Behaviour and structural changes of redeposited material due to plasma-wall interaction
During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall....
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
1986 |
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| Reproduktion: |
Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 |
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| Übergeordnetes Werk: |
in: Journal of Nuclear Materials - Amsterdam : Elsevier, 141-143(1986), Seite 198-203 |
| Übergeordnetes Werk: |
volume:141-143 ; year:1986 ; pages:198-203 |
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NLEJ185403859 |
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| 520 | |a During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. | ||
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| 700 | 1 | |a Wallura, E. |4 oth | |
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(DE-627)NLEJ185403859 (DE-599)GBVNLZ185403859 DE-627 ger DE-627 rakwb eng Behaviour and structural changes of redeposited material due to plasma-wall interaction 1986 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Linke, J. oth Bolt, H. oth Hoven, H. oth Koizlik, K. oth Nickel, H. oth Wallura, E. oth in Journal of Nuclear Materials Amsterdam : Elsevier 141-143(1986), Seite 198-203 (DE-627)NLEJ177263164 (DE-600)2001279-2 0022-3115 nnns volume:141-143 year:1986 pages:198-203 http://dx.doi.org/10.1016/S0022-3115(86)80036-8 GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 141-143 1986 198-203 |
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(DE-627)NLEJ185403859 (DE-599)GBVNLZ185403859 DE-627 ger DE-627 rakwb eng Behaviour and structural changes of redeposited material due to plasma-wall interaction 1986 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Linke, J. oth Bolt, H. oth Hoven, H. oth Koizlik, K. oth Nickel, H. oth Wallura, E. oth in Journal of Nuclear Materials Amsterdam : Elsevier 141-143(1986), Seite 198-203 (DE-627)NLEJ177263164 (DE-600)2001279-2 0022-3115 nnns volume:141-143 year:1986 pages:198-203 http://dx.doi.org/10.1016/S0022-3115(86)80036-8 GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 141-143 1986 198-203 |
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(DE-627)NLEJ185403859 (DE-599)GBVNLZ185403859 DE-627 ger DE-627 rakwb eng Behaviour and structural changes of redeposited material due to plasma-wall interaction 1986 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Linke, J. oth Bolt, H. oth Hoven, H. oth Koizlik, K. oth Nickel, H. oth Wallura, E. oth in Journal of Nuclear Materials Amsterdam : Elsevier 141-143(1986), Seite 198-203 (DE-627)NLEJ177263164 (DE-600)2001279-2 0022-3115 nnns volume:141-143 year:1986 pages:198-203 http://dx.doi.org/10.1016/S0022-3115(86)80036-8 GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 141-143 1986 198-203 |
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(DE-627)NLEJ185403859 (DE-599)GBVNLZ185403859 DE-627 ger DE-627 rakwb eng Behaviour and structural changes of redeposited material due to plasma-wall interaction 1986 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Linke, J. oth Bolt, H. oth Hoven, H. oth Koizlik, K. oth Nickel, H. oth Wallura, E. oth in Journal of Nuclear Materials Amsterdam : Elsevier 141-143(1986), Seite 198-203 (DE-627)NLEJ177263164 (DE-600)2001279-2 0022-3115 nnns volume:141-143 year:1986 pages:198-203 http://dx.doi.org/10.1016/S0022-3115(86)80036-8 GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 141-143 1986 198-203 |
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(DE-627)NLEJ185403859 (DE-599)GBVNLZ185403859 DE-627 ger DE-627 rakwb eng Behaviour and structural changes of redeposited material due to plasma-wall interaction 1986 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. Elsevier Journal Backfiles on ScienceDirect 1907 - 2002 Linke, J. oth Bolt, H. oth Hoven, H. oth Koizlik, K. oth Nickel, H. oth Wallura, E. oth in Journal of Nuclear Materials Amsterdam : Elsevier 141-143(1986), Seite 198-203 (DE-627)NLEJ177263164 (DE-600)2001279-2 0022-3115 nnns volume:141-143 year:1986 pages:198-203 http://dx.doi.org/10.1016/S0022-3115(86)80036-8 GBV_USEFLAG_H ZDB-1-SDJ GBV_NL_ARTICLE AR 141-143 1986 198-203 |
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behaviour and structural changes of redeposited material due to plasma-wall interaction |
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Behaviour and structural changes of redeposited material due to plasma-wall interaction |
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During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. |
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During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. |
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During plasma-wall interaction in tokamaks erosion and redeposition processes substantially influence plasma parameters as well as the properties of the first wall. During disruptions or run-away-electron accidents hot spots will form on limiters or other protective installations of the first wall. In the case of metallic components beside erosion and evaporation melting processes are becoming essential: liquid metal droplets with diameters in the range of some 10μm up to some 100 μm are deposited onto the vacuum vessel and the limiters. Another important redeposition process is the formation of thin films by atomic condensation during normal operation. Influenced by high heat fluxes during successive shots these films are forced to undergo structural changes which can result in the formation of metallic agglomerates with mean diameters in the range of some microns. |
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