Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives
Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the pe...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Liao, Juan [verfasserIn] Wang, Lijuan [verfasserIn] Song, Ning [verfasserIn] Huang, Jian [verfasserIn] Zhao, Man [verfasserIn] Zhao, Meng [verfasserIn] Tang, Yunzhi [verfasserIn] Tan, Yuhui [verfasserIn] Fan, Xiaowei [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2023 |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: Materials science and engineering / B - New York, NY [u.a.] : Elsevier, 1988, 299 |
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| Übergeordnetes Werk: |
volume:299 |
| DOI / URN: |
10.1016/j.mseb.2023.116969 |
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| Katalog-ID: |
ELV066134587 |
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| 245 | 1 | 0 | |a Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives |
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| 520 | |a Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. | ||
| 650 | 4 | |a Lithium copper foil | |
| 650 | 4 | |a Additive | |
| 650 | 4 | |a Electrodeposition model | |
| 650 | 4 | |a Synergistic promotion | |
| 700 | 1 | |a Wang, Lijuan |e verfasserin |4 aut | |
| 700 | 1 | |a Song, Ning |e verfasserin |4 aut | |
| 700 | 1 | |a Huang, Jian |e verfasserin |4 aut | |
| 700 | 1 | |a Zhao, Man |e verfasserin |4 aut | |
| 700 | 1 | |a Zhao, Meng |e verfasserin |4 aut | |
| 700 | 1 | |a Tang, Yunzhi |e verfasserin |0 (orcid)0000-0003-1791-5234 |4 aut | |
| 700 | 1 | |a Tan, Yuhui |e verfasserin |4 aut | |
| 700 | 1 | |a Fan, Xiaowei |e verfasserin |4 aut | |
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10.1016/j.mseb.2023.116969 doi (DE-627)ELV066134587 (ELSEVIER)S0921-5107(23)00711-0 DE-627 ger DE-627 rda eng 600 670 VZ 51.00 bkl 51.45 bkl Liao, Juan verfasserin aut Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. Lithium copper foil Additive Electrodeposition model Synergistic promotion Wang, Lijuan verfasserin aut Song, Ning verfasserin aut Huang, Jian verfasserin aut Zhao, Man verfasserin aut Zhao, Meng verfasserin aut Tang, Yunzhi verfasserin (orcid)0000-0003-1791-5234 aut Tan, Yuhui verfasserin aut Fan, Xiaowei verfasserin aut Enthalten in Materials science and engineering / B New York, NY [u.a.] : Elsevier, 1988 299 Online-Ressource (DE-627)302720731 (DE-600)1492109-1 (DE-576)259483982 1873-4944 nnns volume:299 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ 51.45 Werkstoffe mit besonderen Eigenschaften VZ AR 299 |
| spelling |
10.1016/j.mseb.2023.116969 doi (DE-627)ELV066134587 (ELSEVIER)S0921-5107(23)00711-0 DE-627 ger DE-627 rda eng 600 670 VZ 51.00 bkl 51.45 bkl Liao, Juan verfasserin aut Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. Lithium copper foil Additive Electrodeposition model Synergistic promotion Wang, Lijuan verfasserin aut Song, Ning verfasserin aut Huang, Jian verfasserin aut Zhao, Man verfasserin aut Zhao, Meng verfasserin aut Tang, Yunzhi verfasserin (orcid)0000-0003-1791-5234 aut Tan, Yuhui verfasserin aut Fan, Xiaowei verfasserin aut Enthalten in Materials science and engineering / B New York, NY [u.a.] : Elsevier, 1988 299 Online-Ressource (DE-627)302720731 (DE-600)1492109-1 (DE-576)259483982 1873-4944 nnns volume:299 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ 51.45 Werkstoffe mit besonderen Eigenschaften VZ AR 299 |
| allfields_unstemmed |
10.1016/j.mseb.2023.116969 doi (DE-627)ELV066134587 (ELSEVIER)S0921-5107(23)00711-0 DE-627 ger DE-627 rda eng 600 670 VZ 51.00 bkl 51.45 bkl Liao, Juan verfasserin aut Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. Lithium copper foil Additive Electrodeposition model Synergistic promotion Wang, Lijuan verfasserin aut Song, Ning verfasserin aut Huang, Jian verfasserin aut Zhao, Man verfasserin aut Zhao, Meng verfasserin aut Tang, Yunzhi verfasserin (orcid)0000-0003-1791-5234 aut Tan, Yuhui verfasserin aut Fan, Xiaowei verfasserin aut Enthalten in Materials science and engineering / B New York, NY [u.a.] : Elsevier, 1988 299 Online-Ressource (DE-627)302720731 (DE-600)1492109-1 (DE-576)259483982 1873-4944 nnns volume:299 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ 51.45 Werkstoffe mit besonderen Eigenschaften VZ AR 299 |
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10.1016/j.mseb.2023.116969 doi (DE-627)ELV066134587 (ELSEVIER)S0921-5107(23)00711-0 DE-627 ger DE-627 rda eng 600 670 VZ 51.00 bkl 51.45 bkl Liao, Juan verfasserin aut Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. Lithium copper foil Additive Electrodeposition model Synergistic promotion Wang, Lijuan verfasserin aut Song, Ning verfasserin aut Huang, Jian verfasserin aut Zhao, Man verfasserin aut Zhao, Meng verfasserin aut Tang, Yunzhi verfasserin (orcid)0000-0003-1791-5234 aut Tan, Yuhui verfasserin aut Fan, Xiaowei verfasserin aut Enthalten in Materials science and engineering / B New York, NY [u.a.] : Elsevier, 1988 299 Online-Ressource (DE-627)302720731 (DE-600)1492109-1 (DE-576)259483982 1873-4944 nnns volume:299 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ 51.45 Werkstoffe mit besonderen Eigenschaften VZ AR 299 |
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10.1016/j.mseb.2023.116969 doi (DE-627)ELV066134587 (ELSEVIER)S0921-5107(23)00711-0 DE-627 ger DE-627 rda eng 600 670 VZ 51.00 bkl 51.45 bkl Liao, Juan verfasserin aut Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives 2023 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. Lithium copper foil Additive Electrodeposition model Synergistic promotion Wang, Lijuan verfasserin aut Song, Ning verfasserin aut Huang, Jian verfasserin aut Zhao, Man verfasserin aut Zhao, Meng verfasserin aut Tang, Yunzhi verfasserin (orcid)0000-0003-1791-5234 aut Tan, Yuhui verfasserin aut Fan, Xiaowei verfasserin aut Enthalten in Materials science and engineering / B New York, NY [u.a.] : Elsevier, 1988 299 Online-Ressource (DE-627)302720731 (DE-600)1492109-1 (DE-576)259483982 1873-4944 nnns volume:299 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ 51.45 Werkstoffe mit besonderen Eigenschaften VZ AR 299 |
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Liao, Juan @@aut@@ Wang, Lijuan @@aut@@ Song, Ning @@aut@@ Huang, Jian @@aut@@ Zhao, Man @@aut@@ Zhao, Meng @@aut@@ Tang, Yunzhi @@aut@@ Tan, Yuhui @@aut@@ Fan, Xiaowei @@aut@@ |
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Liao, Juan |
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600 670 VZ 51.00 bkl 51.45 bkl Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives Lithium copper foil Additive Electrodeposition model Synergistic promotion |
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preparation, micro-structure and characterization of high strength and low profile lithium copper foil with sps and hp additives |
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Preparation, micro-structure and characterization of high strength and low profile lithium copper foil with SPS and HP additives |
| abstract |
Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. |
| abstractGer |
Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. |
| abstract_unstemmed |
Copper foil is an important negative current collector material for lithium ion battery. Its mechanical properties and appropriate roughness have an important influence on the negative electrode and battery performance. Adding additives to the plating solution is an effective means to improve the performance of lithium copper foil. Here we prepared Cu-(SPS + HP) copper foil with a tensile strength of 570.57 MPa, elongation of 4.47%, and roughness of 0.812 μm. Moreover, the optical contact angle test shows that Cu-(SPS + HP) has the best surface wettability (the highest surface energy 50.62 mN/m). XRD and EBSD tests show that the fundamental reason for improving the mechanical properties of Cu-(SPS + HP) is the preferred orientation of the crystal plane (220) and the phenomenon of large grains including small grains. Besides, the electrochemical test of Cu-(SPS + HP) bath is conducted to determine the principle of additives in the plating process, cathodic reaction characteristics and electrocrystallization nucleation mechanism. Finally, we establish the electrodeposition model. The reaction behavior of SPS and HP in the plating process synergistically promoted the preparation of excellent performance lithium copper foil. |
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