Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope
Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
1992 |
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| Umfang: |
7 |
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| Reproduktion: |
Springer Online Journal Archives 1860-2002 |
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| Übergeordnetes Werk: |
in: Journal of materials science - 1966, 27(1992), Seite 4009-4015 |
| Übergeordnetes Werk: |
volume:27 ; year:1992 ; month:15 ; pages:4009-4015 ; extent:7 |
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| 520 | |a Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. | ||
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| 700 | 1 | |a McKinlay, J. K. |4 oth | |
| 700 | 1 | |a McGee, S. M. |4 oth | |
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(DE-627)NLEJ194632350 DE-627 ger DE-627 rakwb eng Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope 1992 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. Springer Online Journal Archives 1860-2002 Betrabet, H. S. oth McKinlay, J. K. oth McGee, S. M. oth in Journal of materials science 1966 27(1992), Seite 4009-4015 (DE-627)NLEJ188987134 (DE-600)2015305-3 1573-4803 nnns volume:27 year:1992 month:15 pages:4009-4015 extent:7 http://dx.doi.org/10.1007/BF01105097 GBV_USEFLAG_U ZDB-1-SOJ GBV_NL_ARTICLE AR 27 1992 15 4009-4015 7 |
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(DE-627)NLEJ194632350 DE-627 ger DE-627 rakwb eng Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope 1992 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. Springer Online Journal Archives 1860-2002 Betrabet, H. S. oth McKinlay, J. K. oth McGee, S. M. oth in Journal of materials science 1966 27(1992), Seite 4009-4015 (DE-627)NLEJ188987134 (DE-600)2015305-3 1573-4803 nnns volume:27 year:1992 month:15 pages:4009-4015 extent:7 http://dx.doi.org/10.1007/BF01105097 GBV_USEFLAG_U ZDB-1-SOJ GBV_NL_ARTICLE AR 27 1992 15 4009-4015 7 |
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(DE-627)NLEJ194632350 DE-627 ger DE-627 rakwb eng Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope 1992 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. Springer Online Journal Archives 1860-2002 Betrabet, H. S. oth McKinlay, J. K. oth McGee, S. M. oth in Journal of materials science 1966 27(1992), Seite 4009-4015 (DE-627)NLEJ188987134 (DE-600)2015305-3 1573-4803 nnns volume:27 year:1992 month:15 pages:4009-4015 extent:7 http://dx.doi.org/10.1007/BF01105097 GBV_USEFLAG_U ZDB-1-SOJ GBV_NL_ARTICLE AR 27 1992 15 4009-4015 7 |
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(DE-627)NLEJ194632350 DE-627 ger DE-627 rakwb eng Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope 1992 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. Springer Online Journal Archives 1860-2002 Betrabet, H. S. oth McKinlay, J. K. oth McGee, S. M. oth in Journal of materials science 1966 27(1992), Seite 4009-4015 (DE-627)NLEJ188987134 (DE-600)2015305-3 1573-4803 nnns volume:27 year:1992 month:15 pages:4009-4015 extent:7 http://dx.doi.org/10.1007/BF01105097 GBV_USEFLAG_U ZDB-1-SOJ GBV_NL_ARTICLE AR 27 1992 15 4009-4015 7 |
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(DE-627)NLEJ194632350 DE-627 ger DE-627 rakwb eng Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope 1992 7 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. Springer Online Journal Archives 1860-2002 Betrabet, H. S. oth McKinlay, J. K. oth McGee, S. M. oth in Journal of materials science 1966 27(1992), Seite 4009-4015 (DE-627)NLEJ188987134 (DE-600)2015305-3 1573-4803 nnns volume:27 year:1992 month:15 pages:4009-4015 extent:7 http://dx.doi.org/10.1007/BF01105097 GBV_USEFLAG_U ZDB-1-SOJ GBV_NL_ARTICLE AR 27 1992 15 4009-4015 7 |
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Dynamic observations of Sn-Pb solder reflow in a hot-stage environmental scanning electron microscope |
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Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. |
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Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. |
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Abstract Solidification behaviour of solders has a critical effect on the resulting microstructures and hence mechanical properties. Therefore, it is essential to understand the effects of soldering processing parameters on microstructure to engineer optimum microstructures. Microstructural changes in the solder that occur during the reflow process were studied in a hot-stage environmental scanning electron microscope (ESEM). An off-eutectic Sn60-Pb40 solder and a dispersion-strengthened solder with the same Sn-Pb ratio were reflowed in an ESEM, and changes in the microstructure were recorded on video tape. The dissolution and nucleation of grains during melting and solidification were observed. It was found that the microstructure of the conventional solder became coarser when it was allowed to solidify from a melt where the proeutectic lead was not completely dissolved. Grain refinement was observed in dispersion-strengthened solder where the dispersoids acted as heterogeneous nucleation sites. |
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