Reflow profile study of the Sn-Ag-Cu solder
A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results o...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2004 |
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| Schlagwörter: |
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| Umfang: |
8 |
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| Reproduktion: |
Emerald Fulltext Archive Database 1994-2005 |
|---|---|
| Übergeordnetes Werk: |
In: Soldering & surface mount technology - Bradford : MCB University Press, 1989, 16(2004), 1, Seite 27-34 |
| Übergeordnetes Werk: |
volume:16 ; year:2004 ; number:1 ; pages:27-34 ; extent:8 |
| Links: |
|---|
| DOI / URN: |
10.1108/09540910410517022 |
|---|
| Katalog-ID: |
NLEJ219872767 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | NLEJ219872767 | ||
| 003 | DE-627 | ||
| 005 | 20210707094417.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 090811s2004 xxk|||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1108/09540910410517022 |2 doi | |
| 035 | |a (DE-627)NLEJ219872767 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 044 | |c XA-GB | ||
| 245 | 1 | 0 | |a Reflow profile study of the Sn-Ag-Cu solder |
| 264 | 1 | |c 2004 | |
| 300 | |a 8 | ||
| 336 | |a nicht spezifiziert |b zzz |2 rdacontent | ||
| 337 | |a nicht spezifiziert |b z |2 rdamedia | ||
| 338 | |a nicht spezifiziert |b zu |2 rdacarrier | ||
| 520 | |a A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. | ||
| 533 | |f Emerald Fulltext Archive Database 1994-2005 | ||
| 650 | 4 | |a Soldering | |
| 650 | 4 | |a Surface texture | |
| 650 | 4 | |a Surface treatment | |
| 700 | 1 | |a Salam, B. |4 oth | |
| 700 | 1 | |a Virseda, C. |4 oth | |
| 700 | 1 | |a Da, H. |4 oth | |
| 700 | 1 | |a Ekere, N.N. |4 oth | |
| 700 | 1 | |a Durairaj, R. |4 oth | |
| 773 | 0 | 8 | |i In |t Soldering & surface mount technology |d Bradford : MCB University Press, 1989 |g 16(2004), 1, Seite 27-34 |h Online-Ressource |w (DE-627)NLEJ219578796 |w (DE-600)2015855-5 |7 nnns |
| 773 | 1 | 8 | |g volume:16 |g year:2004 |g number:1 |g pages:27-34 |g extent:8 |
| 856 | 4 | 0 | |u http://dx.doi.org/10.1108/09540910410517022 |
| 912 | |a GBV_USEFLAG_U | ||
| 912 | |a ZDB-1-EFD | ||
| 912 | |a GBV_NL_ARTICLE | ||
| 951 | |a AR | ||
| 952 | |d 16 |j 2004 |e 1 |h 27-34 |g 8 | ||
| matchkey_str |
salambvirsedacdahekerenndurairajr:2004----:elwrflsuyfhs |
|---|---|
| hierarchy_sort_str |
2004 |
| publishDate |
2004 |
| allfields |
10.1108/09540910410517022 doi (DE-627)NLEJ219872767 DE-627 ger DE-627 rakwb eng XA-GB Reflow profile study of the Sn-Ag-Cu solder 2004 8 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. Emerald Fulltext Archive Database 1994-2005 Soldering Surface texture Surface treatment Salam, B. oth Virseda, C. oth Da, H. oth Ekere, N.N. oth Durairaj, R. oth In Soldering & surface mount technology Bradford : MCB University Press, 1989 16(2004), 1, Seite 27-34 Online-Ressource (DE-627)NLEJ219578796 (DE-600)2015855-5 nnns volume:16 year:2004 number:1 pages:27-34 extent:8 http://dx.doi.org/10.1108/09540910410517022 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 16 2004 1 27-34 8 |
| spelling |
10.1108/09540910410517022 doi (DE-627)NLEJ219872767 DE-627 ger DE-627 rakwb eng XA-GB Reflow profile study of the Sn-Ag-Cu solder 2004 8 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. Emerald Fulltext Archive Database 1994-2005 Soldering Surface texture Surface treatment Salam, B. oth Virseda, C. oth Da, H. oth Ekere, N.N. oth Durairaj, R. oth In Soldering & surface mount technology Bradford : MCB University Press, 1989 16(2004), 1, Seite 27-34 Online-Ressource (DE-627)NLEJ219578796 (DE-600)2015855-5 nnns volume:16 year:2004 number:1 pages:27-34 extent:8 http://dx.doi.org/10.1108/09540910410517022 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 16 2004 1 27-34 8 |
| allfields_unstemmed |
10.1108/09540910410517022 doi (DE-627)NLEJ219872767 DE-627 ger DE-627 rakwb eng XA-GB Reflow profile study of the Sn-Ag-Cu solder 2004 8 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. Emerald Fulltext Archive Database 1994-2005 Soldering Surface texture Surface treatment Salam, B. oth Virseda, C. oth Da, H. oth Ekere, N.N. oth Durairaj, R. oth In Soldering & surface mount technology Bradford : MCB University Press, 1989 16(2004), 1, Seite 27-34 Online-Ressource (DE-627)NLEJ219578796 (DE-600)2015855-5 nnns volume:16 year:2004 number:1 pages:27-34 extent:8 http://dx.doi.org/10.1108/09540910410517022 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 16 2004 1 27-34 8 |
| allfieldsGer |
10.1108/09540910410517022 doi (DE-627)NLEJ219872767 DE-627 ger DE-627 rakwb eng XA-GB Reflow profile study of the Sn-Ag-Cu solder 2004 8 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. Emerald Fulltext Archive Database 1994-2005 Soldering Surface texture Surface treatment Salam, B. oth Virseda, C. oth Da, H. oth Ekere, N.N. oth Durairaj, R. oth In Soldering & surface mount technology Bradford : MCB University Press, 1989 16(2004), 1, Seite 27-34 Online-Ressource (DE-627)NLEJ219578796 (DE-600)2015855-5 nnns volume:16 year:2004 number:1 pages:27-34 extent:8 http://dx.doi.org/10.1108/09540910410517022 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 16 2004 1 27-34 8 |
| allfieldsSound |
10.1108/09540910410517022 doi (DE-627)NLEJ219872767 DE-627 ger DE-627 rakwb eng XA-GB Reflow profile study of the Sn-Ag-Cu solder 2004 8 nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. Emerald Fulltext Archive Database 1994-2005 Soldering Surface texture Surface treatment Salam, B. oth Virseda, C. oth Da, H. oth Ekere, N.N. oth Durairaj, R. oth In Soldering & surface mount technology Bradford : MCB University Press, 1989 16(2004), 1, Seite 27-34 Online-Ressource (DE-627)NLEJ219578796 (DE-600)2015855-5 nnns volume:16 year:2004 number:1 pages:27-34 extent:8 http://dx.doi.org/10.1108/09540910410517022 GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE AR 16 2004 1 27-34 8 |
| language |
English |
| source |
In Soldering & surface mount technology 16(2004), 1, Seite 27-34 volume:16 year:2004 number:1 pages:27-34 extent:8 |
| sourceStr |
In Soldering & surface mount technology 16(2004), 1, Seite 27-34 volume:16 year:2004 number:1 pages:27-34 extent:8 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Soldering Surface texture Surface treatment |
| isfreeaccess_bool |
false |
| container_title |
Soldering & surface mount technology |
| authorswithroles_txt_mv |
Salam, B. @@oth@@ Virseda, C. @@oth@@ Da, H. @@oth@@ Ekere, N.N. @@oth@@ Durairaj, R. @@oth@@ |
| publishDateDaySort_date |
2004-01-01T00:00:00Z |
| hierarchy_top_id |
NLEJ219578796 |
| id |
NLEJ219872767 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">NLEJ219872767</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20210707094417.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">090811s2004 xxk|||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1108/09540910410517022</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)NLEJ219872767</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="c">XA-GB</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Reflow profile study of the Sn-Ag-Cu solder</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2004</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">8</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile.</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="f">Emerald Fulltext Archive Database 1994-2005</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Soldering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surface texture</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surface treatment</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Salam, B.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Virseda, C.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Da, H.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ekere, N.N.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Durairaj, R.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">In</subfield><subfield code="t">Soldering & surface mount technology</subfield><subfield code="d">Bradford : MCB University Press, 1989</subfield><subfield code="g">16(2004), 1, Seite 27-34</subfield><subfield code="h">Online-Ressource</subfield><subfield code="w">(DE-627)NLEJ219578796</subfield><subfield code="w">(DE-600)2015855-5</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:16</subfield><subfield code="g">year:2004</subfield><subfield code="g">number:1</subfield><subfield code="g">pages:27-34</subfield><subfield code="g">extent:8</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://dx.doi.org/10.1108/09540910410517022</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-1-EFD</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_NL_ARTICLE</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">16</subfield><subfield code="j">2004</subfield><subfield code="e">1</subfield><subfield code="h">27-34</subfield><subfield code="g">8</subfield></datafield></record></collection>
|
| series2 |
Emerald Fulltext Archive Database 1994-2005 |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)NLEJ219578796 |
| format |
electronic Article |
| delete_txt_mv |
keep |
| collection |
NL |
| remote_str |
true |
| illustrated |
Not Illustrated |
| topic_title |
Reflow profile study of the Sn-Ag-Cu solder Soldering Surface texture Surface treatment |
| topic |
misc Soldering misc Surface texture misc Surface treatment |
| spellingShingle |
misc Soldering misc Surface texture misc Surface treatment Reflow profile study of the Sn-Ag-Cu solder |
| topic_unstemmed |
misc Soldering misc Surface texture misc Surface treatment |
| topic_browse |
misc Soldering misc Surface texture misc Surface treatment |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
zu |
| author2_variant |
b s bs c v cv h d hd n e ne r d rd |
| hierarchy_parent_title |
Soldering & surface mount technology |
| hierarchy_parent_id |
NLEJ219578796 |
| hierarchy_top_title |
Soldering & surface mount technology |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)NLEJ219578796 (DE-600)2015855-5 |
| title |
Reflow profile study of the Sn-Ag-Cu solder |
| ctrlnum |
(DE-627)NLEJ219872767 |
| title_full |
Reflow profile study of the Sn-Ag-Cu solder |
| journal |
Soldering & surface mount technology |
| journalStr |
Soldering & surface mount technology |
| lang_code |
eng |
| isOA_bool |
false |
| recordtype |
marc |
| publishDateSort |
2004 |
| contenttype_str_mv |
zzz |
| container_start_page |
27 |
| container_volume |
16 |
| physical |
8 |
| format_se |
Elektronische Aufsätze |
| countryofpublication_str_mv |
XA-GB |
| doi_str_mv |
10.1108/09540910410517022 |
| title_sort |
reflow profile study of the sn-ag-cu solder |
| title_auth |
Reflow profile study of the Sn-Ag-Cu solder |
| abstract |
A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. |
| abstractGer |
A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. |
| abstract_unstemmed |
A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile. |
| collection_details |
GBV_USEFLAG_U ZDB-1-EFD GBV_NL_ARTICLE |
| container_issue |
1 |
| title_short |
Reflow profile study of the Sn-Ag-Cu solder |
| url |
http://dx.doi.org/10.1108/09540910410517022 |
| remote_bool |
true |
| author2 |
Salam, B. Virseda, C. Da, H. Ekere, N.N. Durairaj, R. |
| author2Str |
Salam, B. Virseda, C. Da, H. Ekere, N.N. Durairaj, R. |
| ppnlink |
NLEJ219578796 |
| mediatype_str_mv |
z |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth oth oth |
| doi_str |
10.1108/09540910410517022 |
| up_date |
2024-07-06T06:20:52.669Z |
| _version_ |
1803809563786346496 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">NLEJ219872767</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20210707094417.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">090811s2004 xxk|||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1108/09540910410517022</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)NLEJ219872767</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="c">XA-GB</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Reflow profile study of the Sn-Ag-Cu solder</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2004</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">8</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zzz</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">z</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">nicht spezifiziert</subfield><subfield code="b">zu</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">A study of the Sn-Ag-Cu lead-free solder reflow profile has been conducted. The purpose of the work was to determine the Sn-Ag-Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn-Ag-Cu lead-free solder should be 230°C. The recommended time above liquidus is 40?s for the RSS reflow profile and 50-70?s for the RTS reflow profile.</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="f">Emerald Fulltext Archive Database 1994-2005</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Soldering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surface texture</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surface treatment</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Salam, B.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Virseda, C.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Da, H.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ekere, N.N.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Durairaj, R.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">In</subfield><subfield code="t">Soldering & surface mount technology</subfield><subfield code="d">Bradford : MCB University Press, 1989</subfield><subfield code="g">16(2004), 1, Seite 27-34</subfield><subfield code="h">Online-Ressource</subfield><subfield code="w">(DE-627)NLEJ219578796</subfield><subfield code="w">(DE-600)2015855-5</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:16</subfield><subfield code="g">year:2004</subfield><subfield code="g">number:1</subfield><subfield code="g">pages:27-34</subfield><subfield code="g">extent:8</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://dx.doi.org/10.1108/09540910410517022</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_U</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-1-EFD</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_NL_ARTICLE</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">16</subfield><subfield code="j">2004</subfield><subfield code="e">1</subfield><subfield code="h">27-34</subfield><subfield code="g">8</subfield></datafield></record></collection>
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