conductive H-Ti
abstract	2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s).
abstractGer	2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s).
abstract_unstemmed	2D MXene are showing great prospects for EMI shielding by virtue of abundant surface functional groups and outstanding metallic electrical conductivity. However, it remains a great challenge to simultaneously achieve flexible, lightweight and high stability in MXene shielding materials due to inferior mechanical strength and poor oxidation stability. Gelation paves up an effective and facile strategy to develop highly stable and conductive 3D porous Ti3C2Tx architectures. Herein, super-flexible and highly conductive H-Ti3C2Tx MXene composite films with 3D macro-assemblies for EMI shielding were fabricated through a gelation-densification process initiated by hydrochloric acids, and two-step vacuum-assisted filtration followed by freeze-casting approach. The obtained nanocomposite films manifest satisfactory mechanical properties with a tensile strength of 116.51 MPa, excellent EMI SE of 55.14 dB, superior SSE/t and high EMI SE retention after 5000 cycles of bending deformation. In addition, the as-prepared nanocomposite papers demonstrate outstanding thermal management performances such as rapid response time, high Joule heating temperature (118 °C) at low applied voltage (2.5 V) and eminent working stability (4000 s).
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title_short	Super-flexible and highly conductive H-Ti
remote_bool	true
author2	Zhang, Si-Ying Zhao, Da-Qiang Ding, Ling Fang, Kan Zhou, Xu Wang, Gui-Gen
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doi_str	10.1016/j.compositesa.2023.107866
up_date	2024-07-06T23:58:37.724Z
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