Recovery for SiCw-6061 aluminium alloy composite chips by hot compression

Gespeichert in:

Autor*in:	Jiang, C.H. [verfasserIn] Wang, D.Z. Wu, J.S.

Format:	Artikel

Erschienen:	2003

Übergeordnetes Werk:	Enthalten in: Materials science and technology - London : Inst., 1985, 19(2003), 3, Seite 406
Übergeordnetes Werk:	volume:19 ; year:2003 ; number:3 ; pages:406

Katalog-ID:	OLC1641320184

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allfields	sw030417 (DE-627)OLC1641320184 (DE-599)GBVOLC1641320184 DE-627 ger DE-627 rakwb 600 670 Jiang, C.H. verfasserin aut Recovery for SiCw-6061 aluminium alloy composite chips by hot compression 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Wang, D.Z. oth Wu, J.S. oth Enthalten in Materials science and technology London : Inst., 1985 19(2003), 3, Seite 406 (DE-627)129571539 (DE-600)226723-8 (DE-576)015060896 0267-0836 nnns volume:19 year:2003 number:3 pages:406 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_30 GBV_ILN_40 GBV_ILN_62 GBV_ILN_70 GBV_ILN_100 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_2095 GBV_ILN_2411 GBV_ILN_4046 GBV_ILN_4116 GBV_ILN_4315 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 19 2003 3 406
spelling	sw030417 (DE-627)OLC1641320184 (DE-599)GBVOLC1641320184 DE-627 ger DE-627 rakwb 600 670 Jiang, C.H. verfasserin aut Recovery for SiCw-6061 aluminium alloy composite chips by hot compression 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Wang, D.Z. oth Wu, J.S. oth Enthalten in Materials science and technology London : Inst., 1985 19(2003), 3, Seite 406 (DE-627)129571539 (DE-600)226723-8 (DE-576)015060896 0267-0836 nnns volume:19 year:2003 number:3 pages:406 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_30 GBV_ILN_40 GBV_ILN_62 GBV_ILN_70 GBV_ILN_100 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_2095 GBV_ILN_2411 GBV_ILN_4046 GBV_ILN_4116 GBV_ILN_4315 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 19 2003 3 406
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allfieldsGer	sw030417 (DE-627)OLC1641320184 (DE-599)GBVOLC1641320184 DE-627 ger DE-627 rakwb 600 670 Jiang, C.H. verfasserin aut Recovery for SiCw-6061 aluminium alloy composite chips by hot compression 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Wang, D.Z. oth Wu, J.S. oth Enthalten in Materials science and technology London : Inst., 1985 19(2003), 3, Seite 406 (DE-627)129571539 (DE-600)226723-8 (DE-576)015060896 0267-0836 nnns volume:19 year:2003 number:3 pages:406 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_30 GBV_ILN_40 GBV_ILN_62 GBV_ILN_70 GBV_ILN_100 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_2095 GBV_ILN_2411 GBV_ILN_4046 GBV_ILN_4116 GBV_ILN_4315 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 19 2003 3 406
allfieldsSound	sw030417 (DE-627)OLC1641320184 (DE-599)GBVOLC1641320184 DE-627 ger DE-627 rakwb 600 670 Jiang, C.H. verfasserin aut Recovery for SiCw-6061 aluminium alloy composite chips by hot compression 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Wang, D.Z. oth Wu, J.S. oth Enthalten in Materials science and technology London : Inst., 1985 19(2003), 3, Seite 406 (DE-627)129571539 (DE-600)226723-8 (DE-576)015060896 0267-0836 nnns volume:19 year:2003 number:3 pages:406 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_30 GBV_ILN_40 GBV_ILN_62 GBV_ILN_70 GBV_ILN_100 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_2095 GBV_ILN_2411 GBV_ILN_4046 GBV_ILN_4116 GBV_ILN_4315 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 19 2003 3 406
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