The 3-D IC with 4-layer structure for the fast range sensing system

The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will...
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Autor*in:	Akasaka, Y. Inoue, Y. Nakaya, M. Nishimura, T.

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	1991

Reproduktion:	Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
Übergeordnetes Werk:	in: Microelectronic Engineering - Amsterdam : Elsevier, 15(1991), 1-4, Seite 183-186
Übergeordnetes Werk:	volume:15 ; year:1991 ; number:1-4 ; pages:183-186

Links:	Link aufrufen

Katalog-ID:	NLEJ177989181

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allfields	(DE-627)NLEJ177989181 (DE-599)GBVNLZ177989181 DE-627 ger DE-627 rakwb eng The 3-D IC with 4-layer structure for the fast range sensing system 1991 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Akasaka, Y. oth Inoue, Y. oth Nakaya, M. oth Nishimura, T. oth in Microelectronic Engineering Amsterdam : Elsevier 15(1991), 1-4, Seite 183-186 (DE-627)NLEJ177331771 (DE-600)1497065-X 0167-9317 nnns volume:15 year:1991 number:1-4 pages:183-186 http://linkinghub.elsevier.com/retrieve/pii/0167-9317(91)90208-U GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 15 1991 1-4 183-186
spelling	(DE-627)NLEJ177989181 (DE-599)GBVNLZ177989181 DE-627 ger DE-627 rakwb eng The 3-D IC with 4-layer structure for the fast range sensing system 1991 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Akasaka, Y. oth Inoue, Y. oth Nakaya, M. oth Nishimura, T. oth in Microelectronic Engineering Amsterdam : Elsevier 15(1991), 1-4, Seite 183-186 (DE-627)NLEJ177331771 (DE-600)1497065-X 0167-9317 nnns volume:15 year:1991 number:1-4 pages:183-186 http://linkinghub.elsevier.com/retrieve/pii/0167-9317(91)90208-U GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 15 1991 1-4 183-186
allfields_unstemmed	(DE-627)NLEJ177989181 (DE-599)GBVNLZ177989181 DE-627 ger DE-627 rakwb eng The 3-D IC with 4-layer structure for the fast range sensing system 1991 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Akasaka, Y. oth Inoue, Y. oth Nakaya, M. oth Nishimura, T. oth in Microelectronic Engineering Amsterdam : Elsevier 15(1991), 1-4, Seite 183-186 (DE-627)NLEJ177331771 (DE-600)1497065-X 0167-9317 nnns volume:15 year:1991 number:1-4 pages:183-186 http://linkinghub.elsevier.com/retrieve/pii/0167-9317(91)90208-U GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 15 1991 1-4 183-186
allfieldsGer	(DE-627)NLEJ177989181 (DE-599)GBVNLZ177989181 DE-627 ger DE-627 rakwb eng The 3-D IC with 4-layer structure for the fast range sensing system 1991 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Akasaka, Y. oth Inoue, Y. oth Nakaya, M. oth Nishimura, T. oth in Microelectronic Engineering Amsterdam : Elsevier 15(1991), 1-4, Seite 183-186 (DE-627)NLEJ177331771 (DE-600)1497065-X 0167-9317 nnns volume:15 year:1991 number:1-4 pages:183-186 http://linkinghub.elsevier.com/retrieve/pii/0167-9317(91)90208-U GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 15 1991 1-4 183-186
allfieldsSound	(DE-627)NLEJ177989181 (DE-599)GBVNLZ177989181 DE-627 ger DE-627 rakwb eng The 3-D IC with 4-layer structure for the fast range sensing system 1991 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Akasaka, Y. oth Inoue, Y. oth Nakaya, M. oth Nishimura, T. oth in Microelectronic Engineering Amsterdam : Elsevier 15(1991), 1-4, Seite 183-186 (DE-627)NLEJ177331771 (DE-600)1497065-X 0167-9317 nnns volume:15 year:1991 number:1-4 pages:183-186 http://linkinghub.elsevier.com/retrieve/pii/0167-9317(91)90208-U GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 15 1991 1-4 183-186
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abstract	The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system.
abstractGer	The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system.
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