SPECIAL SECTION ON POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING - Behaviors of Polymeric Materials and Their Effects on High Density PWB

Gespeichert in:

Autor*in:	Wu, S.X. [verfasserIn] Peng, S. Yeh, C.-P.

Format:	Artikel

Erschienen:	2000

Umfang:	6

Übergeordnetes Werk:	Enthalten in: IEEE transactions on components and packaging technologies - New York, NY : IEEE, 1999, 23(2000), 3, Seite 428-433
Übergeordnetes Werk:	volume:23 ; year:2000 ; number:3 ; pages:428-433 ; extent:6

Katalog-ID:	OLC1579026893

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spelling	SW001009 (DE-627)OLC1579026893 (DE-599)GBVOLC1579026893 DE-627 ger DE-627 rakwb 620 53.12 bkl 53.51 bkl Wu, S.X. verfasserin aut SPECIAL SECTION ON POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING - Behaviors of Polymeric Materials and Their Effects on High Density PWB 2000 6 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Peng, S. oth Yeh, C.-P. oth Enthalten in IEEE transactions on components and packaging technologies New York, NY : IEEE, 1999 23(2000), 3, Seite 428-433 (DE-627)269015779 (DE-600)1473457-6 (DE-576)077661982 1521-3331 nnns volume:23 year:2000 number:3 pages:428-433 extent:6 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_21 GBV_ILN_23 GBV_ILN_32 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_4036 GBV_ILN_4046 GBV_ILN_4266 GBV_ILN_4307 GBV_ILN_4309 GBV_ILN_4314 GBV_ILN_4315 GBV_ILN_4317 GBV_ILN_4318 GBV_ILN_4319 GBV_ILN_4700 53.12 AVZ 53.51 AVZ AR 23 2000 3 428-433 6
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allfieldsGer	SW001009 (DE-627)OLC1579026893 (DE-599)GBVOLC1579026893 DE-627 ger DE-627 rakwb 620 53.12 bkl 53.51 bkl Wu, S.X. verfasserin aut SPECIAL SECTION ON POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING - Behaviors of Polymeric Materials and Their Effects on High Density PWB 2000 6 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Peng, S. oth Yeh, C.-P. oth Enthalten in IEEE transactions on components and packaging technologies New York, NY : IEEE, 1999 23(2000), 3, Seite 428-433 (DE-627)269015779 (DE-600)1473457-6 (DE-576)077661982 1521-3331 nnns volume:23 year:2000 number:3 pages:428-433 extent:6 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_21 GBV_ILN_23 GBV_ILN_32 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_4036 GBV_ILN_4046 GBV_ILN_4266 GBV_ILN_4307 GBV_ILN_4309 GBV_ILN_4314 GBV_ILN_4315 GBV_ILN_4317 GBV_ILN_4318 GBV_ILN_4319 GBV_ILN_4700 53.12 AVZ 53.51 AVZ AR 23 2000 3 428-433 6
allfieldsSound	SW001009 (DE-627)OLC1579026893 (DE-599)GBVOLC1579026893 DE-627 ger DE-627 rakwb 620 53.12 bkl 53.51 bkl Wu, S.X. verfasserin aut SPECIAL SECTION ON POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING - Behaviors of Polymeric Materials and Their Effects on High Density PWB 2000 6 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Peng, S. oth Yeh, C.-P. oth Enthalten in IEEE transactions on components and packaging technologies New York, NY : IEEE, 1999 23(2000), 3, Seite 428-433 (DE-627)269015779 (DE-600)1473457-6 (DE-576)077661982 1521-3331 nnns volume:23 year:2000 number:3 pages:428-433 extent:6 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_21 GBV_ILN_23 GBV_ILN_32 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_4036 GBV_ILN_4046 GBV_ILN_4266 GBV_ILN_4307 GBV_ILN_4309 GBV_ILN_4314 GBV_ILN_4315 GBV_ILN_4317 GBV_ILN_4318 GBV_ILN_4319 GBV_ILN_4700 53.12 AVZ 53.51 AVZ AR 23 2000 3 428-433 6
source	Enthalten in IEEE transactions on components and packaging technologies 23(2000), 3, Seite 428-433 volume:23 year:2000 number:3 pages:428-433 extent:6
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