LETTERS - Materials and Processing - Air-Gaps in 0.3 mm Electrical Interconnections

Gespeichert in:

Autor*in:	Kohl, P.A. [verfasserIn] Bhusari, D.M. Wedlake, M. Case, C. Klemens, F.P. Miner, J. Lee, B.-C. Gutmann, R.J. Shick, R.

Format:	Artikel

Erschienen:	2000

Umfang:	3

Übergeordnetes Werk:	Enthalten in: IEEE electron device letters - New York, NY : IEEE, 1980, 21(2000), 12, Seite 557-559
Übergeordnetes Werk:	volume:21 ; year:2000 ; number:12 ; pages:557-559 ; extent:3

Katalog-ID:	OLC1585820202

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spelling	SW001214 (DE-627)OLC1585820202 (DE-599)GBVOLC1585820202 DE-627 ger DE-627 rakwb 620 Kohl, P.A. verfasserin aut LETTERS - Materials and Processing - Air-Gaps in 0.3 mm Electrical Interconnections 2000 3 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Bhusari, D.M. oth Wedlake, M. oth Case, C. oth Klemens, F.P. oth Miner, J. oth Lee, B.-C. oth Gutmann, R.J. oth Shick, R. oth Enthalten in IEEE electron device letters New York, NY : IEEE, 1980 21(2000), 12, Seite 557-559 (DE-627)129618993 (DE-600)245158-X (DE-576)015122115 0193-8576 nnns volume:21 year:2000 number:12 pages:557-559 extent:3 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_32 GBV_ILN_70 GBV_ILN_100 GBV_ILN_170 GBV_ILN_2002 GBV_ILN_2006 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2016 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2061 GBV_ILN_4036 GBV_ILN_4046 GBV_ILN_4266 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4309 GBV_ILN_4313 GBV_ILN_4314 GBV_ILN_4315 GBV_ILN_4317 GBV_ILN_4318 GBV_ILN_4319 GBV_ILN_4700 AR 21 2000 12 557-559 3
allfields_unstemmed	SW001214 (DE-627)OLC1585820202 (DE-599)GBVOLC1585820202 DE-627 ger DE-627 rakwb 620 Kohl, P.A. verfasserin aut LETTERS - Materials and Processing - Air-Gaps in 0.3 mm Electrical Interconnections 2000 3 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Bhusari, D.M. oth Wedlake, M. oth Case, C. oth Klemens, F.P. oth Miner, J. oth Lee, B.-C. oth Gutmann, R.J. oth Shick, R. oth Enthalten in IEEE electron device letters New York, NY : IEEE, 1980 21(2000), 12, Seite 557-559 (DE-627)129618993 (DE-600)245158-X (DE-576)015122115 0193-8576 nnns volume:21 year:2000 number:12 pages:557-559 extent:3 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_32 GBV_ILN_70 GBV_ILN_100 GBV_ILN_170 GBV_ILN_2002 GBV_ILN_2006 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2016 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2061 GBV_ILN_4036 GBV_ILN_4046 GBV_ILN_4266 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4309 GBV_ILN_4313 GBV_ILN_4314 GBV_ILN_4315 GBV_ILN_4317 GBV_ILN_4318 GBV_ILN_4319 GBV_ILN_4700 AR 21 2000 12 557-559 3
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allfieldsSound	SW001214 (DE-627)OLC1585820202 (DE-599)GBVOLC1585820202 DE-627 ger DE-627 rakwb 620 Kohl, P.A. verfasserin aut LETTERS - Materials and Processing - Air-Gaps in 0.3 mm Electrical Interconnections 2000 3 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Bhusari, D.M. oth Wedlake, M. oth Case, C. oth Klemens, F.P. oth Miner, J. oth Lee, B.-C. oth Gutmann, R.J. oth Shick, R. oth Enthalten in IEEE electron device letters New York, NY : IEEE, 1980 21(2000), 12, Seite 557-559 (DE-627)129618993 (DE-600)245158-X (DE-576)015122115 0193-8576 nnns volume:21 year:2000 number:12 pages:557-559 extent:3 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_32 GBV_ILN_70 GBV_ILN_100 GBV_ILN_170 GBV_ILN_2002 GBV_ILN_2006 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2016 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2061 GBV_ILN_4036 GBV_ILN_4046 GBV_ILN_4266 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4309 GBV_ILN_4313 GBV_ILN_4314 GBV_ILN_4315 GBV_ILN_4317 GBV_ILN_4318 GBV_ILN_4319 GBV_ILN_4700 AR 21 2000 12 557-559 3
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