Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes
Gespeichert in:
| Autor*in: |
Shin, Dongwon [verfasserIn] |
|---|
| Format: |
Artikel |
|---|
| Erschienen: |
2004 |
|---|
| Umfang: |
12 |
|---|
| Übergeordnetes Werk: |
Enthalten in: Precision engineering - Guildford : IPC Science and Technology Press, 1979, 28(2004), 3, Seite 302-313 |
|---|---|
| Übergeordnetes Werk: |
volume:28 ; year:2004 ; number:3 ; pages:302-313 ; extent:12 |
| Katalog-ID: |
OLC1665785403 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC1665785403 | ||
| 003 | DE-627 | ||
| 005 | 20230707145511.0 | ||
| 007 | tu | ||
| 008 | 040701s2004 xx ||||| 00| ||und c | ||
| 028 | 5 | 2 | |a sw040701 |
| 035 | |a (DE-627)OLC1665785403 | ||
| 035 | |a (DE-599)GBVOLC1665785403 | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 082 | 0 | 4 | |a 600 |
| 100 | 1 | |a Shin, Dongwon |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| 264 | 1 | |c 2004 | |
| 300 | |a 12 | ||
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 700 | 1 | |a Kurfess, Thomas R. |4 oth | |
| 773 | 0 | 8 | |i Enthalten in |t Precision engineering |d Guildford : IPC Science and Technology Press, 1979 |g 28(2004), 3, Seite 302-313 |w (DE-627)130075078 |w (DE-600)444597-1 |w (DE-576)015613003 |x 0141-6359 |7 nnns |
| 773 | 1 | 8 | |g volume:28 |g year:2004 |g number:3 |g pages:302-313 |g extent:12 |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a GBV_ILN_31 | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_170 | ||
| 951 | |a AR | ||
| 952 | |d 28 |j 2004 |e 3 |h 302-313 |g 12 | ||
| author_variant |
d s ds |
|---|---|
| matchkey_str |
article:01416359:2004----::hedmninlerlgosraexrcefoaluomauepituignwontsraesinetehd |
| hierarchy_sort_str |
2004 |
| publishDate |
2004 |
| allfields |
sw040701 (DE-627)OLC1665785403 (DE-599)GBVOLC1665785403 DE-627 ger DE-627 rakwb 600 Shin, Dongwon verfasserin aut Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes 2004 12 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kurfess, Thomas R. oth Enthalten in Precision engineering Guildford : IPC Science and Technology Press, 1979 28(2004), 3, Seite 302-313 (DE-627)130075078 (DE-600)444597-1 (DE-576)015613003 0141-6359 nnns volume:28 year:2004 number:3 pages:302-313 extent:12 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 AR 28 2004 3 302-313 12 |
| spelling |
sw040701 (DE-627)OLC1665785403 (DE-599)GBVOLC1665785403 DE-627 ger DE-627 rakwb 600 Shin, Dongwon verfasserin aut Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes 2004 12 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kurfess, Thomas R. oth Enthalten in Precision engineering Guildford : IPC Science and Technology Press, 1979 28(2004), 3, Seite 302-313 (DE-627)130075078 (DE-600)444597-1 (DE-576)015613003 0141-6359 nnns volume:28 year:2004 number:3 pages:302-313 extent:12 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 AR 28 2004 3 302-313 12 |
| allfields_unstemmed |
sw040701 (DE-627)OLC1665785403 (DE-599)GBVOLC1665785403 DE-627 ger DE-627 rakwb 600 Shin, Dongwon verfasserin aut Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes 2004 12 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kurfess, Thomas R. oth Enthalten in Precision engineering Guildford : IPC Science and Technology Press, 1979 28(2004), 3, Seite 302-313 (DE-627)130075078 (DE-600)444597-1 (DE-576)015613003 0141-6359 nnns volume:28 year:2004 number:3 pages:302-313 extent:12 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 AR 28 2004 3 302-313 12 |
| allfieldsGer |
sw040701 (DE-627)OLC1665785403 (DE-599)GBVOLC1665785403 DE-627 ger DE-627 rakwb 600 Shin, Dongwon verfasserin aut Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes 2004 12 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kurfess, Thomas R. oth Enthalten in Precision engineering Guildford : IPC Science and Technology Press, 1979 28(2004), 3, Seite 302-313 (DE-627)130075078 (DE-600)444597-1 (DE-576)015613003 0141-6359 nnns volume:28 year:2004 number:3 pages:302-313 extent:12 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 AR 28 2004 3 302-313 12 |
| allfieldsSound |
sw040701 (DE-627)OLC1665785403 (DE-599)GBVOLC1665785403 DE-627 ger DE-627 rakwb 600 Shin, Dongwon verfasserin aut Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes 2004 12 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kurfess, Thomas R. oth Enthalten in Precision engineering Guildford : IPC Science and Technology Press, 1979 28(2004), 3, Seite 302-313 (DE-627)130075078 (DE-600)444597-1 (DE-576)015613003 0141-6359 nnns volume:28 year:2004 number:3 pages:302-313 extent:12 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 AR 28 2004 3 302-313 12 |
| source |
Enthalten in Precision engineering 28(2004), 3, Seite 302-313 volume:28 year:2004 number:3 pages:302-313 extent:12 |
| sourceStr |
Enthalten in Precision engineering 28(2004), 3, Seite 302-313 volume:28 year:2004 number:3 pages:302-313 extent:12 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| dewey-raw |
600 |
| isfreeaccess_bool |
false |
| container_title |
Precision engineering |
| authorswithroles_txt_mv |
Shin, Dongwon @@aut@@ Kurfess, Thomas R. @@oth@@ |
| publishDateDaySort_date |
2004-01-01T00:00:00Z |
| hierarchy_top_id |
130075078 |
| dewey-sort |
3600 |
| id |
OLC1665785403 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC1665785403</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230707145511.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">040701s2004 xx ||||| 00| ||und c</controlfield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">sw040701</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC1665785403</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)GBVOLC1665785403</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">600</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Shin, Dongwon</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2004</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">12</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kurfess, Thomas R.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Precision engineering</subfield><subfield code="d">Guildford : IPC Science and Technology Press, 1979</subfield><subfield code="g">28(2004), 3, Seite 302-313</subfield><subfield code="w">(DE-627)130075078</subfield><subfield code="w">(DE-600)444597-1</subfield><subfield code="w">(DE-576)015613003</subfield><subfield code="x">0141-6359</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:28</subfield><subfield code="g">year:2004</subfield><subfield code="g">number:3</subfield><subfield code="g">pages:302-313</subfield><subfield code="g">extent:12</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_170</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">28</subfield><subfield code="j">2004</subfield><subfield code="e">3</subfield><subfield code="h">302-313</subfield><subfield code="g">12</subfield></datafield></record></collection>
|
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC1665785403</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230707145511.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">040701s2004 xx ||||| 00| ||und c</controlfield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">sw040701</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC1665785403</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)GBVOLC1665785403</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">600</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Shin, Dongwon</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2004</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">12</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kurfess, Thomas R.</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Precision engineering</subfield><subfield code="d">Guildford : IPC Science and Technology Press, 1979</subfield><subfield code="g">28(2004), 3, Seite 302-313</subfield><subfield code="w">(DE-627)130075078</subfield><subfield code="w">(DE-600)444597-1</subfield><subfield code="w">(DE-576)015613003</subfield><subfield code="x">0141-6359</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:28</subfield><subfield code="g">year:2004</subfield><subfield code="g">number:3</subfield><subfield code="g">pages:302-313</subfield><subfield code="g">extent:12</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_170</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">28</subfield><subfield code="j">2004</subfield><subfield code="e">3</subfield><subfield code="h">302-313</subfield><subfield code="g">12</subfield></datafield></record></collection>
|
| author |
Shin, Dongwon |
| spellingShingle |
Shin, Dongwon ddc 600 Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| authorStr |
Shin, Dongwon |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)130075078 |
| format |
Article |
| dewey-ones |
600 - Technology |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0141-6359 |
| topic_title |
600 Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| topic |
ddc 600 |
| topic_unstemmed |
ddc 600 |
| topic_browse |
ddc 600 |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| author2_variant |
t r k tr trk |
| hierarchy_parent_title |
Precision engineering |
| hierarchy_parent_id |
130075078 |
| dewey-tens |
600 - Technology |
| hierarchy_top_title |
Precision engineering |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)130075078 (DE-600)444597-1 (DE-576)015613003 |
| title |
Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| ctrlnum |
(DE-627)OLC1665785403 (DE-599)GBVOLC1665785403 |
| title_full |
Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| author_sort |
Shin, Dongwon |
| journal |
Precision engineering |
| journalStr |
Precision engineering |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2004 |
| contenttype_str_mv |
txt |
| container_start_page |
302 |
| author_browse |
Shin, Dongwon |
| container_volume |
28 |
| physical |
12 |
| class |
600 |
| format_se |
Aufsätze |
| author-letter |
Shin, Dongwon |
| dewey-full |
600 |
| title_sort |
three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - an application to pcb-mounted solder pastes |
| title_auth |
Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 |
| container_issue |
3 |
| title_short |
Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method - An application to PCB-mounted solder pastes |
| remote_bool |
false |
| author2 |
Kurfess, Thomas R. |
| author2Str |
Kurfess, Thomas R. |
| ppnlink |
130075078 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth |
| up_date |
2024-07-03T20:53:21.642Z |
| _version_ |
1803592664762810368 |
| score |
7.399969 |