Case Study of Ground Plane Inductance and Implications for Simulation

Gespeichert in:

Autor*in:	Young, B. [verfasserIn]

Format:	Artikel

Erschienen:	1995

Umfang:	5

Übergeordnetes Werk:	Enthalten in: IEEE transactions on components, packaging and manufacturing technology / B - New York, NY : IEEE, 1994, 18(1995), 1, Seite 174-178
Übergeordnetes Werk:	volume:18 ; year:1995 ; number:1 ; pages:174-178 ; extent:5

Katalog-ID:	OLC1501802984

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