Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents

In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared afte...
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Gespeichert in:

Autor*in:	Li, Xiuqing [verfasserIn] Wang, Qi [verfasserIn] Wei, Shizhong [verfasserIn] Lou, Wenpeng [verfasserIn] Xu, Liujie [verfasserIn] Zhou, Yucheng [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2024

Schlagwörter:	Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties

Übergeordnetes Werk:	Enthalten in: Materials science and engineering / A - Amsterdam : Elsevier, 1988, 892
Übergeordnetes Werk:	volume:892

DOI / URN:	10.1016/j.msea.2024.146090

Katalog-ID:	ELV066750970

Internformat


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520			\|a In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening.
650		4	\|a Spray drying method
650		4	\|a W-coated Cu powders
650		4	\|a Spark plasma sintering
650		4	\|a Nanoparticle
650		4	\|a Mechanical properties
700	1		\|a Wang, Qi \|e verfasserin \|4 aut
700	1		\|a Wei, Shizhong \|e verfasserin \|4 aut
700	1		\|a Lou, Wenpeng \|e verfasserin \|4 aut
700	1		\|a Xu, Liujie \|e verfasserin \|4 aut
700	1		\|a Zhou, Yucheng \|e verfasserin \|4 aut
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allfields	10.1016/j.msea.2024.146090 doi (DE-627)ELV066750970 (ELSEVIER)S0921-5093(24)00021-2 DE-627 ger DE-627 rda eng 600 670 530 VZ 51.00 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents 2024 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening. Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Materials science and engineering / A Amsterdam : Elsevier, 1988 892 Online-Ressource (DE-627)320500497 (DE-600)2012154-4 (DE-576)095299947 1873-4936 nnns volume:892 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ AR 892
spelling	10.1016/j.msea.2024.146090 doi (DE-627)ELV066750970 (ELSEVIER)S0921-5093(24)00021-2 DE-627 ger DE-627 rda eng 600 670 530 VZ 51.00 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents 2024 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening. Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Materials science and engineering / A Amsterdam : Elsevier, 1988 892 Online-Ressource (DE-627)320500497 (DE-600)2012154-4 (DE-576)095299947 1873-4936 nnns volume:892 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ AR 892
allfields_unstemmed	10.1016/j.msea.2024.146090 doi (DE-627)ELV066750970 (ELSEVIER)S0921-5093(24)00021-2 DE-627 ger DE-627 rda eng 600 670 530 VZ 51.00 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents 2024 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening. Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Materials science and engineering / A Amsterdam : Elsevier, 1988 892 Online-Ressource (DE-627)320500497 (DE-600)2012154-4 (DE-576)095299947 1873-4936 nnns volume:892 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ AR 892
allfieldsGer	10.1016/j.msea.2024.146090 doi (DE-627)ELV066750970 (ELSEVIER)S0921-5093(24)00021-2 DE-627 ger DE-627 rda eng 600 670 530 VZ 51.00 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents 2024 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening. Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Materials science and engineering / A Amsterdam : Elsevier, 1988 892 Online-Ressource (DE-627)320500497 (DE-600)2012154-4 (DE-576)095299947 1873-4936 nnns volume:892 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ AR 892
allfieldsSound	10.1016/j.msea.2024.146090 doi (DE-627)ELV066750970 (ELSEVIER)S0921-5093(24)00021-2 DE-627 ger DE-627 rda eng 600 670 530 VZ 51.00 bkl Li, Xiuqing verfasserin (orcid)0000-0003-0034-2468 aut Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents 2024 nicht spezifiziert zzz rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening. Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties Wang, Qi verfasserin aut Wei, Shizhong verfasserin aut Lou, Wenpeng verfasserin aut Xu, Liujie verfasserin aut Zhou, Yucheng verfasserin aut Enthalten in Materials science and engineering / A Amsterdam : Elsevier, 1988 892 Online-Ressource (DE-627)320500497 (DE-600)2012154-4 (DE-576)095299947 1873-4936 nnns volume:892 GBV_USEFLAG_U GBV_ELV SYSFLAG_U GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_150 GBV_ILN_151 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_370 GBV_ILN_602 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2034 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2088 GBV_ILN_2106 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2470 GBV_ILN_2507 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 Werkstoffkunde: Allgemeines VZ AR 892
language	English
source	Enthalten in Materials science and engineering / A 892 volume:892
sourceStr	Enthalten in Materials science and engineering / A 892 volume:892
format_phy_str_mv	Article
bklname	Werkstoffkunde: Allgemeines
institution	findex.gbv.de
topic_facet	Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties
dewey-raw	600
isfreeaccess_bool	false
container_title	Materials science and engineering / A
authorswithroles_txt_mv	Li, Xiuqing @@aut@@ Wang, Qi @@aut@@ Wei, Shizhong @@aut@@ Lou, Wenpeng @@aut@@ Xu, Liujie @@aut@@ Zhou, Yucheng @@aut@@
publishDateDaySort_date	2024-01-01T00:00:00Z
hierarchy_top_id	320500497
dewey-sort	3600
id	ELV066750970
language_de	englisch
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author	Li, Xiuqing
spellingShingle	Li, Xiuqing ddc 600 bkl 51.00 misc Spray drying method misc W-coated Cu powders misc Spark plasma sintering misc Nanoparticle misc Mechanical properties Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
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topic_title	600 670 530 VZ 51.00 bkl Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents Spray drying method W-coated Cu powders Spark plasma sintering Nanoparticle Mechanical properties
topic	ddc 600 bkl 51.00 misc Spray drying method misc W-coated Cu powders misc Spark plasma sintering misc Nanoparticle misc Mechanical properties
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title	Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
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title_full	Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
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title_sort	microstructure and characteristics of cu-w composite prepared by w-coated cu powder with different w contents
title_auth	Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
abstract	In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening.
abstractGer	In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening.
abstract_unstemmed	In this study, nanometer W particles were added to Cu matrix as reinforcement phase, aiming to maintain the excellent electrical conductivity of Cu matrix while significantly improving the mechanical performance of Cu-W composite. Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. The strength of Cu-W composite was improved by the pinning effect of W nanoparticles as a result of the combined effect of fine grain and dispersion strengthening.
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title_short	Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
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author2	Wang, Qi Wei, Shizhong Lou, Wenpeng Xu, Liujie Zhou, Yucheng
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doi_str	10.1016/j.msea.2024.146090
up_date	2024-07-06T18:51:53.840Z
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Cu-W composite powder with W nanoparticle coated Cu was prepared after spray drying and two-step hydrogen reduction. Cu-W composite with different W contents (0 wt%, 5 wt%, 10 wt%, and 20 wt%) were fabricated by spark plasma sintering (SPS). The coating structure can refine Cu particle size and inhibit Cu grain growth during sintering. The impact of W nanoparticles on microstructure, physical and mechanical performance of Cu-W composite was studied. The average size of the W particles dispersed in Cu matrix ranged from 71.89 nm to 106.90 nm. Electron back-scatter diffraction (EBSD) statistics indicated that Cu-5 wt%W, Cu-10 wt%W, and Cu-20 wt%W composite had a mean grain size of 0.76 μm, 0.71 μm, and 0.57 μm, respectively. Cu-20 wt%W composite had a uniform W network-Cu pool structure. The room-temperature tensile strength of Cu-20 wt%W composite was up to 421.98 MPa, with an elongation of 10.91 %; and the room-temperature compressive yield strength reached 313.83 MPa, an increase of 71.76 % compared to pure Cu. Although adding W nanoparticles caused the decrease of electrical conductivity, the conductivity of all Cu-W samples exceeded 81 %. The (111) of Cu and (110) of W showed a semi-coherent relationship with a calculated mismatch parameter δ of 0.077 and good interfacial bonding. 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Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents

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