Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

Gespeichert in:

Autor*in:	Beckermann, C. [verfasserIn] Smith, T.F. Pospichal, B.

Format:	Artikel

Erschienen:	1994

Umfang:	7

Übergeordnetes Werk:	Enthalten in: Journal of electronic packaging - New York, NY : ASME, 1989, 116(1994), 2, Seite 126-132
Übergeordnetes Werk:	volume:116 ; year:1994 ; number:2 ; pages:126-132 ; extent:7

Katalog-ID:	OLC1740482921

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