Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
Autor*in: |
Beckermann, C. [verfasserIn] |
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Format: |
Artikel |
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Erschienen: |
1994 |
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Umfang: |
7 |
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Übergeordnetes Werk: |
Enthalten in: Journal of electronic packaging - New York, NY : ASME, 1989, 116(1994), 2, Seite 126-132 |
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Übergeordnetes Werk: |
volume:116 ; year:1994 ; number:2 ; pages:126-132 ; extent:7 |
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