Modeling the dynamics of Si wafer bonding during annealing

Gespeichert in:

Autor*in:	Han, Weihua [verfasserIn] Yu, Jinzhong Wang, Qiming

Format:	Artikel

Erschienen:	2000

Umfang:	3

Übergeordnetes Werk:	Enthalten in: Journal of applied physics - Melville, NY : AIP, 1937, 88(2000), 7, Seite 4404-4406
Übergeordnetes Werk:	volume:88 ; year:2000 ; number:7 ; pages:4404-4406 ; extent:3

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Modeling the dynamics of Si wafer bonding during annealing

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