Topological Design of Three-Dimensional Microstructure Based on Homogenization Effective Method
Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fr...
Ausführliche Beschreibung
Autor*in: |
Qiu, Ke Peng [verfasserIn] |
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E-Artikel |
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Sprache: |
Englisch |
Erschienen: |
s.l. Stafa-Zurich, Switzerland: 2006 |
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Anmerkung: |
https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 |
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Umfang: |
Online-Ressource (4 pages) |
Reproduktion: |
Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008 |
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Übergeordnetes Werk: |
In: Materials science forum - Uetikon : Trans Tech Publ., 1984, Vol. 532-533 (Dec. 2006), p. 705-708 |
Übergeordnetes Werk: |
volume:532-533 ; year:2006 ; pages:705-708 |
Links: |
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DOI / URN: |
10.4028/www.scientific.net/MSF.532-533.705 |
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10.4028/www.scientific.net/MSF.532-533.705 doi (DE-627)NLEJ238026361 DE-627 ger DE-627 rakwb eng Qiu, Ke Peng verfasserin aut Topological Design of Three-Dimensional Microstructure Based on Homogenization Effective Method s.l. Stafa-Zurich, Switzerland 2006 Online-Ressource (4 pages) nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fraction in conjunction with the homogenization method and the finiteelement method. Numerical examples are given to demonstrate that optimal material layouts aresuccessfully achieved and the initial layout has a great effect on the optimal microstructure Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008 Zhang, Wei Hong oth Sun, Shi Ping oth Zhu, Ji Hong oth In Materials science forum Uetikon : Trans Tech Publ., 1984 Vol. 532-533 (Dec. 2006), p. 705-708 Online-Ressource (DE-627)NLEJ237794969 (DE-600)2047372-2 1662-9752 nnns volume:532-533 year:2006 pages:705-708 https://www.tib.eu/de/openurl/search/?pid=doi:10.4028/www.scientific.net/MSF.532-533.705 text/html Deutschlandweit zugänglich Volltext https://doi.org//10.4028/www.scientific.net/MSF.532-533.705 text/html Deutschlandweit zugänglich Volltext GBV_USEFLAG_U ZDB-1-SNT GBV_NL_ARTICLE AR 532-533 2006 705-708 Vol. 532-533 (Dec. 2006), p. 705-708 |
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10.4028/www.scientific.net/MSF.532-533.705 doi (DE-627)NLEJ238026361 DE-627 ger DE-627 rakwb eng Qiu, Ke Peng verfasserin aut Topological Design of Three-Dimensional Microstructure Based on Homogenization Effective Method s.l. Stafa-Zurich, Switzerland 2006 Online-Ressource (4 pages) nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fraction in conjunction with the homogenization method and the finiteelement method. Numerical examples are given to demonstrate that optimal material layouts aresuccessfully achieved and the initial layout has a great effect on the optimal microstructure Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008 Zhang, Wei Hong oth Sun, Shi Ping oth Zhu, Ji Hong oth In Materials science forum Uetikon : Trans Tech Publ., 1984 Vol. 532-533 (Dec. 2006), p. 705-708 Online-Ressource (DE-627)NLEJ237794969 (DE-600)2047372-2 1662-9752 nnns volume:532-533 year:2006 pages:705-708 https://www.tib.eu/de/openurl/search/?pid=doi:10.4028/www.scientific.net/MSF.532-533.705 text/html Deutschlandweit zugänglich Volltext https://doi.org//10.4028/www.scientific.net/MSF.532-533.705 text/html Deutschlandweit zugänglich Volltext GBV_USEFLAG_U ZDB-1-SNT GBV_NL_ARTICLE AR 532-533 2006 705-708 Vol. 532-533 (Dec. 2006), p. 705-708 |
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10.4028/www.scientific.net/MSF.532-533.705 doi (DE-627)NLEJ238026361 DE-627 ger DE-627 rakwb eng Qiu, Ke Peng verfasserin aut Topological Design of Three-Dimensional Microstructure Based on Homogenization Effective Method s.l. Stafa-Zurich, Switzerland 2006 Online-Ressource (4 pages) nicht spezifiziert zzz rdacontent nicht spezifiziert z rdamedia nicht spezifiziert zu rdacarrier https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fraction in conjunction with the homogenization method and the finiteelement method. Numerical examples are given to demonstrate that optimal material layouts aresuccessfully achieved and the initial layout has a great effect on the optimal microstructure Scientific.Net: Materials Science & Technology / Trans Tech Publications Archiv 1984-2008 Zhang, Wei Hong oth Sun, Shi Ping oth Zhu, Ji Hong oth In Materials science forum Uetikon : Trans Tech Publ., 1984 Vol. 532-533 (Dec. 2006), p. 705-708 Online-Ressource (DE-627)NLEJ237794969 (DE-600)2047372-2 1662-9752 nnns volume:532-533 year:2006 pages:705-708 https://www.tib.eu/de/openurl/search/?pid=doi:10.4028/www.scientific.net/MSF.532-533.705 text/html Deutschlandweit zugänglich Volltext https://doi.org//10.4028/www.scientific.net/MSF.532-533.705 text/html Deutschlandweit zugänglich Volltext GBV_USEFLAG_U ZDB-1-SNT GBV_NL_ARTICLE AR 532-533 2006 705-708 Vol. 532-533 (Dec. 2006), p. 705-708 |
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Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fraction in conjunction with the homogenization method and the finiteelement method. Numerical examples are given to demonstrate that optimal material layouts aresuccessfully achieved and the initial layout has a great effect on the optimal microstructure https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 |
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Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fraction in conjunction with the homogenization method and the finiteelement method. Numerical examples are given to demonstrate that optimal material layouts aresuccessfully achieved and the initial layout has a great effect on the optimal microstructure https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 |
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Nowadays, the topology optimization method is extensively adopted for the design ofmaterial microstructures to achieve desired behaviors. The present work is concerned with theoptimal design of the stiffness and thermal conductivity of 3D microstructure unit cells with thespecific material volume fraction in conjunction with the homogenization method and the finiteelement method. Numerical examples are given to demonstrate that optimal material layouts aresuccessfully achieved and the initial layout has a great effect on the optimal microstructure https://getinfo.de/app/details?id=transtech:doi~10.4028%252Fwww.scientific.net%252FMSF.532-533.705 |
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