Characterization of low- benzocyclobutene dielectric thin film
This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to invest...
Ausführliche Beschreibung
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| Autor*in: |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2003 |
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| Umfang: |
12 |
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| Reproduktion: |
Emerald Fulltext Archive Database 1994-2005 |
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| Übergeordnetes Werk: |
In: Microelectronics international - Bingley : Emerald, 1996, 20(2003), 3, Seite 11-22 |
| Übergeordnetes Werk: |
volume:20 ; year:2003 ; number:3 ; pages:11-22 ; extent:12 |
| Links: |
|---|
| DOI / URN: |
10.1108/13565360310487909 |
|---|
| Katalog-ID: |
NLEJ219580812 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | NLEJ219580812 | ||
| 003 | DE-627 | ||
| 005 | 20210707090101.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 090811s2003 xxk|||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1108/13565360310487909 |2 doi | |
| 035 | |a (DE-627)NLEJ219580812 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 044 | |c XA-GB | ||
| 245 | 1 | 0 | |a Characterization of low- benzocyclobutene dielectric thin film |
| 264 | 1 | |c 2003 | |
| 300 | |a 12 | ||
| 336 | |a nicht spezifiziert |b zzz |2 rdacontent | ||
| 337 | |a nicht spezifiziert |b z |2 rdamedia | ||
| 338 | |a nicht spezifiziert |b zu |2 rdacarrier | ||
| 520 | |a This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. | ||
| 533 | |f Emerald Fulltext Archive Database 1994-2005 | ||
| 650 | 4 | |a Curing | |
| 650 | 4 | |a Shrinkage | |
| 650 | 4 | |a Thin film | |
| 700 | 1 | |a Chan, K.C. |4 oth | |
| 700 | 1 | |a Teo, M. |4 oth | |
| 700 | 1 | |a Zhong, Z.W. |4 oth | |
| 773 | 0 | 8 | |i In |t Microelectronics international |d Bingley : Emerald, 1996 |g 20(2003), 3, Seite 11-22 |h Online-Ressource |w (DE-627)NLEJ219578370 |w (DE-600)2024931-7 |7 nnns |
| 773 | 1 | 8 | |g volume:20 |g year:2003 |g number:3 |g pages:11-22 |g extent:12 |
| 856 | 4 | 0 | |u http://dx.doi.org/10.1108/13565360310487909 |
| 912 | |a GBV_USEFLAG_U | ||
| 912 | |a ZDB-1-EFD | ||
| 912 | |a GBV_NL_ARTICLE | ||
| 951 | |a AR | ||
| 952 | |d 20 |j 2003 |e 3 |h 11-22 |g 12 | ||
| matchkey_str |
chankcteomzhongzw:2003----:hrceiainfobnoylbtnd |
|---|---|
| hierarchy_sort_str |
2003 |
| publishDate |
2003 |
| allfields |
10.1108/13565360310487909 doi (DE-627)NLEJ219580812 DE-627 ger DE-627 rakwb eng XA-GB Characterization of low- benzocyclobutene dielectric thin film 2003 12 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. Emerald Fulltext Archive Database 1994-2005 Curing Shrinkage Thin film Chan, K.C. oth Teo, M. oth Zhong, Z.W. oth In Microelectronics international Bingley : Emerald, 1996 20(2003), 3, Seite 11-22 Online-Ressource (DE-627)NLEJ219578370 (DE-600)2024931-7 nnns volume:20 year:2003 number:3 pages:11-22 extent:12 http://dx.doi.org/10.1108/13565360310487909 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 20 2003 3 11-22 12 |
| spelling |
10.1108/13565360310487909 doi (DE-627)NLEJ219580812 DE-627 ger DE-627 rakwb eng XA-GB Characterization of low- benzocyclobutene dielectric thin film 2003 12 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. Emerald Fulltext Archive Database 1994-2005 Curing Shrinkage Thin film Chan, K.C. oth Teo, M. oth Zhong, Z.W. oth In Microelectronics international Bingley : Emerald, 1996 20(2003), 3, Seite 11-22 Online-Ressource (DE-627)NLEJ219578370 (DE-600)2024931-7 nnns volume:20 year:2003 number:3 pages:11-22 extent:12 http://dx.doi.org/10.1108/13565360310487909 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 20 2003 3 11-22 12 |
| allfields_unstemmed |
10.1108/13565360310487909 doi (DE-627)NLEJ219580812 DE-627 ger DE-627 rakwb eng XA-GB Characterization of low- benzocyclobutene dielectric thin film 2003 12 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. Emerald Fulltext Archive Database 1994-2005 Curing Shrinkage Thin film Chan, K.C. oth Teo, M. oth Zhong, Z.W. oth In Microelectronics international Bingley : Emerald, 1996 20(2003), 3, Seite 11-22 Online-Ressource (DE-627)NLEJ219578370 (DE-600)2024931-7 nnns volume:20 year:2003 number:3 pages:11-22 extent:12 http://dx.doi.org/10.1108/13565360310487909 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 20 2003 3 11-22 12 |
| allfieldsGer |
10.1108/13565360310487909 doi (DE-627)NLEJ219580812 DE-627 ger DE-627 rakwb eng XA-GB Characterization of low- benzocyclobutene dielectric thin film 2003 12 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. Emerald Fulltext Archive Database 1994-2005 Curing Shrinkage Thin film Chan, K.C. oth Teo, M. oth Zhong, Z.W. oth In Microelectronics international Bingley : Emerald, 1996 20(2003), 3, Seite 11-22 Online-Ressource (DE-627)NLEJ219578370 (DE-600)2024931-7 nnns volume:20 year:2003 number:3 pages:11-22 extent:12 http://dx.doi.org/10.1108/13565360310487909 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 20 2003 3 11-22 12 |
| allfieldsSound |
10.1108/13565360310487909 doi (DE-627)NLEJ219580812 DE-627 ger DE-627 rakwb eng XA-GB Characterization of low- benzocyclobutene dielectric thin film 2003 12 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. Emerald Fulltext Archive Database 1994-2005 Curing Shrinkage Thin film Chan, K.C. oth Teo, M. oth Zhong, Z.W. oth In Microelectronics international Bingley : Emerald, 1996 20(2003), 3, Seite 11-22 Online-Ressource (DE-627)NLEJ219578370 (DE-600)2024931-7 nnns volume:20 year:2003 number:3 pages:11-22 extent:12 http://dx.doi.org/10.1108/13565360310487909 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 20 2003 3 11-22 12 |
| language |
English |
| source |
In Microelectronics international 20(2003), 3, Seite 11-22 volume:20 year:2003 number:3 pages:11-22 extent:12 |
| sourceStr |
In Microelectronics international 20(2003), 3, Seite 11-22 volume:20 year:2003 number:3 pages:11-22 extent:12 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Curing Shrinkage Thin film |
| isfreeaccess_bool |
false |
| container_title |
Microelectronics international |
| authorswithroles_txt_mv |
Chan, K.C. @@oth@@ Teo, M. @@oth@@ Zhong, Z.W. @@oth@@ |
| publishDateDaySort_date |
2003-01-01T00:00:00Z |
| hierarchy_top_id |
NLEJ219578370 |
| id |
NLEJ219580812 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">NLEJ219580812</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20210707090101.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">090811s2003 xxk|||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1108/13565360310487909</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)NLEJ219580812</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="c">XA-GB</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Characterization of low- benzocyclobutene dielectric thin film</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">12</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained.</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="f">Emerald Fulltext Archive Database 1994-2005</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Curing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Shrinkage</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin film</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Chan, K.C.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Teo, M.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhong, Z.W.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">In</subfield><subfield code="t">Microelectronics international</subfield><subfield code="d">Bingley : Emerald, 1996</subfield><subfield code="g">20(2003), 3, Seite 11-22</subfield><subfield code="h">Online-Ressource</subfield><subfield code="w">(DE-627)NLEJ219578370</subfield><subfield code="w">(DE-600)2024931-7</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:20</subfield><subfield code="g">year:2003</subfield><subfield code="g">number:3</subfield><subfield code="g">pages:11-22</subfield><subfield code="g">extent:12</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://dx.doi.org/10.1108/13565360310487909</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-1-EFD</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_NL_ARTICLE</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">20</subfield><subfield code="j">2003</subfield><subfield code="e">3</subfield><subfield code="h">11-22</subfield><subfield code="g">12</subfield></datafield></record></collection>
|
| series2 |
Emerald Fulltext Archive Database 1994-2005 |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)NLEJ219578370 |
| format |
electronic Article |
| delete_txt_mv |
keep |
| collection |
NL |
| remote_str |
true |
| illustrated |
Not Illustrated |
| topic_title |
Characterization of low- benzocyclobutene dielectric thin film Curing Shrinkage Thin film |
| topic |
misc Curing misc Shrinkage misc Thin film |
| spellingShingle |
misc Curing misc Shrinkage misc Thin film Characterization of low- benzocyclobutene dielectric thin film |
| topic_unstemmed |
misc Curing misc Shrinkage misc Thin film |
| topic_browse |
misc Curing misc Shrinkage misc Thin film |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
zu |
| author2_variant |
k c kc m t mt z z zz |
| hierarchy_parent_title |
Microelectronics international |
| hierarchy_parent_id |
NLEJ219578370 |
| hierarchy_top_title |
Microelectronics international |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)NLEJ219578370 (DE-600)2024931-7 |
| title |
Characterization of low- benzocyclobutene dielectric thin film |
| ctrlnum |
(DE-627)NLEJ219580812 |
| title_full |
Characterization of low- benzocyclobutene dielectric thin film |
| journal |
Microelectronics international |
| journalStr |
Microelectronics international |
| lang_code |
eng |
| isOA_bool |
false |
| recordtype |
marc |
| publishDateSort |
2003 |
| contenttype_str_mv |
zzz |
| container_start_page |
11 |
| container_volume |
20 |
| physical |
12 |
| format_se |
Elektronische Aufsätze |
| countryofpublication_str_mv |
XA-GB |
| doi_str_mv |
10.1108/13565360310487909 |
| title_sort |
characterization of low- benzocyclobutene dielectric thin film |
| title_auth |
Characterization of low- benzocyclobutene dielectric thin film |
| abstract |
This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. |
| abstractGer |
This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. |
| abstract_unstemmed |
This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained. |
| collection_details |
GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE |
| container_issue |
3 |
| title_short |
Characterization of low- benzocyclobutene dielectric thin film |
| url |
http://dx.doi.org/10.1108/13565360310487909 |
| remote_bool |
true |
| author2 |
Chan, K.C. Teo, M. Zhong, Z.W. |
| author2Str |
Chan, K.C. Teo, M. Zhong, Z.W. |
| ppnlink |
NLEJ219578370 |
| mediatype_str_mv |
z |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth |
| doi_str |
10.1108/13565360310487909 |
| up_date |
2024-07-06T05:33:29.129Z |
| _version_ |
1803806582117498880 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">NLEJ219580812</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20210707090101.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">090811s2003 xxk|||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1108/13565360310487909</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)NLEJ219580812</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="c">XA-GB</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Characterization of low- benzocyclobutene dielectric thin film</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">12</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained.</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="f">Emerald Fulltext Archive Database 1994-2005</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Curing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Shrinkage</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin film</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Chan, K.C.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Teo, M.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhong, Z.W.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">In</subfield><subfield code="t">Microelectronics international</subfield><subfield code="d">Bingley : Emerald, 1996</subfield><subfield code="g">20(2003), 3, Seite 11-22</subfield><subfield code="h">Online-Ressource</subfield><subfield code="w">(DE-627)NLEJ219578370</subfield><subfield code="w">(DE-600)2024931-7</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:20</subfield><subfield code="g">year:2003</subfield><subfield code="g">number:3</subfield><subfield code="g">pages:11-22</subfield><subfield code="g">extent:12</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://dx.doi.org/10.1108/13565360310487909</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-1-EFD</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_NL_ARTICLE</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">20</subfield><subfield code="j">2003</subfield><subfield code="e">3</subfield><subfield code="h">11-22</subfield><subfield code="g">12</subfield></datafield></record></collection>
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