Contract manufacturing - Chip scale assemb1y on contract - Brian Smith explains how CEM D2D keeps itseLf one step ahead of the latest developments in packaging.

Gespeichert in:

Autor*in:	Smith, Brian [verfasserIn]

Format:	Artikel

Erschienen:	1996

Umfang:	6

Übergeordnetes Werk:	Enthalten in: Electronic production - London : Kiver-Patterson, 1972, 25(1996), 9, Seite 21-26
Übergeordnetes Werk:	volume:25 ; year:1996 ; number:9 ; pages:21-26 ; extent:6

Katalog-ID:	OLC1506786057

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