The application of carbon black and printing ink technology in molded interconnect devices
In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powde...
Ausführliche Beschreibung
Autor*in: |
Liu, Ren-Hao [verfasserIn] Young, Wen-Bin [verfasserIn] |
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E-Artikel |
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Erschienen: |
De Gruyter ; 2014 |
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Umfang: |
9 |
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Reproduktion: |
Walter de Gruyter Online Zeitschriften |
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Übergeordnetes Werk: |
Enthalten in: Journal of polymer engineering - Berlin : de Gruyter, 1984, 34(2014), 5 vom: 2. Apr., Seite 395-403 |
Übergeordnetes Werk: |
volume:34 ; year:2014 ; number:5 ; day:2 ; month:04 ; pages:395-403 ; extent:9 |
Links: |
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DOI / URN: |
10.1515/polyeng-2013-0292 |
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NLEJ24813874X |
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10.1515/polyeng-2013-0292 doi articles2015-2020.pp (DE-627)NLEJ24813874X DE-627 ger DE-627 rakwb Liu, Ren-Hao verfasserin aut The application of carbon black and printing ink technology in molded interconnect devices De Gruyter 2014 9 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. Walter de Gruyter Online Zeitschriften conductivity ink IMD MID Young, Wen-Bin verfasserin aut Enthalten in Journal of polymer engineering Berlin : de Gruyter, 1984 34(2014), 5 vom: 2. Apr., Seite 395-403 (DE-627)NLEJ248236601 (DE-600)2602430-5 2191-0340 nnns volume:34 year:2014 number:5 day:2 month:04 pages:395-403 extent:9 https://doi.org/10.1515/polyeng-2013-0292 Deutschlandweit zugänglich GBV_USEFLAG_U ZDB-1-DGR GBV_NL_ARTICLE AR 34 2014 5 2 4 395-403 9 |
spelling |
10.1515/polyeng-2013-0292 doi articles2015-2020.pp (DE-627)NLEJ24813874X DE-627 ger DE-627 rakwb Liu, Ren-Hao verfasserin aut The application of carbon black and printing ink technology in molded interconnect devices De Gruyter 2014 9 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. Walter de Gruyter Online Zeitschriften conductivity ink IMD MID Young, Wen-Bin verfasserin aut Enthalten in Journal of polymer engineering Berlin : de Gruyter, 1984 34(2014), 5 vom: 2. Apr., Seite 395-403 (DE-627)NLEJ248236601 (DE-600)2602430-5 2191-0340 nnns volume:34 year:2014 number:5 day:2 month:04 pages:395-403 extent:9 https://doi.org/10.1515/polyeng-2013-0292 Deutschlandweit zugänglich GBV_USEFLAG_U ZDB-1-DGR GBV_NL_ARTICLE AR 34 2014 5 2 4 395-403 9 |
allfields_unstemmed |
10.1515/polyeng-2013-0292 doi articles2015-2020.pp (DE-627)NLEJ24813874X DE-627 ger DE-627 rakwb Liu, Ren-Hao verfasserin aut The application of carbon black and printing ink technology in molded interconnect devices De Gruyter 2014 9 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. Walter de Gruyter Online Zeitschriften conductivity ink IMD MID Young, Wen-Bin verfasserin aut Enthalten in Journal of polymer engineering Berlin : de Gruyter, 1984 34(2014), 5 vom: 2. Apr., Seite 395-403 (DE-627)NLEJ248236601 (DE-600)2602430-5 2191-0340 nnns volume:34 year:2014 number:5 day:2 month:04 pages:395-403 extent:9 https://doi.org/10.1515/polyeng-2013-0292 Deutschlandweit zugänglich GBV_USEFLAG_U ZDB-1-DGR GBV_NL_ARTICLE AR 34 2014 5 2 4 395-403 9 |
allfieldsGer |
10.1515/polyeng-2013-0292 doi articles2015-2020.pp (DE-627)NLEJ24813874X DE-627 ger DE-627 rakwb Liu, Ren-Hao verfasserin aut The application of carbon black and printing ink technology in molded interconnect devices De Gruyter 2014 9 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. Walter de Gruyter Online Zeitschriften conductivity ink IMD MID Young, Wen-Bin verfasserin aut Enthalten in Journal of polymer engineering Berlin : de Gruyter, 1984 34(2014), 5 vom: 2. Apr., Seite 395-403 (DE-627)NLEJ248236601 (DE-600)2602430-5 2191-0340 nnns volume:34 year:2014 number:5 day:2 month:04 pages:395-403 extent:9 https://doi.org/10.1515/polyeng-2013-0292 Deutschlandweit zugänglich GBV_USEFLAG_U ZDB-1-DGR GBV_NL_ARTICLE AR 34 2014 5 2 4 395-403 9 |
allfieldsSound |
10.1515/polyeng-2013-0292 doi articles2015-2020.pp (DE-627)NLEJ24813874X DE-627 ger DE-627 rakwb Liu, Ren-Hao verfasserin aut The application of carbon black and printing ink technology in molded interconnect devices De Gruyter 2014 9 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. Walter de Gruyter Online Zeitschriften conductivity ink IMD MID Young, Wen-Bin verfasserin aut Enthalten in Journal of polymer engineering Berlin : de Gruyter, 1984 34(2014), 5 vom: 2. Apr., Seite 395-403 (DE-627)NLEJ248236601 (DE-600)2602430-5 2191-0340 nnns volume:34 year:2014 number:5 day:2 month:04 pages:395-403 extent:9 https://doi.org/10.1515/polyeng-2013-0292 Deutschlandweit zugänglich GBV_USEFLAG_U ZDB-1-DGR GBV_NL_ARTICLE AR 34 2014 5 2 4 395-403 9 |
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the application of carbon black and printing ink technology in molded interconnect devices |
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The application of carbon black and printing ink technology in molded interconnect devices |
abstract |
In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. |
abstractGer |
In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. |
abstract_unstemmed |
In this article, the processing of molded interconnect devices (MIDs) was studied via in-mold decoration (IMD) molding technology. A screen printing process using carbon black and printing ink was proposed in the study. For comparison, various conductivity materials such as copper powder, iron powder, carbon black and silver composite were studied with the screen printing method. The results show that there is no electrical conductivity for the ink containing copper or iron powder up to 90% concentration. The low cost carbon black with printing ink was shown to be successful for the IMD process. |
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